SBC-C66

SBC with the Intel® 8th generation Core™/Xeon® (formerly Coffee Lake H) and 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs

Product status

Development
Sampling
Production
Available in Industrial Temperature Range

Contact us for more information and quotes

CPU

8th Gen Core™/Xeon® (Coffee Lake H) & 9th Gen Core™/ Xeon® /Pentium®/Celeron® CPUs (Coffee Lake Refresh)

Graphics

Intel® UHD Graphics 630/P630 architecture, supports up to 3 independent displays

Connectivity

2x USB 3.1; 4x USB 2.0; NVMe SSD Slot; PCI-e x8 port (PCI-e x16 mechanical slot); VPU High Speed Connector with 4xUSB3.1 + 2x PCI-ex4

Memory

up to 128GB DDR4 memory on 4x SO-DIMM Slots (ECC supported)

Product details

Technical Info

  • Description
    SBC with the Intel® 8th generation Core™/Xeon® (formerly Coffee Lake H) and 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs
  • Processor

    Intel® 8th generation Core™ / Xeon® (formerly Coffee Lake H) CPUs:

    Intel® Core™ i7-8850H, Six Core @ 2.6GHz (4.3GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with HyperThreading

    Intel® Core™ i5-8400H, Quad Core @ 2.5GHz (4.2GHz Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), with HyperThreading

    Intel® Core™ i3-8100H, Quad Core @ 3.0GHz, 6MB Cache, 45W TDP (35W cTDP)

    Intel® Xeon® E-2176M, Six Core @ 2.7GHz (4.4GHz Max 1 Core Turbo), 12MB Cache, 45W TDP (35W cTDP), with HyperThreading

     

    Intel® 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs:

    Intel® Xeon® E-2276ME Six Core @2.8GHz (4.5GHz Max 1 Core Turbo), 12MB Cache, 45W TDP (35W cTDP), with Hyperthreading

    Intel® Xeon® E-2276ML Six Core @2.0GHz (4.2GHz Max 1 Core Turbo), 12MB Cache, 25W TDP, with Hyperthreading

    Intel® Xeon® E-2254ME Quad Core @2.6GHz (3.8GHz Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), with Hyperthreading

    Intel® Xeon® E-2254ML Quad Core @1.7GHz (3.5GHz Max 1 Core Turbo), 8MB Cache, 25W TDP, with Hyperthreading

    Intel® Core™ i7-9850HE,  Six Core @2.7GHz (4.4GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with Hyperthreading

    Intel® Core™ i7-9850HL, Six Core @1.9GHz (4.1GHz Max 1 Core Turbo), 9MB Cache, 25W TDP, with Hyperthreading

    Intel® Core™ i3-9100HL, Quad Core @1.6GHz (2.9GHz Max 1 Core Turbo), 6MB Cache, 25W TDP

    Intel® Pentium® G5600E, Dual Core @2.6GHz (3.1GHz Max 1 Core Turbo), 4MB Cache, 35W TDP

    Intel® Celeron® G4930E, Dual Core @2.4GHz, 2MB Cache, 35W TDP

    Intel® Celeron® G4932E,  Dual Core @1.9GHz, 2MB Cache, 25W TDP

  • Chipset

    Intel® QM370, HM370 or CM246 Platform Controller Hub (PCH)

  • Max Cores
    6
  • Max Threads
    12
  • Memory

    2x DDR4-2666 or 4x DDR4-2444 ECC SODIMM Slots, up to 128GB total (only with 4 SODIMM modules).
    ECC DDR4 memory modules supported only with Xeon® Core™ i3, Pentium® and Celeron® CPUs combined with CM246 PCH

  • Graphics

    Intel® UHD Graphics 630/P630 architecture, up to 48 Execution Units
    Up to 3 independent displays supported
    DirectX 12, OpenGL 4.5, and OpenCL 2.1 support
    HW accelerated video decode MPEG2, VC1/WMV9, AVC/H.264, VP8, JPEG/MJPEG, HEVC/H.265 (8-/10-bit), VP9
    HW accelerated video encode MPEG2, AVC/H.264, VP8, JPEGHEVC/H.265, VP9

  • Video Interfaces

    2x DP++ connector
    eDP 40-poles connector (interface switched with LVDS)
    LVDS Single/Dual Channel connector (interface switched with eDP)

  • Video Resolution

    DP++, eDP: up to 4096x2304 @ 60Hz, 24bpp
    LVDS: up to 1920x1200 @ 60Hz

  • Mass Storage

    Up to 2x S-ATA M 7p standard connectors
    M.2 Socket 3 Key M 2280 Slot for NVME SSD modules with PCI-ex4 or SATA interface
    M.2 Socket 2 Key B Slot for SATA SSD modules (interface shared with PCI-e x2)
    microSD card slot

  • Networking

    Up to 2x Gigabit Ethernet interface (Intel® I219-LM GbE PHY + optional Intel® I210/211 GbE controller)
    M.2 Socket1 Key E 2242 Slot for optional WLAN modules
    M.2 WWAN Slot (PCI-e x2 interface shared with SATA SSD module)

  • USB

    2x USB 3.1 ports on standard Type-A sockets, placed on the front side of the board.
    4x USB 3.1 (Superspeed + USB 2.0) ports on a PCIe/104 Connector for Expansion
    1x USB 3.1 (Superspeed + USB 2.0) port on M.2 SSD/WWAN Key B Slot
    2x USB 2.0 ports on standard Type-A sockets, placed on the front side of the board.
    2x USB 2.0 ports on internal pin header
    1x USB 2.0 port on M.2 Socket 1 Key E for WiFi modules

  • PCI-e

    PCI-e x4 interface on M.2 Socket 3 Key M slot for NVMe modules
    PCI-e x2 port on M.2 SSD/WWAN Key B Slot
    PCI-e x1 port on M.2 Socket 1 Key E for WiFi modules
    4x PCI-e x1 ports on PCIe/104 Connector for Expansion
    PCI-e x8 port on Network Card Adapter Slot
    2x PCI-e x4 ports on PCI-e/104 Connector for Expansion

  • Audio

    HD Audio codec on-board
    Mic In, Line out audio jacks
    Front Panel Audio Header

  • Serial Ports

    2x multistandard RS-232/RS-422/RS-485 serial ports on internal pin header

  • Other Interfaces

    LPC pin Header
    Front Panel Header
    3-pin or 4-pin tachometric FAN Connector
    Optional TPM 2.0 device on-board

  • Power Supply

    2-pin Mega-Fit connector
    VIN Range: +12V+24V

  • Operating System

    Windows 10 64-bit
    Linux OS 64-bit

  • Operating Temperature

    0°C  ÷ +60 °C (Commercial version)
    -40°C  ÷ +85 °C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

  • Dimensions
    170 x 170 mm

Part Number

  • The ordering code for samples will be available soon.

    Part number description
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