ALKES

NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors
- i.MX6S Solo - Single core up to 1GHz
- i.MX6DL Dual Lite - Dual core up to 1GHz per core
- i.MX6D Dual - Dual core up to 1GHz per core
- i.MX6DP DualPlus - Dual core up to 1GHz per core
- i.MX6Q Quad - Quad core up to 1GHz per core

Up to 4GB DDR3L on-board (up to 2GB with i.MX6S)

Dedicated 2D Hardware accelerator
Dedicated 3D Hardware accelerator, supports OpenGL® ES 2.0 3D
Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D, i.MX6DP and i.MX6Q)
Enhanced 2D and 3D graphics with i.MX6DP
Supports up to 3 independent displays with i.MX6D, i.MX6DPand i.MX6Q
Supports 2 independent displays with i.MX6DL and i.MX6S

1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
HDMI Interface 1.4
Video Input Port / Camera Connector

LVDS  up to 1920x1200
HDMI  up to 1080p

On-board eMMC drive, up to 32 GB
SD / MMC / SDIO interface
1 x μSD Card Slot on-board
1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

Gigabit Ethernet interface

1 x USB OTG interface
4 x USB 2.0 Host interfaces

1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

AC'97 Audio Interface
I2S

2 x serial ports (TTL interface)
CAN port interface

I2C Bus
LPC Bus
SM Bus
Power Management Signals

+5VDC ± 5%

Linux
Yocto
Microsoft® Windows Embedded Compact 7

0°C ÷ +70°C (commercial version)
-40°C ÷ +85°C (industrial version)

*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.