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    μQ7-962

    μQseven® standard module with NXP i.MX 6 Processor

    • Single-, Dual- and Quad- Core (ARM® Cortex® -A9 Cores)
    • 4x USB 2.0; 2x Serial ports; CAN Bus
    • 2D/3D dedicated graphics processors
    • up to 2GB DDR3L on-board
    Available in Industrial Temperature Range

      μQ7-962

    μQ7-962

    Q7-C25

    Q7-C25

    SM-C12

    SM-C12

    SYS-B08-7/BD

    SYS-B08-7/BD

     
    Product Development Status
    Processor
    NXP i.MX 6 Family, based on ARM® CORTEX® -A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz
    Chipset
    ...
    ...
    ...
    ...
    Max Cores
    4
    0
    0
    1 + 1
    Max Thread
    0
    0
    0
    ...
    Memory
    up to 2GB DDR3L on-board (up to 1GB with i.MX6S)

    soldered down DDR4-2400 memory, 32-bit interface, up to 4GB

    Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB
    512MB RAM
    Graphics
    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D and i.MX6Q)
    Supports up to 3 independent displays with i.MX6D and i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC,H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG (not for i.MX8M QuadLite).
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 2.x, DirectX 11

    Integrated Graphics Processing Unit, supports 2 independent displays
    Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
    Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

    Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator
    OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1 supported

    Video Interfaces
    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4

    HDMI 2.0a / Display Port 1.3 interface, supporting HDCP 2.2 and HDCP 1.4/1.3
    eDP interface or 18- / 24-bit Dual Channel LVDS interface

    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
    18- / 24-bit Dual Channel LVDS interface or MIPI-DSI interface
    (factory alternatives)

    Single Channel 18-/24- bit LVDS connector + Touch Screen (I2C signals)
    24-bit Parallel RGB Connector

    Video Resolution
    HDMI, up to 1080p
    LVDS, up to 1920x1200
    HDMI/DP: Up to 4096 x 2160p60
    LVDS/eDP: Up to 1920 x 1080 @ 60Hz
    HDMIUp to 4096 x 2160 @ 60 (4K)
    MIPI-DSI, LVDSUp to 1920 x 1080 @ 60Hz

    LVDS: up to 1366x768 @60Hz, 24bpp
    RGB: up to 1920x1080p @60Hz, 24bpp

    Mass Storage
    Up to 8 GB eMMC drive soldered onboard
    SD / MMC / SDIO interface
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

    eMMC 5.0 drive soldered on-board, up to 64GB
    Optional microSD slot on board
    QSPI Flash soldered-onboard

    Optional SD 4-bit interface
    QSPI Flash soldered-onboard
    eMMC 5.0 drive soldered on-board

    16MB NOR Quad-SPI Flash soldered onboard µSD Card slot
    SYS-B08-FULL/D: 8GB eMMC soldered onboard

    Networking
    Gigabit Ethernet interface

    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard

    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard
    1x FastETH
    USB
    1 x USB OTG interface
    4 x USB 2.0 Host interfaces

    1 x USB 3.0 OTG Ports
    Up to 4 x USB 2.0 Host Ports

    2 USB 3.0 Host ports
    2 USB 2.0 Host ports
    1 USB 2.0 OTG port
    1 x USB 2.0 OTG port
    3 x USB 2.0 Host ports on standard Type-A socket
    1 x USB 2.0 Host port on internal pin header
    PCI-e
    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    1x PCI-e x1 port, optional

    2x PCI-e x1 ports
    ...
    Audio
    I2S / AC’97 Audio Interface

    I2S Audio Interface

    I2S Audio Interface
    I2S Audio interface on programmable pin header
    S / PDIF interface (In and Out) on programmable pin header
    Serial Ports
    2 x Serial ports (TTL interface)
    CAN port interface

    1x UART Tx/Rx/RTS/CTS (Optional)
    1x Debug UART
    Optional CAN Bus interface (TTL Level)

    Up to 2x UART Tx/Rx/RTS/CTS
    2x UART Tx/Rx
    1x CAN Bus (TTL level)

    1 x CAN Port reconfigurable as GPIO
    2x RS-232 (Tx/RX signals only) + 1x RS-485 serial ports on expansion pin header

    Other Interfaces
    I2C Bus
    SM Bus
    Power Management Signals

    I2C Bus
    SM Bus
    Optional SPI interface
    8 x GPI/Os
    UltraLow Power RTC
    Power Management Signals
    Watchdog

