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    Q7-C26

    Qseven® Rel. 2.1 compliant module with NXP i.MX 8 Applications Processors

    • NXP i.MX 8 Applications Processors

    • 1x USB 3.0; PCI-e x1 Gen3; CSI camera connector; Boot select signal
    • Integrated GPU, supports 2 independent displays

    • soldered down LPDDR4-3200 memory

    Доступно в промышленном температурном диапазоне

      Q7-C26

    Q7-C26

    μQ7-A76-J

    μQ7-A76-J

    μQ7-A75-J

    μQ7-A75-J

    SM-C12

    SM-C12

     
    Статус разработки продукта
    Процессор

    NXP i.MX 8 Family:
    i.MX 8QuadMax - 2x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8QuadPlus - 1x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8Quad - 4x Cortex®-A53 cores + 2x Cortex®-M4F cores

    Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP
    Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP
    Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors

    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    Набор микросхем
    ...
    ...
    ...
    ...
    Макс. количество ядер
    0
    2
    2
    0
    Максимальное количество потоков
    0
    2
    ...
    0
    Память

    soldered down LPDDR4-3200 memory, 64-bit interface

    Soldered onboard DDR3L memory
    E3825, E3815:  up to 4GB Single-Channel DDR3L @ 1066MHz
    N2807: up to 4GB Single-Channel DDR3L @ 1333MHz

    Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F

    Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB
    Графика

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-2, VC-1, RV9, VP8, H.263 and MPEG4 part, HW encoding of AVC/H.264
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 3.x, DirectX 11

    Integrated Intel® HD Graphics 4000 Series controller
    Dual independent display support
    HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats
    HW encoding of H.264, MPEG2 and MVC formats

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Supports 2 independent displays

    Integrated Graphics Processing Unit, supports 2 independent displays
    Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
    Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

    Видеоинтерфейс

    HDMI 2.0a or DP 1.3 interface, supporting HDCP 2.2
    Dual Channel or 2 x Single Channel 18- / 24-bit LVDS interface

    Multimode Display Port (DP++) interface
    18 / 24 bit Dual Channel LVDS interface

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface

    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
    18- / 24-bit Dual Channel LVDS interface or MIPI-DSI interface
    (factory alternatives)
    Разрешение видео
    HDMI:Up to 4Kp60
    LVDSUp to 1080p
    DP++ (HDMI compatible) Up to 2560x1600@60Hz
    LVDS interface Up to 1920x1200@60Hz

    LVDS, resolution up to 1920x1200
    HDMI, resolution up to 1080p

    HDMIUp to 4096 x 2160 @ 60 (4K)
    MIPI-DSI, LVDSUp to 1920 x 1080 @ 60Hz
    Массовое хранение

    1x SATA Gen3 interface (alternative to 1x PCI-e x1 port)
    eMMC 5.1 drive soldered on-board
    SD 4-bit interface
    QSPI Flash soldered-on-board

    2 x external S-ATA channels
    SD interface
    Optional eMMC drive soldered onboard

    On-board eMMC drive, up to 8 GB
    SD / MMC / SDIO interface
    Internal SPI Flash for booting

    Optional SD 4-bit interface
    QSPI Flash soldered-onboard
    eMMC 5.0 drive soldered on-board
    Сетевой

    1 x Gigabit Ethernet interface

    Gigabit Ethernet interface
    Fast Ethernet (10/100) interface
    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard
    USB

    4 x USB 2.0 Host Ports 
    1 x USB 3.0 Host Port
    1 x USB 2.0 OTG port

    1 x USB 3.0 Host port
    4 x USB 2.0 Host ports (one shared with USB 3.0 interface)

    1 x USB OTG interface
    1 x USB 2.0 Host interface

    2 USB 3.0 Host ports
    2 USB 2.0 Host ports
    1 USB 2.0 OTG port
    PCI-e

    Up to 2x PCI-e x1 Gen3 ports

    3 x PCI-e x1 lanes (Gen2)

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    2x PCI-e x1 ports
    Аудио

    I2S Audio Interface

    HD Audio Interface
    I2S / AC’97 Audio Interface
    I2S Audio Interface
    Последовательные порты

    1x UART Tx/Rx/RTS/CTS
    1x CAN Bus (TTL level)

    1 x Serial Port (TTL interface, Tx/Rx only)
    ...
    Up to 2x UART Tx/Rx/RTS/CTS
    2x UART Tx/Rx
    1x CAN Bus (TTL level)
    Другие интерфейсы

    CSI camera connector
    2x I2C Bus
    SPI interface
    8 x GPI/Os
    Boot select signal
    Power Management Signals
    Watchdog

