What is COM Express? COM Express Ecosystem Featured Modules
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COM Express is a group of modular, small form factor computer-on-module specifications. The standard currently defines three pinout types and four module sizes to accommodate a wide range of use cases. Type 6 is the most versatile, providing high speed serial interfaces, including PCI Express Gen 4, 10GbE, USB 4.0, and SATA; multiple display interfaces via HDMI and LVDS; and traditional serial interfaces including CAN, UART, I2C, SPI, and more. 

One of the main advantages of COM Express modules is that they’re easily integrated with a carrier board, speeding up the design process and making it easier to upgrade over time. The COM Express standard was first introduced in 2005 and is maintained by PICMG, of which SECO is an active member. The latest version, Revision 3.1, enables the most current USB 4.0 and PCI Express Gen 4.

COM Express modules are well-suited to mid-range embedded applications, and offer more computing and interface capability than SMARC or Qseven.

Supports USB 4.0 and PCI Express Gen 4; backwards compatible with older interfaces/legacy versions.

COM Express modules connect to application-specific carrier boards in a consistent way, so performance upgrades are very straightforward.

SECO's COM Express ecosystem includes off-the-shelf modules, accompanying OS, and COM Express development kits including module and carrier board. All of our COM Express products support compatibility with our IoT software suite Clea.

SOM-COMe-BT6-RPL-P

COM Express® 3.1 Type 6 Basic Computer on Module (CoM) with 13th Gen Intel® Core™ processors (Codename: Raptor Lake-P). (CALLISTO - E03)

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SOM-COMe-CT6-EHL

COM Express® 3.1 Type 6 Compact Computer on Module (CoM) with Intel® Atom® x6000E Series, Intel® Pentium® and Celeron® N and J Series Processors (Codename: Elkhart Lake).

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SOM-COMe-CT6-V2000

COM Express® 3.0 Type 6 Compact Computer on Module (CoM) with AMD Ryzen™ Embedded V2000 SoCs.

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SOM-COMe-CT6-TGL-U

COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with 11th Gen Intel® Core™ (Codename: Tiger Lake UP3) Processors.

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Carrier Board Design

To incorporate into an electronic product, a COM Express module must be mounted to a carrier board, which is usually designed with application-specific interfaces and mechanicals. PICMG maintains a carrier board design guide for COM Express.

SECO offers comprehensive design services for custom carrier boards, letting you accelerate time-to-market by leveraging our expertise. We collaborate with you to define your product’s requirements and develop a product-specific carrier board with accompanying board support package (BSP). The latest high speed interface standards require added diligence to selecting an appropriate printed circuit board (PCB) stackup, accommodating tight routing strategies, and then utilizing expensive lab equipment for rigorous verification. Leveraging SECO minimizes carrier board design risk and smooths the development process.

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Product Design and Manufacturing

Once the design process is complete, we manufacture and deliver your product-specific carrier board, with the COM Express module mounted and software configured with your image.

Beyond carrier boards, SECO designs and builds complete products including HMIs, boxed solutions, and rugged portable/handheld devices, available off-the-shelf or customized.

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customized designs
Serial production

Manufacturing

SECO manufacturers its modules, carriers, and other boards and products in its world-class, in-house production facilities in Italy, Germany, and China. With ISO 9001 and ISO 13485 certifications and circuit board and device level assembly, SECO provides low cost, high quality, one-stop production backed by global supply chain excellence.

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COM Express Type 6 modules are widely used in industrial automation, medical, and computer vision applications. Available in two module sizes – compact (95x95 mm) and basic (125x95 mm), both of which feature dual 220-pin connectors – Type 6 modules provide graphics support, up to 24 PCI Express lanes, 8x GPIO, 4x SATA, 3x digital display interfaces, making them usable for a variety of applications.

COM Express Type 7 modules are intended for server class applications, and feature 4x 10G Ethernet ports instead of audio/video interfaces. Type 10 modules are low power (max 64 W) and are available only in the Mini module size (55x84 mm). They are used in mobile x86-based embedded applications.

COM Express modules are commonly used in applications such as:

  • General purpose embedded computing
  • Industrial control
  • Data acquisition
  • Instrumentation
  • Computer vision
  • Medical applications

For more demanding environments, including mil/aero and defense, remote data acquisition, and vehicular applications, high-temperature range and ruggedized COM Express products are available.