Arezzo, 10 November 2023 – SECO, a global leader in innovations in the fields of embedded systems, Internet of things (IoT) and artificial intelligence (AI), will be present for the first time with a booth at SPS 2023. Among other things, the company will present its Modular Vision HMI family, the brand-new SMARC® 2.1-compatible SOM-SMARC-Genio700 module and other Computer-on-Module solutions (COMs). Further, trade visitors can find out about the application possibilities of the IoT Software Suite Clea for automation solutions at the SECO booth (Hall 8, Booth 211).
Modular Vision – scalable HMI family
Among the product highlights SECO will bring to SPS 2023 is the scalable HMI family Modular Vision. Modular Vision is suitable for cross-industry applications and is based on either Arm® or x86. With the new platform concept, OEMs can quickly develop customer designs and scale them easily.
The Modular Vision series currently includes three members with three different screen sizes, 7-, 10- and 15-inches, with resolutions ranging from 1024 x 600 to Full HD (1920 x 1080), and each with brightness >400 cd/m2. Additional diagonals and resolutions will follow. Scalable here refers not only to the display size and image resolution but also to the performance of the integrated electronics. The versatile HMIs are available as standalone panel PCs or as OEM products that can be integrated into the respective application using different adapters.
The entry-level Modular Vision 7 MX93 models with 7-inch display contain the NXP i.MX93 application processor at their core and are equipped with up to 2 GB LPDDR4-3200. Interfaces such as Gb Ethernet, RS485, CAN, RS232, USB and digital I/O are available.
The Modular Vision 10.1 MX8M-Plus 10-inch HMI is a high-end model built around the NXP i.MX8M Plus application processor and a high-performing GC7000UL internal GPU. These models include up to 6 GB LPDDR4-4000 and feature the same interfaces as the 7-inch models.
The Modular Vision 15.6 EHL models with 15.6-inch display are also designed for high-end applications and are based on Intel® Atom® x6000E Series, Intel® Pentium®, Celeron® N and J Series processors. They include Quad Channel LPDDR4 memory and an integrated Gen11 UHD graphics controller for up to three independent displays.
SOM-SMARC-Genio700 – SMARC® 2.1.1-compatible COM module
SECO is also presenting its SMARC 2.1.1-compatible COM module, the SOM-SMARC-Genio 700, a powerful new addition to the extensive SMARC® product family.
The new model is suitablefor developing demanding industrial solutions in the shortest possible time. With the COM in the compact SMARC® (Smart Mobility Architecture) form factor, developers of embedded and other electronic systems can implement fanless industrial applications that must meet high demands for graphics or AI performance. At the core of this SMARC® module is MediaTek’s new octa-core Genio 700 application processor, designed for industrial IoT products, enabling solutions with the highest performance and lowest power consumption. The Genio 700 is an N6 (6nm) IoT chipset and features two Arm® Cortex®-A78 cores running at 2.2 GHz and six Arm® Cortex®-A55 cores running at 2.0 GHz, as well as a 4.0 TOPs AI accelerator.
Boasting vast expertise in COM design and manufacturing, SECO will present numerous other standard form-factor Computer-on-Module solutions at SPS 2023 that have been designed for use in different environments.
Clea – The software suite that powers IoT infrastructures
All SECO hardware products are born natively integrated with Clea. Open-source and production-ready, Clea provides a seamless and cost-effective solution for unlocking the potential of field data, facilitating the development of value-added services and advanced AI applications. This is achieved within a modular, fully integrated system that prioritizes scalability and stability.
Adhering to a highly modular approach that caters to the needs of even the most demanding IoT projects, Clea functions as a comprehensive fleet and device management solution, encompassing everything from over-the-air updates to application management. Clea also presents a ready-to-use, extensible user interface and UI framework with advanced monetization features, facilitating accelerated time-to-market.
Clea’s middleware components are open source and boast robust integration capabilities, making them suitable for deployment in any major cloud environment or on-premises, and supporting any kind of field device or gateway. Visitors at SPS will experience Clea’s features for the Industrial Automation market through a software demo.
SECO’s comprehensive, integrated, and modular range of end-to-end technological solutions, spanning from Edge to Cloud, is built upon a steadfast commitment to strategic partnerships with industry-leading high-tech companies. A recent illustration of this commitment is the announcement of a strategic collaboration with Qualcomm Technologies International, Ltd., aimed at introducing new edge computing products for the Industrial IoT sector, leveraging the capabilities of Qualcomm Technologies’ processors.
Visitors are cordially invited to visit the SECO booth 211 in hall 8 from 14 to 16 November, to get an overview of its extensive know-how. In addition to all the product innovations, the company will inspire with a new brand concept including a new logo.
