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Q7 DEV KIT 2.0

Cross Platform Development Kit for Qseven® philosophy, compatible with both x86 and ARM Rev. 2.0 Qseven® modules

Additional Information

Video Interfaces HDMI / Display Port interface on PCI-e x16 slot
LVDS / eDP interface on PCI-e x8 slot
Mass Storage SATA Female 7p connector with dedicated Power connector,
interface shared with mSATA Slot
SATA Male 7+15p connector
SD/MMC Card Slot
SPI Flash Socket
Networking Gigabit Ethernet connector
USB 1 x USB 3.0 Host Type-A socket
1 x USB 3.0 OTG micro-AB socket
2 x USB 2.0 Host ports on internal pin header (alternative to USB 3.0 port #0)
Up to 4 x USB 2.0 Host ports on quad Type-A socket
PCI-e PCI-e x 4 interface on dedicated PCI-e x 16 slot shared with 3 x PCI-e x1 slots + miniPCI-e slot (selection via jumper)
Audio Embedded HD Audio Codec, Realtek ALC888
2 x Triple HD Audio jacks
2 x S/PDIF connectors (In & Out)
Audio Expansion Slot
Serial Ports CAN Bus (both TTL interface and with CAN transceiver)
3 x RS-232 only ports
2 x RS-232/RS/422/RS-485 configurable serial ports
Other Interfaces Feature Connector, with I2C , SM Bus, Watchdog, Thermal and Power Management Signals
LPC Bus Header
SPI Pin Header
SIM Card slot
4 x 7-segment LCD displays for POST codes
PS/2 Mouse/keyboard pin header
2 x tachometric FAN connectors
Debug Port on mini-B USB connector
Power, Reset, LID and Sleep Buttons
Power Supply +12VDC
Coin Cell battery Holder for CMOS and RTC
Operating Temperature 0° C ÷ 60° C

*All carrier board components must remain within the operating temperature at any and all times, including startup; carrier operating temperature is independent of the module installed. Please refer to the specific module for more details. Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system.
Dimensions 345 x 170mm (13.58” x 6.69”)

The new Cross Platform Development Kit 2.0 is based on the CQ7-A30 carrier board, born from the SGeT Consortium specifications. The Kit is a complete package that contains all the necessary materials to start developing with Qseven® CPU modules, both x86 and ARM architectures, and most importantly to explore the possibilities offered by these two different worlds. This thanks to the possibility of swapping, at any given moment, from one architecture to the other, with only  a few minor software changes, and with minimal effort and time-consumption.



The Development kit contains the following material:
• Cross Platform Carrier Board CQ7-A30
• LVDS optional Display
• One 12VDC Notebook Power Adapter
• Add on modules for LVDS/eDP and HDMI/DP
• Cable kit

Qseven® module not included. Must be purchased separately



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P/N Description Configuration
QA30-Q7XDK-0000 Qseven Development Kit 2.0 Qseven® Cross Platform Development Kit 2.0
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SECO S.p.A. Via Calamandrei, 91, 52100 Arezzo Italy - Phone +39 0575 26979 - Fax: +39 0575 350210 - P.IVA 00325250512
Reg. Imprese n. 4196 Arezzo - REA n. 70645 - Meccanografico AR007079

Images are for illustrative purposes only. Actual product may differ
- ©SECO 2014, All rights reserved.


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