Home / Contattaci / Richieste generiche

Contatti

Vuoi maggiori informazioni sui nostri prodotti e servizi? Compila il form, siamo a tua disposizione.

Hai bisogno di supporto tecnico sui tuoi prodotti SECO? Vai su RMA e Ticketing

Nome

Cognome

Indirizzo email

Numero di telefono

Seleziona paese

Nome azienda

Messaggio

Seleziona i prodotti per i quali vuoi richiedere maggiori informazioni

Servizi

Clea: IIoT One-Stop Solution

Proof of Concept

Progettazione & Industrializzazione

Manufacturing

Software

System Integration

SECO Next: Soluzioni innovative, Prototipi, Design Prodotto, Design Servizi, Ricerca & Sperimentazione, Proof Of Concept, Progettazione & industrializzazione

EV charging station

SECO Care

COM-HPC

CARINA - COM-HPC® Client module Size A, with the 11th Gen Intel® Core™ and Celeron® processors (formerly Tiger Lake-U)

LAGOON - COM-HPC® Client module Size A, with the 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® processors (formerly Tiger Lake-H) for FuSa application

ORION - COM-HPC® Client module Size A, with 12th Gen Intel® Core™ processors (Codename: Alder Lake - H series)

ETX

ETX-A61 - ETX® Module with the Intel® Atom™ E3800 and Celeron® families (Bay Trail) System-on-Chip

padre_ETX-A61

ETX-A61 - ETX® Module with the Intel® Atom™ E3800 and Celeron® families (Bay Trail) System-on-Chipilies (Bay Trail) System-on-Chip

PN_ETX-A61

TA61-8330-2110-C0-V - Bay Trail-M N2807 @1.58 GHz Dual Core - RAM DDR3L 2GB - SATA 0 converted to PATA - SATA 1 on connector - PCI clock free runnig - Comm. Temp

TRIZEPS SODIMM SOM

Trizeps VII - SODIMM-200 CPU-Module with NXP i.MX6 Processors

Trizeps VII SX - SODIMM-200 CPU-Module with NXP i.MX 6SoloX Processor

Trizeps VIII - SODIMM-200 CPU-Module with NXP i.MX 8M Processors

Trizeps VIII Mini - SODIMM-200 CPU-Module with NXP i.MX 8M Mini Processors

Trizeps VIII Plus - SODIMM-200 CPU-Module with NXP i.MX 8M Plus Processors

MYON MICROMODULE SOM

Myon II - Micro CPU module with NXP i.MX 8M Mini & i.MX8M Nano Processors

Myon I - Micro CPU module with Snapdragon™ 410E

CARRIER BOARD

pConXS III by Keith & Koep - SODIMM 200 Carrier Board for Trizeps SOMs

ConXM by Keith & Koep - MicroModule Carrier Board for Myon SOMs

pConXS by Keith & Koep - Carrier Board for Trizeps SODIMM SOMs

CQ7-D59 - Carrier Board for Qseven® Rel. 2.0 / 2.1 Compliant Modules in the 3.5” Form Factor

PRODUCT_CQ7-A42

CQ7-A42 - Qseven® rel. 2.0 Compliant Evaluation Carrier Board on 3.5” Form factor

PN_CQ7-A42

QA42-0000-1111-I0-V - Carrier Board for Qseven® rel. 2.0 Compliant modules on 3.5" Form factor - DisplayPort - 2nd Ethernet Port - LVDS - Debug Port

QA42-0000-2111-I0-V- Carrier Board for Qseven® rel. 2.0 Compliant modules on 3.5" Form factor - HDMI - 2nd Ethernet Port - LVDS - Debug Port

PRODUCT_CCOMe-C30

CCOMe-C30 - Evaluation Carrier Board for COM Express™ Type 6 Modules on 3.5” form factor

PN_CCOMe-C30

MC30-0000-0000-C3 - Evaluation Carrier Board for COM Express™ Type 6 Modules on 3.5” form factor

PAYMENT SYSTEMS

KarL4 - Contactless payment terminal

Accetto l’Informativa sulla privacy

SECO S.p.A. Via A. Grandi 20, 52100 Arezzo Italy

+39 0575 26979

+39 0575 350210

Contatti

Desideri contattarci per altre richieste?