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EW 2023: SECO and Axelera AI to unveil cutting-edge innovations

SECO and Axelera at EW23

Arezzo, Eindhoven, February 14, 2023 – SECO and Axelera AI are proud to announce the first integrated solutions developed as a result of their partnership at embedded world Exhibition&Conference, which takes place at the Exhibition Center in Nuremberg from March 14-16, 2023. Visitors will be able to preview Axelera AI’s high performance AI inference capability in a range of SECO solutions in different form factors. SECO’s edge design experience and edge-to-cloud connectivity technologies are complemented by Axelera AI’s high performance Metis AIPU to create complete systems ready for high-end computer vision applications and more.


With a quad core architecture that can execute all layers of a standard neural network without external interactions, the Metis™ AI Platform is a high-performance, cost effective and user-friendly platform designed to accelerate computer vision at the edge. At its heart, the powerful Metis AIPU powers SECO’s edge devices to create integrated, value added solutions that unlock the potential of accelerated edge AI in different market verticals.


The PHOENIX AI Fanless Embedded Computer can integrate the processing performance of the 11th Gen Intel® Core™ and Intel® Celeron® processors with over 100 Tera Operations Per Second (TOPS) inference power. Axelera AI’s Voyager SDK enables effortless deployment of AI applications, unleashing the potential of the Metis AI Processing Unit. Publicly presented for the first time at embedded world, the CUZCO 3.5” Single Board Computer can combine Rockchip’s RK3588 core and 100+ TOPS M.2 2280 M-key with Metis AIPU. In addition, the PRISMA Single Board Computer can bring together the same chip technology from Axelera AI and the 11th Gen Intel® Core™ and Intel® Celeron® processors.


The unique combination of SECO and Axelera AI technologies is enriched by CLEA, the IoT-AI platform developed by SECO. The integration of Axelera AI’s Voyager SDK and CLEA makes the remote deployment of AI applications to the Edge effortless. The CLEA model management system updates a fleet of devices with specific AI applications related to specific customer needs and easily manages the CI/CD of AI inference on Edge devices. That means opening great opportunities for a range of applications whose business models can be transformed by computer vision, providing customers with a 360 degrees complete edge AI computer vision system that can reduce their technological complexity and allow them to focus on their business goals.


The AI-accelerated, on-field analysis of data and images can empower the context awareness of devices for an easier and augmented machine-to-machine and human-machine interaction, enhancing user experience. The introduction of Axelera AI’s technology into SECO’s product portfolio extends our offering providing high performance AI inference capability at low latency, enabling to target the high-end computer vision market segment”, says Vincenzo Difronzo, Chief Sales Officer of SECO. “Embedded world will be an opportunity for us to demonstrate the benefits that have arisen from this strategic partnership.


“Together, Axelera AI and SECO are revolutionizing the world of computer vision AI, with a joint product portfolio combining affordability, power, and usability to deliver truly holistic and cutting-edge solutions at the Edge. When you merge the computing power and efficiency of the Metis AIPU with the innovative SECO’s portfolio, and the easy of use of the Voyager SDK with CLEA management and orchestration capabilities, all of them at an affordable price, you have the perfect combination to drive innovation and transform the future of AI’’, says Flavio Devidé, Head of Go-To-Market of Axelera AI.


Don’t miss this opportunity to experience the latest developments in AI technology and see how SECO and Axelera AI are working together to bring innovative solutions to the market. Be sure to stop by SECO and Axelera AI booths (1-320 and 2-538) at the embedded world trade fair to learn more!

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