    I2C bus
    LPC Bus
    SM Bus
    Thermal / FAN Management
    PWR Management signals

    On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
    - Additional SD interface
    - Up to 4 UARTs
    - CAN interface
    - Watchdog(s)
    - I2C interfaces
    - PWM outputs
    - SPI interface
    - Additional Audio interface

    (*) not all the combinations are allowed simultaneously Power Management Signals

    1x 4-lanes + 1x 2-lanes CSI camera interfaces
    I2C Bus
    SM Bus
    2x SPI interfaces
    QuadSPI interface
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    Блок питания

    +5VDC ± 5%
    +3.3V_RTC

    +5VDC ± 5%

    +5VDC ± 5%
    Optional Low Power RTC

    +5VDC
    +3.3V_RTC

    Потребляемая мощность
    ...
    ...
    ...
    ...
    Операционная система

    Linux
    Android

    Microsoft® Windows 7
    Microsoft® Windows 8.1
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7
    Microsoft® Windows Embedded Standard 8
    Microsoft® Windows Embedded Compact 7
    Linux
    Yocto

    Linux
    Yocto

    Linux
    Android
    Рабочая температура

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (Industrial temp.)* 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Размеры
    70x70 mm (2.76” x 2.76”)
    40 x 70 mm (1.57 x 2.76)
    40x70 mm (1.57” x 2.76”)
    50 x 82 mm (1.97” x 3.23”)
    Security
    ...
    ...
    ...
    ...
    BIOS
    ...
    ...
    ...
    ...
    Embedded Controller Functionalities
    ...
    ...
    ...
    ...

    Описание

    Подробности

    The Q7-C26 is a Qseven® Rel. 2.1 compliant module based on the NXP i.MX 8 Applications Processors. This solution features rich m2m interface to control onboard subsystems and wide connectivity, taking advantage of the wide scalability offered by Qseven® form factor and the i.MX 8 family.

    Дополнительная информация

    Дополнительная информация

    Процессор

    NXP i.MX 8 Family:
    i.MX 8QuadMax - 2x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8QuadPlus - 1x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8Quad - 4x Cortex®-A53 cores + 2x Cortex®-M4F cores

    Память

    soldered down LPDDR4-3200 memory, 64-bit interface

    Графика

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-2, VC-1, RV9, VP8, H.263 and MPEG4 part, HW encoding of AVC/H.264
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 3.x, DirectX 11

    Видеоинтерфейс

    HDMI 2.0a or DP 1.3 interface, supporting HDCP 2.2
    Dual Channel or 2 x Single Channel 18- / 24-bit LVDS interface

    Разрешение видео
    HDMI:Up to 4Kp60
    LVDSUp to 1080p
    Видеоинтерфейс
    SINGLE CHANNEL LVDS, DUAL CHANNEL LVDS, HDMI, DP
    Массовое хранение

    1x SATA Gen3 interface (alternative to 1x PCI-e x1 port)
    eMMC 5.1 drive soldered on-board
    SD 4-bit interface
    QSPI Flash soldered-on-board

    Сетевой

    1 x Gigabit Ethernet interface

    USB

    4 x USB 2.0 Host Ports 
    1 x USB 3.0 Host Port
    1 x USB 2.0 OTG port

    PCI-e

    Up to 2x PCI-e x1 Gen3 ports

    Аудио

    I2S Audio Interface

    Последовательные порты

    1x UART Tx/Rx/RTS/CTS
    1x CAN Bus (TTL level)

    Другие интерфейсы

    CSI camera connector
    2x I2C Bus
    SPI interface
    8 x GPI/Os
    Boot select signal
    Power Management Signals
    Watchdog

    Блок питания

    +5VDC ± 5%
    +3.3V_RTC

    Операционная система

    Linux
    Android

    Рабочая температура

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Размеры
    70x70 mm (2.76” x 2.76”)
    ПРОГРАММНОЕ ОБЕСПЕЧЕНИЕ

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    Документы

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    Q7-C26

    Q7-C26
    • ОЦЕНИТЕ НАШУ ПРОДУКЦИЮ

      Максимум 3 шт. на номер изделия
    • ЦЕНА ОБРАЗЦА

      Включена стоимость доставки 
    • ТОЛЬКО ДЛЯ КОРПОРАТИВНЫХ КЛИЕНТОВ

      Техническая поддержка, оказываемая исключительно корпоративным клиентам
    Qseven® Rel. 2.1 compliant module with the NXP i.MX 8 Applications Processors
    Номер артикула описание номера детали конфигурация номера детали купить образцы онлайн свяжитесь с нами сравнить
    QC26-0000-2200-C0 Qseven with NXP i.MX 8 Q7-C26 Qseven - NXP i.MX 8, LVDS

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