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Home /  停产产品 /  Q7-A29

Q7-A29

Qseven® standard module with the 1st and 2nd Generation (“eKabini” and “Steppe Eagle”) AMD Embedded G-Series SOCs

Product status

Development
Sampling
Production

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CPU

AMD Embedded G-Series System-on-Chip (SoC)

Graphics

Embedded AMD HD RADEON GPUs

Connectivity

1x USB 3.0; 6x USB 2.0; 1 x Optional UART (TTL level) + SPI interface

Memory

up to 8GB DDR3 1600MHz Single-Channel with ECC soldered onboard

Product details

Technical Info

  • Description
    The Q7-A29 is a Qseven® Rel. 2.0 Compliant Module designed by SECO, based on the 1st and 2nd generation (i.e. ""eKabini"" and ""Steppe Eagle"") AMD EMbedded G-Series, a family of Dual/Quad Core x86 CPUs with integrated discrete-class GPUs and I/O controllers on a Single chip. The wide selection of Quad and Dual Core SOCs, with their different embedded GPUs, allows achieving very high levels of performance, targeting all kind of applications, from graphics to industrial automation. The board is also available in an EXTREME Version, with all the components mounted onboard certified for the industrial temperature range.
  • Processor

    AMD GX-415GA, Quad Core @ 1.5GHz, 2MB L2 Cache, TDP 15W
    AMD GX-217GA, Dual Core @ 1.65GHz, 1MB L2 Cache, TDP 15W
    AMD GX-210HA, Dual Core @ 1.0GHz, 1MB L2 Cache, TDP 9W
    AMD GX-210JA, Dual Core @ 1.0GHz, 1MB L2 Cache, TDP 6W
    AMD GX-411GA, Quad Core @1.1GHz, 2MB L2 Cache, TDP 15W,industrial grade temperature
    AMD GX-209HA, Dual Core @ 1.0GHz, 1MB L2 Cache, TDP 9W,industrial grade temperature

     

    AMD GX-412HC, Quad Core @ 1.2GHz, 2MB L2 Cache, TDP 7W
    AMD GX-222GC, Dual Core @ 2.2GHz, 1MB L2 Cache, TDP 15W
    AMD GX-216HC, Dual Core @ 1.6GHz, 1MB L2 Cache, TDP 10W,industrial grade temperature
    AMD GX-212JC, Dual Core @ 1.2GHz, 1MB L2 Cache, TDP 6W
    AMD GX-210JC, Dual Core @ 1.0GHz, 1MB L2 Cache, TDP 6W,industrial grade temperature

  • Max Cores
    4
  • Memory

    Up to 8GB DDR single-channel memory soldered on-board,with optional ECC
    Up to 1600MHz DDR frequency

  • Graphics

    Embedded AMD HD RADEON™ GPUs
    GX-415GA - HD8330e @ 500MHz
    GX-217GA - HD8280E @ 450MHz
    GX-210HA, GX-411GA - HD8210E @ 300MHz
    GX-210JA, GX-209HA - HD8180 @ 225MHz
    GX-412HC - RADEON™ R3E @ 267/350 MHz
    GX-222GC - RADEON™ R5E @ 655/800 MHz
    GX-216HC - RADEON™ R4E @ 300 MHz
    GX-212JC - RADEON™ R2E @ 267/300 MHz
    GX-210JC - RADEON™ R1E @ 267 MHz
    Dual independent display support
    Supports DirectX® 11.1, OpenGL rel. 4.2 and OpenCL™ rel. 1.2

  • Video Interfaces

    HDMI or Multimode DisplayPort (DP++) interface
    embedded DisplayPort or 18 / 24 bit single / dual channelLVDS interface
    Additional VGA interface (optional external adapter is required)

  • Video Resolution

    HDMI Up to 4096x2160 @ 24Hz (Steppe Eagle SOCs)
    Up to 1920x1200 @ 60Hz (eKabini SOCs)

    DP++ Up to 4096x2160 @ 30Hz (Steppe Eagle SOCs)
    Up to 2560x1600 @ 60Hz (eKabini SOCs)

    eDP: Up to 2048x1536 @ 60Hz

    Optional LVDS: Up to 1920x1200 @ 60Hz

  • Mass Storage

    Up to 2 x external SATA channels
    SD interface
    Optional SATA Flash Drive soldered on-board

  • Networking

    Gigabit Ethernet interface

  • USB

    1 x USB 3.0 Host port
    6 x USB 2.0 Host ports (one shared with USB 3.0)

  • PCI-e

    4 x PCI-e x1 groupable lanes
    (3 x PCI-e x1 lanes with GX-210JA and GX-212JC)

  • Audio

    HD Audio Interface

  • Serial Ports

    1 x Optional UART (TTL level) + SPI interface

  • Other Interfaces

    I2C / LPC / SM Bus
    Thermal / FAN management
    Optional SPI + UART interface
    Power Management Signals
    Watchdog

  • Power Supply

    +5VDC ± 5%

  • Operating System

    Microsoft® Windows 7 (32/64 bit)
    Microsoft® Windows 8.1 (32/64 bit)
    Microsoft® Windows 10 (32/64 bit)
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7 (32/64 bit)
    Microsoft® Windows Embedded Standard 8 (32/64 bit)
    Linux (32/64 bit)

  • Operating Temperature

    0°C ÷ +60°C (commercial version)
    -40°C ÷ +85°C (industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

  • Dimensions
    70x70 mm (2.76” x 2.76”)

Part Number

  • Q7-A29

    Part number description
    Qseven® standard module with the 1st and 2nd Generation (“eKabini” and “Steppe Eagle”) AMD Embedded G-Series SOCs
    Contact us for more informations or quotes
    联系我们