Arezzo, June 1, 2022 – SECO, a Gold Member of the Intel® Partner Alliance, continues its collaboration with Intel® in designing and developing edge solutions that leverage the most innovative and high-performance Intel® platforms. Today, SECO introduces two new standard form factor solutions – a COM Express® Type 6 Compact Module and a 3.5” single board computer – both based on the 11th Gen Intel® Core™ processors (formerly Tiger Lake UP3).
11th Gen Intel® Core™ processors combine high-performance CPU/GPU engines with integrated artificial intelligence (AI) acceleration and deep learning capabilities in a low power processing platform, built on Intel® third-generation 10 nm process technology. Designed for the Internet of Things (IoT), these processors provide a balance of performance and responsiveness, thus supporting low-latency and time-sensitive applications.
To fully exploit the potential of this platform in a compact, modular solution, SECO developed CALYPSO, a COM Express® 3.0 Type 6 Compact Module offering up to four cores of the Intel® 11th generation Core™ Series processors. Selected SKUs, specifically designed for industrial applications, also feature Intel’s Functional Safety Essential Design package. The integrated Intel® Iris® Xe Graphics – with up to 96 Execution Units – supports various hardware accelerated video decode/encode standards and can drive up to four independent displays via DisplayPort (DP), eDP, HDMI, DVI, or LVDS interfaces.
The COM Express® CALYPSO has two DDR4 SO-DIMM slots supporting up to 64 GB of DDR4-3200 memory. In-band error correcting code (IBECC) for enhances reliability is supported on selected Intel® Core™ industrial SKUs. Connectivity options include: 4x SuperSpeed USB (5Gbps) host ports; 8x USB 2.0; 1x Gigabit Ethernet; 8x PCI-e x1 Gen 3; PEG x4 Gen 4; and HD audio interface. Microsoft® Windows 10, Microsoft® Windows 10 IoT Core, and Linux operating systems are supported. Thanks to its features, the COM Express® CALYPSO is well suited to applications requiring responsiveness and high-performance, including edge computing, digital signage, transportation, and biomedical devices.
SECO also leveraged the same Intel® processor platform to develop a single board computer in the 3.5” form factor: PRISMA. The PRISMA SBC comes with 2x DDR4-3200 SODIMM memory slots supporting up to 64 GB (IBECC available with Intel® Core™ industrial SKUs). Up to four independent displays at up to 4K resolution are available via DP, eDP, or LVDS interfaces. Connectivity options are wide: 2x 2.5 Gigabit Ethernet; M.2 slot for Wi-Fi/Bluetooth; 4x SuperSpeed USB (10 Gbps); 2x USB 2.0; 4x PCIe Gen 3; 8x GPIOs; and HD audio interface. Microsoft® Windows 10 IoT Enterprise LTSC, Linux LTS and Yocto operating systems are supported. With availability in the industrial temperature range (-40°C to +85°C), the PRISMA SBC mainly addresses industrial automation and control, surveillance, gaming, and edge computing applications.
Both COM Express® CALYPSO and PRISMA SBC are compatible with SECO’s CLEA AI/IoT platform, which easily connects edge electronic devices to the cloud and facilitates real time device monitoring, analytics, infrastructure management, predictive maintenance, secure remote software updates, and more. Learn more about them by visiting SECO in booth 1-320 at embedded world 2022, in Nuremberg, Germany, from June 21 to 23.
