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    μQ7-962

    μQseven® standard module with NXP i.MX 6 Processor

    • Single-, Dual- and Quad- Core (ARM® Cortex® -A9 Cores)
    • 4x USB 2.0; 2x Serial ports; CAN Bus
    • 2D/3D dedicated graphics processors
    • up to 2GB DDR3L on-board
    Available in Industrial Temperature Range

      μQ7-962

    μQ7-962

    SYS-B08-7/BD

    SYS-B08-7/BD

    Q7-C25

    Q7-C25

    Q7-C26

    Q7-C26

     
    Product Development Status
    Processor
    NXP i.MX 6 Family, based on ARM® CORTEX® -A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core
    NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    NXP i.MX 8 Family:
    i.MX 8QuadMax - 2x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8QuadPlus - 1x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8Quad - 4x Cortex®-A53 cores + 2x Cortex®-M4F cores

    Chipset
    ...
    ...
    ...
    ...
    Max Cores
    4
    1 + 1
    0
    0
    Max Thread
    0
    ...
    0
    0
    Memory
    up to 2GB DDR3L on-board (up to 1GB with i.MX6S)
    512MB RAM

    soldered down DDR4-2400 memory, 32-bit interface, up to 8GB

    soldered down LPDDR4-3200 memory, 64-bit interface

    Graphics
    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D and i.MX6Q)
    Supports up to 3 independent displays with i.MX6D and i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S

    Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator
    OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1 supported

    Integrated Graphics Processing Unit, supports 2 independent displays
    Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
    Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-2, VC-1, RV9, VP8, H.263 and MPEG4 part, HW encoding of AVC/H.264
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 3.x, DirectX 11

    Video Interfaces
    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4

    Single Channel 18-/24- bit LVDS connector + Touch Screen (I2C signals)
    24-bit Parallel RGB Connector

    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
    18- / 24-bit Dual Channel LVDS interface

    HDMI 2.0a or DP 1.3 interface, supporting HDCP 2.2
    Dual Channel or 2 x Single Channel 18- / 24-bit LVDS interface

    Video Resolution
    HDMI, up to 1080p
    LVDS, up to 1920x1200

    LVDS: up to 1366x768 @60Hz, 24bpp
    RGB: up to 1920x1080p @60Hz, 24bpp

    HDMI:Up to 4096 x 2160p60
    LVDS:Up to 1920 x 1080 @ 60Hz
    HDMI:Up to 4Kp60
    LVDSUp to 1080p
    Mass Storage
    Up to 8 GB eMMC drive soldered onboard
    SD / MMC / SDIO interface
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

    16MB NOR Quad-SPI Flash soldered onboard µSD Card slot
    SYS-B08-FULL/D: 8GB eMMC soldered onboard

    eMMC 5.0 drive soldered on-board
    SD 4-bit interface
    QSPI Flash soldered-onboard

    1x SATA Gen3 interface (alternative to 1x PCI-e x1 port)
    eMMC 5.1 drive soldered on-board
    SD 4-bit interface
    QSPI Flash soldered-on-board

    Networking
    Gigabit Ethernet interface
    1x FastETH

    1 x Gigabit Ethernet interface

    1 x Gigabit Ethernet interface

    USB
    1 x USB OTG interface
    4 x USB 2.0 Host interfaces
    1 x USB 2.0 OTG port
    3 x USB 2.0 Host ports on standard Type-A socket
    1 x USB 2.0 Host port on internal pin header

    2 x USB 2.0 Host Ports
    2 x USB 3.0 Host Ports
    1 x USB 2.0 OTG port

    4 x USB 2.0 Host Ports 
    1 x USB 3.0 Host Port
    1 x USB 2.0 OTG port

    PCI-e
    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
    ...

