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A major innovation in the textile machinery industry: using artificial intelligence for advanced machine management protocols based on digital twins developed through CLEA. The announcement at ITMA 2023.
The Board of Directors of SECO S.p.A. has approved the consolidated results for the first three months of 2023.
SECO and DRAM manufacturer company Goldkey have announced a strategic collaboration for the Asia-Pacific (APAC) region. The collaboration involves mutual specification of both companies’ products, joint customer approach, and promotion of CLEA, the IoT-AI platform developed by SECO, towards existing and potential opportunities with Goldkey DRAM solutions under the auspices of SECO Microelectronics and Goldkey Technology Corporation. The Memorandum of Understanding (MoU) was signed at NürnbergMesse on 14th March 2023.
A CLEA-based framework enabling customers to offer value-added services based on data analytics and AI
SECO and Matrix Electrónica proudly announce their partnership agreement for the distribution of SECO product portfolio in the Iberian region. This strategic cooperation will facilitate customers’ access to SECO technology while receiving highly targeted support in the selection of the most suitable solution for their project.
Q1 2023 PRE-CLOSING RESULTS
SECO announces to have successfully completed the closing of the first tranche of the capital increase by 7-Industries Holding B.V., announced on April 3, 2023.
7-Industries becomes one of SECO’s reference shareholders, with a long-term approach and an investment of 11.3% of SECO share capital.
FY 2022 RESULTS
At embedded world Exhibition&Conference 2023, SECO will showcase MAURY, one of the first SMARC Rel. 2.1.1 compliant computer on module (COM) products featuring NXP® Semiconductors’ i.MX 93 applications processor.
SECO and MediaTek’s collaboration paves way for a strong customer approach in the embedded market. Customers will benefit from early access to modules based on the new MediaTek Genio 700 processor.
SECO and MCTX agree on a sales partnership focusing on the Computer-On-Module product portfolio of the SECO Group.
SECO and Tronic One agree on a strategic partnership for the distribution of the entire product portfolio of the SECO Group.
SECO and Exein have teamed up to offer state-of-the-art security solutions for the IoT industry. By integrating Exein's advanced cybersecurity technology into SECO's product portfolio, clients can experience enhanced security for their software and hardware components. At the embedded world Exhibition&Conference in Nuremberg, attendees can see firsthand how Exein's real-time analysis protects SECO embedded devices from cyber attacks with minimal performance impact and low overhead costs.
Scalable solutions and integration capacity, combined with comprehensive support, pave the way for a new generation of medical device applications.
High-level Arm® processing performance and low power consumption for lightweight AIoT applications.
Visitors to SECO booth will have the chance to discover our end-to-end technology for autonomous manufacturing: a suite of high reliability computing boards also integrating dedicated CLEA Apps which support industrial automation with data analysis and help businesses enter the era of Industry 4.0.
High performance and integrated connectivity on x86 architecture with integrated IoT features.
SECO and Axelera AI are proud to announce the first integrated solutions developed as a result of their partnership at embedded world Exhibition&Conference. Visitors will be able to preview Axelera AI’s high performance AI inference capability in a range of SECO solutions in different form factors.
CLEA on Google Cloud to accelerate digital transformation and AI in the Industrial world
Vending machines – who doesn't know them? They're a lifesaver when you're desperate for a cold soft drink, or your best friend when you're craving a chocolate bar. Now imagine what else you can accomplish with a machine that is everywhere that people spend time. SECO will be demonstrating at this year's embedded world in Nuremberg from March 14 to 16 that a vending machine is now much more than just for simple product transactions.
SECO leads the way in energy management and smart city technology, from cutting-edge EV charging stations to smart sensors and monitoring services
In order to make its presence across the territory increasingly widespread, SECO and TOKHATEC signed a new partnership agreement for the coverage of the French market.
Real-world applications and new features of the CLEA AI-IoT platform await visitors at SECO booth
At this year’s exhibition SECO will highlight its modular portfolio of leading edge processing technologies.
