Modular-Vision-QCS6490

10.1" & 15.6" Touch Display

HD and Full HD resolution with industrial-grade panel mounting

Projected Capacitive Touch (P-Cap)

Multi-touch input and gesture support

3.0 mm Strengthened Glass and IP66 Protection

Dust-and-splash-resistant front surface for industrial and semi-outdoor use

High Brightness (400 cd/m2)

Reliable readability in bright environments  and variable light conditions

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Modular Vision QCS6490 (10.1 & 15.6) leverages the heterogeneous architecture of the Qualcomm® Dragonwing QCS6490 to deliver accelerated computing, real-time vision, AI inference, and demanding edge workloads, while maintaining high power efficiency. Deploy computer vision and AI-enabled HMIs faster without building a custom edge AI platform from scratch.

AdrenoTM 643L GPU

High-efficiency graphics acceleration and parallel processing for complex visual workloads.

Octa-core Arm® CPU Architectur

Consistent, low latency performance for industrial and edge workloads.

Qualcomm® AI Engine (NPU)

Dedicated neural processing for real-time vision and AI inference at the edge, up to 12 TOPS computing power.

Power-Efficient System Design

Balanced CPU, GPU, and NPU architecture designed for simultaneous AI and graphics workloads with minimal power consumption.

Reduce integration complexity across industrial deployments and operator stations. Designed for scalable OEM integration, the Modular Vision QCS6490 combines a slim footprint, rugged fanless housing, and a panel-mount-ready design with optional VESA mounting support for additional installation flexibility.

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Simplify integration into automation systems, smart infrastructure, and connected edge environments. A comprehensive set of industrial-grade interfaces enables fast integration with sensors, controllers, and peripherals. All interfaces are accessible from one side to simplify installation, maintenance, and cable management.

Modular-Vision-Connectors

+9V ÷ +32V Power Supply

USB-A 3.0 / USB-C 2.0

RS232 + RS485

RJ45 1GB

CAN

8-pin Molex DIO

Deploy the same edge AI platform across different installation contexts while maintaining a consistent hardware and software baseline. This standardized platform approach helps simplify validation, integration, lifecycle management, and scalable fleet deployment. 

Choose the display size that fits your application while keeping the same computing architecture, power, and AI capabilities

 10.1"15.6"
Resolution1280×8001920×1080
Brightness400 cd/m²400 cd/m²
Touch TechnologyP-Cap 3mmP-Cap 3mm
Backlight Lifetime50,000 h30,000 h
Dimensions270.1 × 187.1 × 51.7 mm407.5 × 259.5 × 52.4 mm
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Develop, deploy, and run AI at the edge through a unified workflow powered by Edge Impulse, Clea, and SECO.
Train your AI model with Edge Impulse, deploy it seamlessly through Clea, and run AI workloads directly on Modular Vision QCS6490, alternatively, accelerate development by accessing ready-to-use AI applications available in the SECO Application Hub.

Clea-Connection
Yocto Logo
Clea Logo

Modular Vision QCS6490 (10.1 & 15.6) leverages Clea OS, SECO’s Yocto-based secure embedded operating system, as its standardized software foundation for industrial edge deployments. Clea OS is designed to simplify onboarding, lifecycle management, and scalable fleet operations while supporting modern cybersecurity and long-term deployment requirements. It also helps address evolving regulatory requirements, including readiness for upcoming EU frameworks such as CRA and RED.

  • Lifecycle security updates
  • Ongoing vulnerability management
  • Conformity assessments for critical products
  • Technical documentation

From industrial environments to smart buildings and healthcare, both Modular Vision QCS6490 support a wide range of AI-driven HMI use cases.

