What is COM-HPC? COM-HPC Ecosystem Featured Modules COM-HPC vs. COM Express
COM-HPC-module_1000x1000_blackbkgrd

COM-HPC is an open standard for high performance computer-on-modules. Hosted by PICMG, the specification was first released in 2021 and currently describes 3 pinouts (Client, Server, and Mini) and 6 module sizes. COM-HPC modules offer higher performance than any other standard form factor currently available, as well as a greater number of high-bandwidth interfaces and more memory capacity. 

COM-HPC supports Arm or x86 processor architectures, and allows the use of GPUs, ASICs, or FPGAs. Like the earlier COM Express standard, COM-HPC modules are intended to be used on a carrier board customized to the application, making them easy to upgrade. Unlike earlier standards, COM-HPC can handle the highest performance demands of today’s embedded applications. Interfaces supported by COM-HPC include USB 4, PCIe Gen 5, Ethernet up to 25GB/lane, audio (SoundWire, I2S, DMIC), and up to 4 displays (DDI (HDMI, DisplayPort), EDP).

Up to 48x PCIe Gen 5 on Client modules, USB 4, DisplayPort 2.0, up to 25G Ethernet.

Client, Server, and Mini options allow COM-HPC to be used in a wide variety of applications.

Supports onboard processing loads up to 251 watts (Client modules).

COM-HPC is a newer standard and is designed to meet ever-growing performance demands – now and in the future.

SECO's COM-HPC ecosystem includes off-the-shelf modules, accompanying OS, and COM-HPC development kits including module and carrier board. All of our COM-HPC products support compatibility with our IoT software suite Clea.

SOM-COM-HPC-A-RPL_800x640

COM-HPC® Client module Size A, with 13th Gen Intel® Core™ processors (Codename: Raptor Lake – H/P/U series).

View product
SOM-COM-HPC-A-TGL-H_800x640

COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® (Codename: Tiger Lake-H) Processors for FuSa applications.

View product
SOM-COM-HPC-A-TGL-UP3_800x640

COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Core™ and Celeron® (Codename: Tiger Lake-UP3) Processors.

View product
SOM-COM-HPC-A-MTL_800x640

COM-HPC® Size A Client Module with Intel® Core™ Ultra Processors Family (codename: Meteor Lake -H and -U)

View product
View all COM-HPC modules
Carrier Board Design

To incorporate into an electronic product, a COM-HPC module must be mounted to a carrier board, which is usually designed with application-specific interfaces and mechanicals. PICMG maintains a carrier board design guide for COM-HPC.

SECO offers comprehensive design services for custom carrier boards, letting you accelerate time-to-market by leveraging our expertise. We collaborate with you to define your product’s requirements and develop a product-specific carrier board with accompanying board support package (BSP). The latest high speed interface standards require added diligence to selecting an appropriate printed circuit board (PCB) stackup, accommodating tight routing strategies, and then utilizing expensive lab equipment for rigorous verification. Leveraging SECO minimizes carrier board design risk and smooths the development process.

Contact us

Product Design and Manufacturing

Once the design process is complete, we manufacture and deliver your product-specific carrier board, with the COM-HPC module mounted and software configured with your image.

Beyond carrier boards, SECO designs and builds complete products including HMIs, boxed solutions, and rugged portable/handheld devices, available off-the-shelf or customized.

Learn more

 

customized designs

COM-HPC Features & Applications

COM-HPC defines three module classes with different sizes and pin configurations: Client, Server, and Mini. Client modules, available in module sizes A, B, or C, support up to 49 PCI Express lanes and one or more displays. Server modules, available in module sizes D or E, support up to 65 PCI Express lanes and lack display outputs. As the name implies, Mini modules are smaller than either Client or Server modules – 95x70mm, about the size of a credit card. While both Client and Server modules utilize two 400-pin high speed connectors, Mini modules use only one connector, and some of its 400 pins are shared between functions.

Client modules are versatile and are widely used in high performance embedded applications. Typical applications for COM-HPC Client modules include:

  • Industrial equipment
  • Medical equipment
  • Gaming
  • Instrumentation
  • Mil-aero and defense systems
  • Transportation

Key Differences Between COM-HPC and COM Express

Although the COM Express specification is still actively maintained and updated, it was first introduced in 2005. COM-HPC is much more recent, and has been designed to better meet the needs of current embedded applications.

COM-HPC is currently the most cutting-edge, high-speed standard on the market. Generally, a COM-HPC module offers more lanes and faster interfaces than a COM Express module. Compared to COM Express Type 6, COM-HPC Client supports twice as many PCI Express lanes, USB 4.0, and higher-speed Ethernet.

Specification COM-HPC Client COM Express Type 6
PCI Express 48 lanes (up to Gen 5) 24 lanes (up to Gen 4)
Ethernet 2x BASE-T (max 10Gb), 2x BASE-KR (max 25Gb) 1 GB
Display 3x DDI - eDP, DSI 3x DDI - eDP, LVDS, VGA
Audio 2x MIPI Soundwire; 2x I2S; DMIC HDA
USB 4x USB 4.0; 4x USB 2.0 4x USB 3.2 (max 10Gb); 8x USB 2.0
SATA 2x 4x
GPIO 12x 8x
Power up to 251 W up to 137 W