From March 14-16, the embedded world Exhibition&Conference, the leading international fair for embedded systems, is coming to the Exhibition Center in Nuremberg, Germany. SECO, as a strategic supplier and partner in the digital transformation and IoT evolution of enterprises, will showcase its latest products and services to the tens of thousands of expected visitors.
SECO joins Axelera AI’s ecosystem as sole European developer of innovative AI accelerators based on Metis™ AI Platform
PRE-CLOSING FY 2022 RESULTS
SECO, a global leader of innovative Internet of Things (IoT) and Artificial Intelligence (AI) solutions, today launches CALLISTO, a COM Express® Rel. 3.1 Type 6 module based on new 13th Gen Intel Core processors. SECO was granted early access to design information and processor silicon via its participation in the Intel Early Access Program.
SECO, a global leader of innovative Internet of Things (IoT) and Artificial Intelligence (AI) solutions, today launches FINLAY, a SMARC® Rel. 2.1 compliant computer-on-module (COM) based on Intel Atom processors x7000E Series, Intel Core i3 processors, Intel Processors N Series (Codename: Alder Lake-N). This happens simultaneously with Intel’s release of this latest generation processor platform, to which SECO was granted early design information and processor silicon to accelerate the development of its solution.
HNA.Live, a data analytics company serving manufacturing and real estate industries, has selected CLEA AI-IoT platform for their innovative cloud solution that combines AI and 3D modelling technologies to optimize manufacturing facility productivity.
Parma/Arezzo, December 1, 2022 – The AI platform Pizzarotti Monitoring System (PMS) for the monitoring and management of construction sites, infrastructures and smart buildings, born from the partnership started in 2022 by Pizzarotti and SECO, will be used in the project, worth over one billion euro, assigned to Pizzarotti and Saipem for the construction of the railway bypass and the new High Speed train station of Florence.
PRE-CLOSING Q3 2022 RESULTS
An industrial partnership to increase the scale of data analysable by CLEA in Smart cities, Smart infrastructures applications
SECO announces the CLEA AI EV Charging Station, a complete solution designed to make charging points for cars and electric vehicles smart, connected, and data rich.
SECO H1 2022 results
SECO, Gold Member of the Intel® Partner Alliance, expands its lineup of cutting-edge computing solutions based on Intel® high-performance microprocessor platforms. Today, the company is launching two new fanless embedded computers for commercial and industrial environments, one based on 11th generation Intel® Core™ and Intel® Celeron® processors (formerly Tiger Lake UP3), the other based on Intel® Atom® x6000E, Intel® Pentium® and Celeron® N and J Series processors (formerly Elkhart Lake).
SECO has expanded the functionality of its KarL4 payment system. This means that contactless payment at terminals and machines enabled with KarL4 will soon be possible also with MasterCard and Visa in European countries outside Germany. Approval for the use of these credit cards with KarL4 is planned for the end of June.
Computer-on-Modules with Arm architecture now available with Windows 10 IoT Enterprise
After the recent announcement of an industrial partnership aimed at integrating Exein’s cybersecurity software solutions into SECO products, the two companies are set to present their collaboration to embedded world’s visitors.
SECO, a Gold Member of the Intel® Partner Alliance, continues its collaboration with Intel® in designing and developing edge solutions that leverage the most innovative and high-performance Intel® platforms. Today, SECO introduces to its product portfolio two new standard form factor solutions – a COM Express® Type 6 Compact Module and a 3.5” single board computer – both based on the 11th Gen Intel® Core™ processors (formerly Tiger Lake UP3).
Oniro is a distributed open-source operating designed with the goal of achieving a more intuitive and collaborative way for intra device collaboration, offering greater levels of flexibility and application portability across the broad spectrum of consumer and IoT devices. Visitors at the embedded world Exhibition & Conference will have the opportunity to explore Oniro OS capabilities through a demo at the SECO booth.
