SECO strengthens its collaboration with NXP through i.MX95-based solutions

SECO strengthens its collaboration with NXP through i.MX 95– based solutions at embedded world 2026

From system-on-modules to modular HMI platforms for secure Edge AI
Seco and Qualcomm highlight Qualcomm Dragonwing platforms at embedded world 2026

SECO and Qualcomm highlight Qualcomm Dragonwing Edge AI platforms at embedded world 2026

From high-performance COM Express modules to scalable industrial HMIs and Edge AI systems.
SECO launches Genio360-based SOMs with Mediatek at EW26

SECO launches new Genio 360- and Genio 360P-based SOMs and expands its Edge AI portfolio with MediaTek at Embedded World 2026

From cost-efficient Edge AI modules to AI-powered HMIs for industrial and medical applications.
Clea framework becomes the enabler of real-world Edge AI applications

SECO to demonstrate Clea as the enabler of real-world Edge AI at Embedded World 2026

Live demos show how Clea simplifies the Edge AI process – from application development to deployment and lifecycle management – across industrial, smart building, medical, and vending use cases.
Pre-closing results as of December 31, 2025

Unaudited consolidated pre-closing results as of December 31, 2025

SECO S.p.A. releases its unaudited consolidated pre-closing results as of December 31, 2025. These are management account figures not subject to audit procedures.
SECO's Intel-Powered Edge AI Hardware at embedded world 2026

SECO to Showcase Intel-Powered Edge AI Hardware at embedded world 2026

From COM Express based on the latest Intel Core Ultra Series 3 processors to HMI solutions and real-world industrial AI use cases at the edge.
SECO showcases live demos of vending innovation at Embedded World

SECO to Showcase Live Experiences of Vending Innovation at Embedded World

The Nuremberg event will provide a platform for advances in SECO’s Clea Vend and the KarL4 contactless payment terminal.
SECO and Boeing Successfully Achieve Design

SECO and Boeing Successfully Achieve Design Certification for the MQ-25A Deck Control Device

This marks a major milestone in SECO’s contribution to next-generation military aviation systems. The collaboration with Boeing represents a significant multi-decade contract for SECO.
COM Express Type 6

SECO launches new COM Express Type 6 module featuring Intel Core Ultra Series 3 processors

Delivering next-generation AI acceleration and industrial-grade performance for edge systems
Modular Vision 10.1 ASL reaching ATO

SECO announces order-ready availability of the modular vision 10.1 ASL HMI based on Intel® Atom® processors

Powered by Intel® Atom® x7000RE processors (formerly Amston Lake), the Modular Vision 10.1 ASL delivers flexibility and expandability for human-machine interaction in industrial IoT applications.