Get an early sample of Qualcomm® Dragonwing IQ9 Series on COM Express

Run local inference on up to 100 TOPS of Qualcomm® Hexagon™ NPU performance, supported by an 8-core Qualcomm® Kryo™ CPU and Qualcomm® Adreno™ GPU. Assess perception, detection, classification and sensor-fusion pipelines without depending on cloud processing.

Map cameras, frame grabbers, LiDAR, NVMe storage and industrial control interfaces through PCIe Gen4, 2.5GbE with TSN, USB and CAN FD. Work with SECO to define the I/O exposed on your carrier architecture.

Use up to 36 GB LPDDR5 memory with inline ECC, industrial temperature options and a compact 95 × 95 mm footprint to support reliable products with long lifecycle requirements.

Move beyond the first benchmark with Clea OS, Secure Boot, OTA updates, SBOM support, containerised applications and device management, with SECO support from carrier-board definition to software lifecycle planning.

Run perception, navigation and control at the edge.

Combine AI inference and machine connectivity for AMRs, AGVs, cobots and inspection robots.

• Up to 100 TOPS for perception and obstacle detection.
• PCIe, Ethernet, CAN FD and USB for cameras, LiDAR, storage and control.
• COM Express modularity for custom carriers and future upgrades.

Evaluate: model performance, sensor topology, latency and thermal envelope.

Process vision data without slowing the line.

Run defect detection, classification and anomaly detection locally for AOI and quality-control systems.

• Up to 100 TOPS for demanding vision models.
• PCIe Gen4 for frame grabbers, vision peripherals and NVMe storage.
• Inline-ECC memory for reliable continuous operation.

Evaluate: inference throughput, camera path and sustained-load behaviour.

Process navigation, obstacle avoidance, object tracking and sensor fusion locally when connectivity is limited.

• Up to 100 TOPS for onboard AI inference.
• Compact 95 × 95 mm footprint with industrial temperature options.
• High-speed I/O for cameras, sensors, storage and communications.

Evaluate: AI performance, sensor integration, power and thermal limits.

Benchmark your models on up to 100 TOPS with the AA variant or 50 TOPS with the AC variant. Measure throughput, latency, memory use, power and thermal behaviour under representative workloads.

Verify the path for MIPI-CSI cameras, PCIe frame grabbers, LiDAR, networking, NVMe storage and control interfaces. Define which I/O must be exposed on your carrier board.

Review what can be reused from an existing COM Express design and what needs to change. Plan carrier-board integration, BSP configuration, drivers and embedded software work with SECO.

Build on an industrial platform designed for long-term availability, compliance readiness, and supply continuity - with one partner from evaluation to production.