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SOM-COMe-BT6-RPL-P

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SOM-COMe-BT6-RPL-P

Name: SOM-COMe-BT6-RPL-P
Availability: OutOfStock

COM Express® 3.1 Type 6 Basic Computer on Module (CoM) with 13th Gen Intel® Core™ processors (Codename: Raptor Lake-P). (CALLISTO - E03)

Available in Industrial Temperature Range

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Contactarnos

Cpu

13th Gen Intel® Core™ processors targeted for IoT Applications

Gráficas

embedded Intel® Iris® Xe graphics with up to 96 execution units

Conectividad

1x NBase-T 2.5GbE; 2x USB4.0 Gen2; 4x USB3.2 Gen 2; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x8 Gen4 and 2x PEG x4 Gen4.

Memoria

Two DDR5 SO-DIMM Slots supporting DDR5-4800 IBECC Memory, up to 64GB

Datos del producto

Información técnica

Descripción	COM Express® 3.1 Type 6 Basic Computer on Module (CoM) with 13th Gen Intel® Core™ processors (formerly codenamed Raptor Lake-P)
Cpu	13th Gen Intel® Core™ processors (Raptor Lake U/P/H series) and Intel® Processor U300E: U series, up to 10C (2P+8E), up to 12M cache, 15W TDP P series, up to 14C (6P+8E), up to 24M cache, 28W TDP H series, up to 14C (6P+8E), up to 24M cache, 45W TDP
Memoria	Two DDR5 SO-DIMM slots supporting DDR5-4800, IBECC modules memory, up to 64GB
Gráfica	Intel® UHD Graphics/Intel® Iris® Xe Graphics architecture, up to 96 EU Improved image (IPU6EP) and video processing (AV1/GNA 3.0) Support up to 4 independent displays @ 4K
Interfaces vídeos	Up to 3x Digital Display Interfaces (DDIs), supporting DVI, DP 1.4, HDMI 2.1 1x VGA (factory option) 1x eDP 1.3 or single/dual-channel 18-/24-bit LVDS interface (factory alternatives)
Resolución vídeo	HDMI and DP up to 8K @ 60Hz via TCSS with Hayden Bridge eDP 1.4b up to 5K @ 120Hz (HBR3 with VDSC1.1) LVDS up to 1920x1200 @ 60Hz
Almacenamiento en masa	2x SATA Gen3 channels Up to 128 GB on-board NVMe SSD (factory alternative to one PCI-express Graphics (PEG) x4 Gen4)
Trabajo en red	1x NBase-T Ethernet interface with Intel® I225 GbE controller, with TSN and 2.5GbE supported.
Usb	Up to 2x USB 4 Gen2 host ports (depending on carrier board retimer implementation) 4x USB 3.2 Gen2 (10Gbps) host ports (depending on carrier board retimer implementation) 8x USB 2.0 host ports
Pci	Up to 8x PCI-e x1 Gen3 lanes 1x PCI-express Graphics (PEG) x8 Gen4 Up to 2x PCI-express Graphics (PEG) x4 Gen4
Audio	HD audio and Soundwire/i2S audio interfaces
Puertos de serie	2x UARTs
Otras interfaces	SPI, I2C, SM Bus, Thermal Management, FAN management Optional eSPI or LPC bus (factory alternatives) Optional TPM 2.0 on-board LID#/SLEEP#/PWRBTN#, Watchdog 4 x GPI, 4 x GPO
Alimentación eléctrica	8VDC..20VDC, +5VSB (optional), +3VRTC (optional)
Sistema operativo	Microsoft® Windows 10 Linux Ubuntu
Temperatura de funcionamiento	0°C to +60°C (commercial version)* -40°C to +85°C (industrial version)* *Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensiones	125 x 95 mm (COM Express® Basic Form factor, Type 6 pinout)

Software

Enlace	SECO Technical Resources

Documentación

Data Sheet	[Datasheet] SOM-COMe-BT6-RPL-P_Rel 1.0
Image	[Picture] SOM-COMe-BT6-RPL-P_front [Picture] SOM-COMe-BT6-RPL-P_back

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