    2x PCI-e x1 ports

    Up to 2x PCI-e x1 Gen3 ports

    Audio
    I2S / AC’97 Audio Interface
    I2S Audio interface on programmable pin header
    S / PDIF interface (In and Out) on programmable pin header

    I2S Audio Interface

    I2S Audio Interface

    Serial Ports
    2 x Serial ports (TTL interface)
    CAN port interface

    1 x CAN Port reconfigurable as GPIO
    2x RS-232 (Tx/RX signals only) + 1x RS-485 serial ports on expansion pin header

    1x UART Tx/Rx/RTS/CTS
    1x CAN Bus (TTL level)

    1x UART Tx/Rx/RTS/CTS
    1x CAN Bus (TTL level)

    Other Interfaces
    I2C Bus
    SM Bus
    Power Management Signals

    2 x I2C dedicated connectors (one reserved for Touch Screen)
    6 analog inputs for A/D Conversion
    Programmable (*) expansion pin header connector, able to offer:
    • CSI interface input (PAL and NTSC formats supported)
    • Up to 20 GPIO
    • SPI interface
    • SPDIF Audio interface
    • I2S Audio interface
    • CAN interface (TTL level)
    • 5 x PWM
    • 3 x I2C
    • 3 x serial ports (2x RS-232 +1xRS-485 interface)
    Embedded Low Power RTC
    (*) Please note that some of these interfaces are factory options, other configurations are made via SW using the pin multiplexing possibilities of the i.MX6SX processor.

    Optional 9-Axis Motion Sensors (Accelerometer, Magnetometer and Digital Gyroscope)

    CSI camera connector
    2x I2C Bus
    SPI interface
    8 x GPI/Os
    Power Management Signals
    Watchdog

    CSI camera connector
    2x I2C Bus
    SPI interface
    8 x GPI/Os
    Boot select signal
    Power Management Signals
    Watchdog

    Power Supply
    +5VDC ± 5%

    +12VDC nominal voltage
    +3VDC cabled Coin Cell Battery

    +5VDC ±5%
    +3.3V_RTC

    +5VDC ± 5%
    +3.3V_RTC

    Power Consumption
    ...
    ...
    ...
    ...
    Operating System
    Linux
    Yocto
    Android
    Linux

    Linux
    Android

    Linux
    Android

    Operating Temperature

    0°C ÷ +60°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Commercial

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    40x70 mm (μQseven, 1.57” x 2.76”)
    189.60 x 121.40 x 28.20 mm
    70x70 mm (2.76” x 2.76”)
    70x70 mm (2.76” x 2.76”)

    Description

    Details

    μQ7-962 is a Qseven® Rel. 2.0 Compliant Module designed by SECO that offers top computational and graphical performances given by low-power consuming ARM architecture.
    The board integrates i.MX 6 Multimedia Applications platform from NXP, a multimedia processor integrating a multicore Cortex® A9 ARM Core (up to Quad Core processors), ideal for applications requiring multimedia capabilities and/or high levels of parallel computing.
    All this comes in the μQseven form factor, just 40x70mm, introduced with the Qseven® specifications Rel. 2.0.
    Additional Information

    Additional Information

    Processor
    NXP i.MX 6 Family, based on ARM® CORTEX® -A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core
    Max Cores
    4
    Memory
    up to 2GB DDR3L on-board (up to 1GB with i.MX6S)
    Graphics
    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D and i.MX6Q)
    Supports up to 3 independent displays with i.MX6D and i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S
    Video Interfaces
    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4
    Video Resolution
    HDMI, up to 1080p
    LVDS, up to 1920x1200
    Mass Storage
    Up to 8 GB eMMC drive soldered onboard
    SD / MMC / SDIO interface
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)
    Networking
    Gigabit Ethernet interface
    USB
    1 x USB OTG interface
    4 x USB 2.0 Host interfaces
    PCI-e
    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
    Audio
    I2S / AC’97 Audio Interface
    Serial Ports
    2 x Serial ports (TTL interface)
    CAN port interface
    Other Interfaces
    I2C Bus
    SM Bus
    Power Management Signals
    Power Supply
    +5VDC ± 5%
    Operating System
    Linux
    Yocto
    Operating Temperature

    0°C ÷ +60°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    40x70 mm (μQseven, 1.57” x 2.76”)
    Software
    SECO WIKI
    Linux
    • SECO BSP*
    Linux-YOCTO
    • Yocto meta SECO BSP release Guideline*

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Documents

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    μQ7-962

    μQ7-962
    • EVALUATE OUR PRODUCTS

      Max. 3 pcs per part number
    • SAMPLING PRICE

      Shipping costs included
    • BUSINESS TO BUSINESS ONLY

      Technical support provided exclusively to businesses
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