• usa


All the latest news and updates about the SECO Group

See also our "Investors" section


SECO Q1 2023 results
SECO H1 2022 results

Latest News

SECO Q1 2023 results

The Board of Directors of SECO S.p.A. has approved the consolidated results for the first three months of 2023.

SECO and Goldkey announce mutual collaboration focused on sales and marketing of SECO solutions in APAC

SECO and DRAM manufacturer company Goldkey have announced a strategic collaboration for the Asia-Pacific (APAC) region. The collaboration involves mutual specification of both companies’ products, joint customer approach, and promotion of CLEA, the IoT-AI platform developed by SECO, towards existing and potential opportunities with Goldkey DRAM solutions under the auspices of SECO Microelectronics and Goldkey Technology Corporation. The Memorandum of Understanding (MoU) was signed at NürnbergMesse on 14th March 2023.

With Matrix Electrónica SECO increases its presence in the Iberian market

SECO and Matrix Electrónica proudly announce their partnership agreement for the distribution of SECO product portfolio in the Iberian region. This strategic cooperation will facilitate customers’ access to SECO technology while receiving highly targeted support in the selection of the most suitable solution for their project.

SECO and Exein: revolutionizing IoT cybersecurity for a safer future

SECO and Exein have teamed up to offer state-of-the-art security solutions for the IoT industry. By integrating Exein's advanced cybersecurity technology into SECO's product portfolio, clients can experience enhanced security for their software and hardware components. At the embedded world Exhibition&Conference in Nuremberg, attendees can see firsthand how Exein's real-time analysis protects SECO embedded devices from cyber attacks with minimal performance impact and low overhead costs.

Embedded World 2023: SECO technology accelerating factory automation

Visitors to SECO booth will have the chance to discover our end-to-end technology for autonomous manufacturing: a suite of high reliability computing boards also integrating dedicated CLEA Apps which support industrial automation with data analysis and help businesses enter the era of Industry 4.0. 

Embedded world 2023: SECO and Axelera AI to unveil cutting-edge innovations

SECO and Axelera AI are proud to announce the first integrated solutions developed as a result of their partnership at embedded world Exhibition&Conference. Visitors will be able to preview Axelera AI’s high performance AI inference capability in a range of SECO solutions in different form factors.  

Rethink Vending: the infinite potential of Smart Vending Machines

Vending machines – who doesn't know them? They're a lifesaver when you're desperate for a cold soft drink, or your best friend when you're craving a chocolate bar. Now imagine what else you can accomplish with a machine that is everywhere that people spend time. SECO will be demonstrating at this year's embedded world in Nuremberg from March 14 to 16 that a vending machine is now much more than just for simple product transactions.

Embedded world 2023: SECO to showcase its range of products and services – from Edge to AI

From March 14-16, the embedded world Exhibition&Conference, the leading international fair for embedded systems, is coming to the Exhibition Center in Nuremberg, Germany. SECO, as a strategic supplier and partner in the digital transformation and IoT evolution of enterprises, will showcase its latest products and services to the tens of thousands of expected visitors.

SECO launches COM Express Type 6 module based on 13th Gen Intel Core Processors

SECO, a global leader of innovative Internet of Things (IoT) and Artificial Intelligence (AI) solutions, today launches CALLISTO, a COM Express® Rel. 3.1 Type 6 module based on new 13th Gen Intel Core processors. SECO was granted early access to design information and processor silicon via its participation in the Intel Early Access Program.

SECO launches SMARC® module based on Intel Atom processors x7000E Series, Intel Core i3 processor, Intel Processors N Series

SECO, a global leader of innovative Internet of Things (IoT) and Artificial Intelligence (AI) solutions, today launches FINLAY, a SMARC® Rel. 2.1 compliant computer-on-module (COM) based on Intel Atom processors x7000E Series, Intel Core i3 processors, Intel Processors N Series (Codename: Alder Lake-N). This happens simultaneously with Intel’s release of this latest generation processor platform, to which SECO was granted early design information and processor silicon to accelerate the development of its solution.

Pizzarotti and SECO's PMS platform selected in the project for the railway bypass and the High Speed train station of Florence

Parma/Arezzo, December 1, 2022 – The AI platform Pizzarotti Monitoring System (PMS) for the monitoring and management of construction sites, infrastructures and smart buildings, born from the partnership started in 2022 by Pizzarotti and  SECO, will be used in the project, worth over one billion euro, assigned to Pizzarotti and Saipem for the construction of the railway bypass and the new High Speed train station of Florence.

