Actualités

The innovative non-invasive pulmonary ventilator born from the partnership of SECO and IBD starts its distribution in Europe

SECO and SDA Bocconi: together to build a bridge between the industrial world, applied research and startups, in the name of Digital Innovation.

SECO, always at the forefront of the latest technologies, has developed its first COM-HPC® / Client module Size A (95 x 120 mm), with the 11th Generation Intel Core processors: the CHPC-C77-CSA.

Today SECO is pleased to unveil its latest product: the SM-C93, a SMARC® Rel 2.1.1 compliant module with the Intel Atom x6000E Series and Intel Pentium and Celeron N and J Series processors.

REVENUES AS AT JUNE 30, 2020 GREW BY 20% WITH A STRONG INCREASE IN THE GROUP’S PROFITABILITY

The Italian company accelerates its competence and Software as a Service development strategy in the Artificial Intelligence and Internet of Things domains.

THE BOARD OF DIRECTORS: IPO PROJECT IS APPROVED, BANKS AND ADVISORS ARE NOMINATED 

On the new website Biorespira.care you can find all about the non-invasive Pulmonary Ventilator developed by SECO in partnership with the innovative Italian company IBD, operating in the biomedical sector.

SECO has just released UDOO BOLT GEAR, the ultimate Mini PC Kit based on AMD Ryzen™ Embedded V1000 Processor. 
 

Arezzo – May 11th 2020 – The Board of Directors of SECO SPA, a high-tech manufacturer of computer miniaturization and “ready-to-use” IoT integrated systems, with shareholder FII Tech Growth fund backed by Cassa Depositi e Prestiti, presented today its 2019 financial results.

SECO is releasing UDOO BOLT GEAR, the ultimate Mini PC Kit by UDOO based on AMD Ryzen™ Embedded V1000 Processor. 

SECO and IBD announce a partnership for the realization of “Respira” non-invasive pulmonary ventilators 

We are closely monitoring the situation to provide unfiltered and up-to-date information about our facilities and infrastructure. With this post we want to respond to the Frequently Asked Questions about our business

SECOs pleased to announce that it has completed the acquisition of 100% of InHand, a Maryland-based leading provider of low-power rugged embedded systems and software.

SECO is developing state-of-the-art solutions suitable for the most advanced applications. Let’s talk about the newest standard from PICMG®: COM-HPC™. 

Among the Arm-based products from SECO’s portfolio on display at embedded world, there will also be the SM-B71, a SMARC Rel. 2.0 compliant module with the Xilinx® Zynq® Ultrascale+™ MPSoC.

2020 edition of embedded world in Germany will provide the opportunity to proudly launch SECO’s partnership with Rockchip, presenting its first off-the-shelf product built on the Rockchip RK3399 processor and developed in 3.5” form factor: the SBC-C31.

At embedded world Exhibition & Conference SECO’s booth, among the many products of its portfolio, will showcase the company’s range of the most up-to-date Intel®-based solutions.

From February 25th to 27th 2020 in Nuremberg, during embedded world Exhibition & Conference, SECO will showcase its latest solutions to the tens of thousands of expected visitors at its booth. Here, SECO will be proud to announce the expansion of its Qseven® standard products portfolio.

From February 25th to 27th 2020, embedded world exhibition & conference, the leading international tradeshow for embedded system technologies, is coming back to Nuremberg Exhibition Centre, Germany. At SECO's booth, among the variety of products displayed, there will be a strong focus on NXP-based solutions.

At the embedded world Exhibition & Conference, SECO will be exhibiting its first COM Express™ Type 7 product: the COMe-C42-BT7, a COM Express™ Rel. 3.0 Basic Type 7 module with the AMD EPYC™ Embedded 3000 Processor.

In this edition of embedded world exhibition & conference, SECO will be showcasing many innovative solutions including products based on the latest AMD Ryzen™ Embedded Processors, i.e. the COMe-B75-CT6 and the COMe-C89-CT6. 

At the embedded world Exhibition & Conference, in addition to its vast array of products and services in exposition, SECO is also going to present SENSE-D01  i.e., SECO’s newest microcontroller for industrial applications.

At the embedded world Exhibition & Conference, in addition to its wide range of products and services in exposition, SECO is also going to present EDGEHOG, i.e., SECO’s IIoT-as-a-service platform.

After having obtained the necessary authorization from the Chinese government, SECO acquired the majority shares of Fannal Electronics Co. Ltd.

We’re in a garage in the 1970s and two guys are in the process of inventing the future. 

SECO is pleased to announce that today it has signed an agreement to acquire InHand, a Maryland-based leading provider of low-power embedded systems and software to original equipment manufacturers of handheld, portable, battery operated, Internet of Things (IoT), and wireless devices.

SECO acquires 70% of AiDiLab 

Milan, 20th April 2018 – FII Tech Growth, a fund managed by Fondo Italiano d’Investimento SGR, announces today its second investment in SECO SpA, one of the European leaders in the embedded electronics market. SECO, headquartered in Arezzo, Tuscany, with subsidiaries in the U.S.A., Germany and Taiwan, was founded in 1979 by entrepreneurs Daniele Conti and Luciano Secciani.