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盒装解决方案

现成解决方案
装配服务经验
机械设计经验
SECO 提供的可能性
需要热管輔助的被动式和帶风扇的主动式 CPU 散热器解决方案，包括最新一代的 CPU。
制造通过注塑制成的塑料元件
使用挤压技术生产铝机械部件
使用压铸技术设计机械部件
折叠和成型金属板材部件
开发自定化布线，以管理系统所有部件的连接，包括一个或多个选项卡/显示器等。
简介

凭借将模块和卡集成到复杂系统中的经验，SECO 基于 Arm 和 x86 SBC 构建了现成的解决方案，这些解决方案在目录中也有提供。 SECO 盒装解决方案专为工业物联网中的应用开发，旨在满足灵活性和安全性的需求。

6 Products

SYS-B68-IPC

Boxed solution based on the Intel® Atom™ X Series (formerly Apollo Lake) Processors

  • 2x GbE; WWAN and WLAN M.2 module slots
  • Integrated Intel® HD Graphics 500 or 505 series controller
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SYS-B68-IGW

Boxed solution based on the Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors

  • 2x GbE; WWAN and WLAN M.2 module slots
  • Integrated Intel® HD Graphics 505 or 500 series controller
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SYS-C90-DS

Boxed Solution for Digital Signage applications based on the AMD Ryzen™ Embedded R1000 / V1000 family of SOCs

  • 2x GbE; M.2 WWAN and WLAN slots; 2x USB 3.0; 2x USB 2.0
  • AMD Radeon™ Vega GPU with up to 8 Compute Units
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SYS-C23-IGW

Industrial IoT Gateway based on the NXP i.MX 6SoloX Processor

  • up to 2x Fast Eth; WiFi + BTLE; optional LTE Cat4 modem onboard; 3x Multicolor Signalling LEDs; 1x RS-232 port; 1x RS-485 port; 2x CAN port
  • N.A.
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SYS-A90-IPC

Boxed solution based on the AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon) or G-Series SOC-J (formerly Prairie Falcon)

  • 2x GbE; 4x USB 3.0; 4x USB 2.0; 6x RS-232
  • AMD Radeon™ 3rd -Generation Graphics Core Next (GCN)
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B901

The boxed solution B901 supports the CQ7-901 carrier board on Pico-ITX Form Factor and the following module: • Q7-928

  • 1 x Gigabit / FastEthernet connector 1 x optional additional FastEthernet port
  • 2D/3D dedicated graphics processors (Q7-928)
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