SECO launches PHOENIX and PYXIS, two new fanless computer solutions

SECO, Gold Member of the Intel® Partner Alliance, expands its lineup of cutting-edge computing solutions based on Intel® high-performance microprocessor platforms. Today, the company is launching two new fanless embedded computers for commercial and industrial environments, one based on 11th generation Intel® Core™ and Intel® Celeron® processors (formerly Tiger Lake UP3), the other based on Intel® Atom® x6000E, Intel® Pentium® and Celeron® N and J Series processors (formerly Elkhart Lake).

Contactless payment with SECO's KarL4 now available with MasterCard and Visa

SECO has expanded the functionality of its KarL4 payment system. This means that contactless payment at terminals and machines enabled with KarL4 will soon be possible also with MasterCard and Visa in European countries outside Germany. Approval for the use of these credit cards with KarL4 is planned for the end of June.

SECO to launch two off-the-shelf computing solutions based on 11th Gen Intel® Core™ processors

SECO, a Gold Member of the Intel® Partner Alliance, continues its collaboration with Intel® in designing and developing edge solutions that leverage the most innovative and high-performance Intel® platforms. Today, SECO introduces to its product portfolio two new standard form factor solutions – a COM Express® Type 6 Compact Module and a 3.5” single board computer – both based on the 11th Gen Intel® Core™ processors (formerly Tiger Lake UP3).

Experience the future of Vending enabled by Oniro OS at SECO booth at embedded world

Oniro is a distributed open-source operating designed with the goal of achieving a more intuitive and collaborative way for intra device collaboration, offering greater levels of flexibility and application portability across the broad spectrum of consumer and IoT devices. Visitors at the embedded world Exhibition & Conference will have the opportunity to explore Oniro OS capabilities through a demo at the SECO booth.

Deep dive: Clea-based demos showcased at embedded world

At this year’s edition of embedded world visitors will learn how to add intelligence to edge devices with SECO’s Clea software platform. Through application demos, visitors will discover the ease and power of data orchestration, data analytics, and artificial intelligence.

SECO presents its expanded Human Machine Interface portfolio at embedded world 2022

Through the acquisition of the Garz & Fricke Group in 2021, SECO customers benefit from a unique and complete human machine interface (HMI) product portfolio. At this year's embedded world trade fair, SECO will present its modular product portfolio, which combines a wide variety of processors with sophisticated installation options.

Discovering more about SECO product portfolio showcased at embedded world 2022

embedded world Exhibition and Conference, the leading international tradeshow for embedded system technologies, is coming back to Nuremberg Exhibition Centre. SECO will welcome visitors at booth 1-310/1-320 to show its extensive portfolio of embedded computing, human-machine interface (HMI), communication gateway, payment system, custom packaged product, and IoT software solutions.

SECO joins Arm’S Project Cassini initiative for a new era of Arm-based Edge

Arezzo, 15 December 2021 - SECO, a leading technological innovator and provider of Internet of Things solutions, proudly announces that it has joined Project Cassini, an initiative led by Arm, achieving its first Arm® SystemReady IR Certification for SECO’s SBC-C61 single board computer based on the NXP i.MX 8M Mini microprocessor.

Embedded world 2021: introducing Clea

Discovering more about the suite solution that integrates Artificial Intelligence, Internet of Things, Cloud Computing and Big Data Analysis with customer service

SECO integrates InHand Electronics

SECOs pleased to announce that it has completed the acquisition of 100% of InHand, a Maryland-based leading provider of low-power rugged embedded systems and software.

SECO cuts the edge with the COM-HPC™

SECO is developing state-of-the-art solutions suitable for the most advanced applications. Let’s talk about the newest standard from PICMG®COM-HPC™


SECO is pleased to announce that today it has signed an agreement to acquire InHand, a Maryland-based leading provider of low-power embedded systems and software to original equipment manufacturers of handheld, portable, battery operated, Internet of Things (IoT), and wireless devices.

FII Tech Growth invests in SECO

Milan, 20th April 2018 – FII Tech Growth, a fund managed by Fondo Italiano d’Investimento SGR, announces today its second investment in SECO SpA, one of the European leaders in the embedded electronics market. SECO, headquartered in Arezzo, Tuscany, with subsidiaries in the U.S.A., Germany and Taiwan, was founded in 1979 by entrepreneurs Daniele Conti and Luciano Secciani.