At this year’s edition of embedded world visitors will learn how to add intelligence to edge devices with SECO’s Clea software platform. Through application demos, visitors will discover the ease and power of data orchestration, data analytics, and artificial intelligence.
SECO enhances its family of fanless embedded computers with CHAMALEON, a boxed IP65 solution providing an excellent balance between computing and graphics performance, together with low power consumption.
SECO adds to its family of Smart Edge boxed solutions DORADO, a fanless, IP20 box PC based on the Rockchip RK3399 applications processor specifically designed for high-end industrial applications.
Through the acquisition of the Garz & Fricke Group in 2021, SECO customers benefit from a unique and complete human machine interface (HMI) product portfolio. At this year's embedded world trade fair, SECO will present its modular product portfolio, which combines a wide variety of processors with sophisticated installation options.
embedded world Exhibition and Conference, the leading international tradeshow for embedded system technologies, is coming back to Nuremberg Exhibition Centre. SECO will welcome visitors at booth 1-310/1-320 to show its extensive portfolio of embedded computing, human-machine interface (HMI), communication gateway, payment system, custom packaged product, and IoT software solutions.
The leading international tradeshow for embedded system technology returns in-person; SECO prepares to meet with customers and partners
SECO, a global leader of innovative embedded computing solutions, today announces a new Qseven® Cross Platform Starter Kit that includes the basic components necessary to start developing applications using any Qseven® compliant computer on module (COM).
SECO, a global leader of innovative Internet of Things (IoT) and Artificial Intelligence (AI) solutions, introduces JULIET, a COM Express® Type 7 module based on Intel® Xeon® D-1700 processors (formerly Ice Lake-D). This announcement is simultaneous with Intel®’s release of this latest generation processor platform, for which SECO is an Intel® Early Access Program partner.
SECO, a global leader of technological innovation for Internet of Things (IoT) and Artificial Intelligence (AI) solutions, today announces a new embedded computing solution based on the AMD RyzenTM Embedded V2000 Series Processors: the COM Express® OPHELIA.
Today SECO is pleased to unveil two new computing solutions based on the Intel® Atom™ X6000E Series, Intel® Pentium® and Celeron® N and J Series SoCs (formerly Elkhart Lake) family of processors: the ICARUS single board computer (SBC) and the Qseven® ATLAS system on module (SOM).
SECO enhances its family of Smart Edge box PCs with PICTOR, a fanless embedded computer providing an excellent balance between computing and graphics performance, together with low power consumption.
SECO, center of excellence in the field of technological innovation for IoT and AI solutions, announces today a new boxed solution based on the NXP i.MX 8M family of Applications Processors: the SYS-C20-IPC.
SECO, center of excellence in the field of technological innovation for IoT and AI solutions, announces today a new box PC specifically developed for Edge Computing: the SYS-C43-IPC.
A bridge between the world of frontier research and that of companies, to enable a digital transformation process based on sustainability.
Arezzo, 15 December 2021 - SECO, a leading technological innovator and provider of Internet of Things solutions, proudly announces that it has joined Project Cassini, an initiative led by Arm, achieving its first Arm® SystemReady IR Certification for SECO’s SBC-C61 single board computer based on the NXP i.MX 8M Mini microprocessor.
ROCKVILLE, MD – October 26, 2021 – SECO USA, Inc., a leading provider of rugged embedded electronic devices and software for mission-critical applications, proudly announces the successful demonstration of a new deck control device (DCD) to be used for controlling the MQ-25 (TM) Stingray (TM) unmanned aerial refueler on U.S. Navy aircraft carriers.
SECO is pleased to announce that it has entered into a binding agreement to acquire the entire share capital of Garz & Fricke Holding GmbH
Arezzo – September 24, 2021 – Today, SECO introduces six new members of its FLEXY VISION family, a series of high-resolution and cost-efficient Panel PCs, also known as Human-Machine Interfaces (HMIs), with various characteristics, dimensions, and operating systems.
Closing of the acquisition of ORO Networks under the newco SECO Mind US.
