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COM Express™ 3.0 Basic Type 6 Module with the Intel® 8th generation Core™ / Xeon® (formerly Coffee Lake H) CPUs

Additional Information


Intel® Core™ i7-8850H, Six Core @ 2.6GHz (4.3GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP)
Intel® Core™ i5-8400H, Quad Core @ 2.5GHz (4.2GHz Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP)

Intel® Xeon® E-2176M, Six Core @ 2.7GHz (4.4GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP)

Max Cores 6
Max Thread 12
Memory Two DDR4 SO-DIMM Slots supporting DDR4-2666 ECC Memory, up to 32GB

Intel® Gen9 LP graphic core architecture, up to 48 Execution Units
Up to 3 independent displays supported
DirectX 12, OpenGL 4.5, and OpenCL 2.1 support
HW accelerated video decode MPEG2, VC1/WMV9,
AVC/H.264, VP8, JPEG/MJPEG, HEVC/H.265 (8-/10-bit), VP9
HW accelerated video encode MPEG2, AVC/H.264, VP8, JPEG
HEVC/H.265, VP9

Video Interfaces

Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI, HDMI 1.4
eDP or Single/Dual-Channel 18-/24-bit LVDS interface or LVDS + VGA interface

Video Resolution

eDP, DP:
up to 4096x2304 @ 60Hz, 24bpp

up to 4096x2160 @ 24Hz, 24bpp (HDMI 1.4)

up to 1920x1200 @ 60Hz

Mass Storage

 4 x S-ATA Gen3 Channels


Gigabit Ethernet interface
Intel® I219-LM GbE Controller


4 x USB 3.1 Gen2 Host ports
8 x USB 2.0 Host ports


8 x PCI-e x 1 Gen3 lanes
PCI-express Graphics (PEG) Gen3 x16

Audio HD Audio Interface
Serial Ports 2 x UARTs
Other Interfaces

SPI, I2C, SM Bus, Thermal Management, FAN management
LPC bus
Optional TPM 2.0 on-board
4 x GPI, 4 x GPO

Power Supply

+12VDC ± 10% and + 5VSB (optional)

Operating System

Microsoft® Windows 10 64-bit
Linux 64-bit

Operating Temperature

0°C  ÷ +60 °C (Commercial version)

*Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system.


125 x 95 mm (Com Express™ Basic Form factor, Type 6 pinout)

DescriptionCOMe-C08-BT6 is a COM Express™ Compact Type 6 with Intel® 8th Generation Core™ i7 / i5 / Xeon® Processors (formerly Coffee Lake H) reaching a maximum of 12 threads. Mounting the Intel® Gen9 LP graphic core architecture, COMe-C08-BT6 can manage up to 3 independent displays at once, with a resolution up to 4096x2304 @60Hz, 24bpp. The module also embeds an H.265 / HEVC hardware transcoder - a peculiarity that, combined with the outstanding performance and the compatibility with multiple video interfaces, makes it an ideal platform for projects operating in the field of gaming, digital signage, infotainment, and HMI.

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P/N Description Configuration
MC08-0000-1700-C0 COM-Express Type 6 Intel Coffe Lake H COMe-C08-BT6 - Intel Coffe Lake H Com Exp Type 6, TPM, LVDS + VGA - Comm. Temp.
MC08-0000-1500-C0 COM-Express Type 6 Intel Coffe Lake H COMe-C08-BT6 - Intel Coffe Lake H Com Exp Type 6, TPM, EDP +DP su DDI3 - Comm. Temp.
MC08-0000-1600-C0 COM-Express Type 6 Intel Coffe Lake H COMe-C08-BT6 - Intel Coffe Lake H Com Exp Type 6, TPM, LVDS + DP su DDI3 - Comm. Temp.
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  • CCOMe-965

    Carrier Board for COM-Express™ Type 6 modules on miniITX form factor

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See also

  • COMe-B09-BT6

    COM Express™ Basic Type 6 with Intel® 6th and 7th generation Core™ / Xeon® CPUs

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Reg. Imprese n. 4196 Arezzo - REA n. 70645 - Meccanografico AR007079

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