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Smart Building and HVAC

Environmental monitoring, control panels, energy efficiency management

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Industrial & Factory control 

Reliable HMIs for demanding environments

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Retail & Kiosk

Interactive POS, info totems, and dynamic digital signage

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Vending machine & Smart appliances

Rugged touch interfaces for smart and IoT-ready machines

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The SECO Application Hub provides developers with ready-to-deploy applications that are tested, validated, and optimized for Qualcomm® Dragonwing QCS6490 platforms. Applications are designed to run directly on Modular Vision, enabling efficient use of available hardware acceleration and faster deployment at the edge. 

Visit Application Hub

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The SECO Developer Center provides technical documentation, onboarding resources, and step-by-step guides to accelerate evaluation, validation, and deployment.

Whether you are bringing up the platform, configuring Clea OS, or validating your design, the Developer Center streamlines development with structured content, practical examples, and continuously updated materials.

Visit Developer Center

Modular-Vision-10_1

Modular Vision 10.1 QCS6490

8 GB RAM / 128 GB eMMC / Ethernet 

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CPU

1x Arm® Cortex®-A78 @2.7 GHz, 3x Arm® Cortex®-A78 @2.4 GHz, and 4x Arm® Cortex®-A55 @1.8 GHz

Memory

Soldered-down LPDDR5-6400 memory, up to 12GB, 32-bit interface 2 channels

 Mass Storage

eMMC 5.1 drive soldered on-board, up to 64GB (boot device) SD 4-bit interface (boot device)

 Connectivity

1x Gigabit Ethernet interfaces, opt. Wi-Fi + BT5.0

USB

1x USB C Dual Role 1x USB 3.0 Type A

Video resolution

10.1” display, resolution 1920 x 1080, LED lifetime 50K hours, 400cd/m² brightness P-Cap (Projected Capacitive touch screen), with 3.0mm chemically strengthened cover glass

 Serial ports

2x RS-232, 1x RS-485

 Graphics

Qualcomm® Adreno™ 643L

Other interfaces

1x I²C, SPI, 2x Digital In, 2x Digital Out

 Power supply

9 VDC % 32 VDC

 Operating system

Clea OS (Yocto)

 Operating temperature

0 - 60 °C

 Dimensions

270.1 x 187.1 x 51.7 mm

Modular-Vision-10_1

Modular Vision 15.6 QCS6490

8 GB RAM / 128 GB eMMC / Ethernet

Request sample

CPU

1x Arm® Cortex®-A78 @2.7 GHz, 3x Arm® Cortex®-A78 @2.4 GHz, and 4x Arm® Cortex®-A55 @1.8 GHz

Memory

Soldered-down LPDDR5-6400 memory, up to 12GB, 32-bit interface 2 channels

 Mass Storage

eMMC 5.1 drive soldered on-board, up to 64GB (boot device) SD 4-bit interface (boot device)

 Connectivity

1x Gigabit Ethernet interfaces, opt. Wi-Fi + BT5.0

USB

1x USB C Dual Role 1x USB 2.0 Type A

Video resolution

15.6” display, resolution 1920 x 1080, LED lifetime 30K hours, 400cd/m² brightness P-Cap (Projected Capacitive touch screen), with 3.0mm chemically strengthened cover glass

 Serial ports

2x RS-232, 1x RS-485

 Graphics

Qualcomm® Adreno™ 643L

Other interfaces

1x I²C, SPI, 2x Digital In, 2x Digital Out

 Power supply

9 VDC % 32 VDC

 Operating system

Clea OS (Linux Yocto)

 Operating temperature

0 - 60 °C

 Dimensions

407.5 x 259.5 x 52.4 mm

For customers evaluating Qualcomm® Dragonwing QCS6490 beyond the HMI form factor, SECO provides a complete SMARC-based evaluation environment to accelerate proof-of-concept and platform validation.

Built around the Carrier-SMARC-E71 with full SMARC 2.1.1 support, the platform enables hardware evaluation, software bring-up, interface validation, and custom embedded design development based on the same core technology powering Modular Vision QCS6490.

Explore the Evaluation Kit

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