• zh

COM EXP T6 DEV KIT

Cross Platform Development Kit compatible with both x86 and Arm COM Express® Type 6 modules

Product status

Development
Sampling
Production

Contact us for more information and quotes

Product details

Technical Info

  • Description
    The Development Kit contains the following material: - CCOMe-C96 Carrier Board - GPIO Header adapter cable (Free wires on one extremity) - 2x Serial Adapter Cables - 1x certified High Speed DP cable 1m - DP-to-HDMI adapter - 1x SATA cable - HDMI cable - eDP cable - Front Panel module V995 with connecting cables Module not included. Must be purchased separately
  • Video Interfaces

    3 x DP++ connector

    VGA connector

    LVDS 24-bit Single/ Dual Channel

    eDP 4-lanes 40 poles VESA connector

    LVDS External EDID flash socket

  • Mass Storage

    4 x SATA 7p M connectors

    μSD Card slot (interface multiplexed with GPIO header)

  • Networking

    1x GbEthernet RJ-45 connector

  • USB

    4x USB 3.1 Host ports on Type-A sockets

    4 x USB 2.0 Host ports on Quad Type-A sockets

  • PCI-e

    2x PCI-e x4 Slots

    1x PCI-e x16 Slot

  • Audio

    On-board HD Audio Codec (Realtek ALC888S)

    HD Audio Jacks

    S/PDIF Out Optical connector

    Mic In + Line Out internal pin header

  • Serial Ports

    2 x RS-232 / RS-422 / RS-485 ports on internal pin header (from carrier board’s LPC Dual UART controller)

    2 x RS-232 ports on dedicated pin header (from module)

  • Other Interfaces

    4 x GPI + 4 x GPO pin header (interface multiplexed with µSD slot)

    SPI Flash header

    Button / LEDs front panel header

    4-pin tachometric FAN connector

    I2C + SM Bus on feature Pin header

    FuSa Header

    I2C Flash Socket

    JTAG connector

    LPC internal header

    USB overcurrent header

    SM Bus Smart Battery Connector

    4 x 7-segment LCD displays for POST codes

    LPC/eSPI internal header

  • Power Supply

    ATX 24 poles connector for carrier board working only

    Auxiliary 12V connector for carrier board working only

    12 VDC power in connector for COM Express module’s working

    Cabled Coin-cell connector for RTC

  • Operating Temperature

    0°C ÷ +60°C ** (Commercial version)



    **All carrier board components must remain within the operating temperature at any and all times, including start-up; carrier operating temperature is independent of the module installed. Please refer to the specific module for more details. Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final syste

  • Dimensions
    305x244mm (ATXform factor, 12” x 9.6”)

Part Number

  • KTDV-COME6-C96.00

    Part number description
    COMe Type 6 Cross Platform Development Kit
    Contact us for more informations or quotes
    联系我们

Related Products

ECHO

搭载英特尔® Haswell 处理器的 COM Express®基本型 6 型模块

Production

View Product
LARISSA

搭载第八代英特尔®酷睿™和赛扬™ U系列(原名 Whiskey Lake-U)处理器的 COM Express®Rel. 3.0 紧凑型 6 型模块

Sampling

View Product
CHANDRA

搭载英特尔®凌动™ E3800 和赛扬®(原名 Bay Trail)处理器的 COM Express® 紧凑型 6 型模块

Production

View Product
AMOS

搭载 AMD 嵌入式第三代 R 系列 SoC(原名 Merlin Falcon)或 G 系列 SOC-I (原名 Brown Falcon)或 G 系列 SOC-J 处理器(原名 Prairie Falcon)的COM Express® 紧凑型 6 型模块

Production

View Product
TARVOS

搭载英特尔®第六代和第七代酷睿™/至强®(原名 Skylake 和 Kaby Lake)中央处理器的 COM Express®基本型 6 型模块

Production

View Product
CHARON

搭载 AMD 锐龙™嵌入式 V1000 处理器的 COM Express®Rel. 3.0 紧凑型 6 型模块

Production

View Product
OBERON

搭载英特尔®酷睿™/至强®(原名 Coffee Lake)、酷睿™/至强®/赛扬®(原名 Coffee Lake Refresh)处理器的COM Express® 3.0 基本型 6 型模块

Production

View Product
MIRANDA

搭载英特尔®凌动™ X、英特尔® 赛扬® J / N、英特尔® 奔腾® N 系列(原名 Apollo Lake)处理器的 COM Express® 3.0 紧凑型 6 型模块

Development

View Product
METIS

搭载 AMD 锐龙™嵌入式 R1000 系列 SoC 的COM Express® Rel. 3.0 紧凑型 6 型模块

Development

View Product