Multi-year partnership involving the use of the IoT-AI platform Clea
SECO has signed an agreement for the acquisition of Oro Networks, a US company based in the Silicon Valley. A strategic transaction creating value for SECO’s shareholders and giving rise to SECO Mind US.
Arezzo, 12 April 2021 – SECO S.p.A. (“SECO” or the “Company”) announces its intention to proceed with the listing of its ordinary shares (the “Shares”) on the Mercato Telematico Azionario, organised and managed by Borsa Italiana S.p.A. (the “Listing”), and, should the specific requirements be met, on the STAR segment.
Long-term agreement between Celli and SECO to develop integrated hardware and software solutions for the innovation of customer experience and implementation of predictive maintenance and Artificial Intelligence functionalities
IoT is now customized for SMEs thanks to the Clea application by SECO Mind on the Azure Cloud platform
GROUP REVENUES GROW 16.4% WITH INCREASED OPERATIONAL PROFITABILITY
Discovering more about the suite solution that integrates Artificial Intelligence, Internet of Things, Cloud Computing and Big Data Analysis with customer service
The company prepares to virtually showcase its products and services
Marco Parisi appointed as the company’s Investor Relations Manager
SECO Mind presents Clea: the suite solution that integrates Artificial Intelligence, Internet of Things, Cloud Computing and Big Data Analysis with customer service
The number of distributors in the EMEA region keeps growing
The Italian company acquires Hopenly and completes the evolution of its business model with high value-added services.
SECO enriches its product portfolio based on the NXP i.MX 8 Series of Processors with the SM-D18, a SMARC Rel. 2.1 compliant module with NXP i.MX 8M Plus Application Processors.
The innovative non-invasive pulmonary ventilator born from the partnership of SECO and IBD starts its distribution in Europe
SECO and SDA Bocconi: together to build a bridge between the industrial world, applied research and startups, in the name of Digital Innovation.
Today SECO is pleased to unveil its latest product: the SM-C93, a SMARC® Rel 2.1.1 compliant module with the Intel Atom x6000E Series and Intel Pentium and Celeron N and J Series processors.
SECO, always at the forefront of the latest technologies, has developed its first COM-HPC® / Client module Size A (95 x 120 mm), with the 11th Generation Intel Core processors: the CHPC-C77-CSA.
REVENUES AS AT JUNE 30, 2020 GREW BY 20% WITH A STRONG INCREASE IN THE GROUP’S PROFITABILITY
The Italian company accelerates its competence and Software as a Service development strategy in the Artificial Intelligence and Internet of Things domains.
SECOs pleased to announce that it has completed the acquisition of 100% of InHand, a Maryland-based leading provider of low-power rugged embedded systems and software.
SECO is developing state-of-the-art solutions suitable for the most advanced applications. Let’s talk about the newest standard from PICMG®: COM-HPC™.
At the embedded world Exhibition & Conference, SECO will be exhibiting its first COM Express™ Type 7 product: the COMe-C42-BT7, a COM Express™ Rel. 3.0 Basic Type 7 module with the AMD EPYC™ Embedded 3000 Processor.
After having obtained the necessary authorization from the Chinese government, SECO acquired the majority shares of Fannal Electronics Co. Ltd.
We’re in a garage in the 1970s and two guys are in the process of inventing the future.
SECO is pleased to announce that today it has signed an agreement to acquire InHand, a Maryland-based leading provider of low-power embedded systems and software to original equipment manufacturers of handheld, portable, battery operated, Internet of Things (IoT), and wireless devices.
SECO acquires 70% of AiDiLab
Milan, 20th April 2018 – FII Tech Growth, a fund managed by Fondo Italiano d’Investimento SGR, announces today its second investment in SECO SpA, one of the European leaders in the embedded electronics market. SECO, headquartered in Arezzo, Tuscany, with subsidiaries in the U.S.A., Germany and Taiwan, was founded in 1979 by entrepreneurs Daniele Conti and Luciano Secciani.
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