    1x 4-lanes + 1x 2-lanes CSI camera interfaces
    I2C Bus
    SM Bus
    2x SPI interfaces
    QuadSPI interface
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    2 x I2C dedicated connectors (one reserved for Touch Screen)
    6 analog inputs for A/D Conversion
    Programmable (*) expansion pin header connector, able to offer:
    • CSI interface input (PAL and NTSC formats supported)
    • Up to 20 GPIO
    • SPI interface
    • SPDIF Audio interface
    • I2S Audio interface
    • CAN interface (TTL level)
    • 5 x PWM
    • 3 x I2C
    • 3 x serial ports (2x RS-232 +1xRS-485 interface)
    Embedded Low Power RTC
    (*) Please note that some of these interfaces are factory options, other configurations are made via SW using the pin multiplexing possibilities of the i.MX6SX processor.

    Optional 9-Axis Motion Sensors (Accelerometer, Magnetometer and Digital Gyroscope)

    Power Supply
    +5VDC ± 5%

    +5VDC ±5% and +5VSB (optional)
    +3.3V_RTC

    +5VDC
    +3.3V_RTC

    +12VDC nominal voltage
    +3VDC cabled Coin Cell Battery

    Power Consumption
    ...
    ...
    ...
    ...
    Operating System
    Linux
    Yocto

    Linux
    Yocto
    Android

    Linux
    Yocto
    Android

    Linux
    Yocto

    Operating Temperature

    0°C ÷ +60°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version, without WiF+BT optional module)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Commercial
    Dimensions
    40x70 mm (μQseven, 1.57” x 2.76”)
    70x70 mm (2.76” x 2.76”)
    50 x 82 mm (1.97” x 3.23”)
    189.60 x 121.40 x 28.20 mm
    Security
    ...
    ...
    ...
    ...
    BIOS
    ...
    ...
    ...
    ...
    Embedded Controller Functionalities
    ...
    ...
    ...
    ...
    CAN Bus
    N/A
    ...
    N/A
    ...
    Functional Safety Features
    N/A
    ...
    N/A
    ...

    Description

    Details

    μQ7-962 is a Qseven® Rel. 2.0 Compliant Module designed by SECO that offers top computational and graphical performances given by low-power consuming ARM architecture.
    The board integrates i.MX 6 Multimedia Applications platform from NXP, a multimedia processor integrating a multicore Cortex® A9 ARM Core (up to Quad Core processors), ideal for applications requiring multimedia capabilities and/or high levels of parallel computing.
    All this comes in the μQseven form factor, just 40x70mm, introduced with the Qseven® specifications Rel. 2.0.
    Additional Information

    Additional Information

    Processor
    NXP i.MX 6 Family, based on ARM® CORTEX® -A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core
    Max Cores
    4
    Memory
    up to 2GB DDR3L on-board (up to 1GB with i.MX6S)
    Graphics
    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D and i.MX6Q)
    Supports up to 3 independent displays with i.MX6D and i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S
    Video Interfaces
    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4
    Video Resolution
    HDMI, up to 1080p
    LVDS, up to 1920x1200
    Mass Storage
    Up to 8 GB eMMC drive soldered onboard
    SD / MMC / SDIO interface
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)
    Networking
    Gigabit Ethernet interface
    USB
    1 x USB OTG interface
    4 x USB 2.0 Host interfaces
    PCI-e
    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
    Audio
    I2S / AC’97 Audio Interface
    Serial Ports
    2 x Serial ports (TTL interface)
    CAN port interface
    Other Interfaces
    I2C Bus
    SM Bus
    Power Management Signals
    Power Supply
    +5VDC ± 5%
    Operating System
    Linux
    Yocto
    Operating Temperature

    0°C ÷ +60°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    40x70 mm (μQseven, 1.57” x 2.76”)
    Software
    SECO WIKI
    Linux
    • SECO BSP*
    Linux-YOCTO
    • Yocto meta SECO BSP release Guideline*

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    Documents

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    μQ7-962

    μQ7-962
    • EVALUATE OUR PRODUCTS

      Max. 3 pcs per part number
    • SAMPLING PRICE

      Shipping costs included
    • BUSINESS TO BUSINESS ONLY

      Technical support provided exclusively to businesses
    μQseven® standard module with NXP i.MX 6 Processor
    sku part number part number description part number configuration buy samples online contact us compare
    Q962-B120-0000-C1 µQ7 - NXP i.MX6 DualLite @1GHz (w/ GPU,VPU) µQ7 - NXP i.MX6 DualLite @1GHz (w/ GPU,VPU), 1GB DDR3L Single Channel, 4GB eMMC, Ultra Low Power RTC, 8Mb SPI Flash - Commercial temp. range Add to Compare

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