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    SBC-B08

    SBC with NXP i.MX 6SoloX Processor

    • NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz
    • up to 2x Fast Eth; optional WiFi + BT LE
    • Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator
    • 32-bit DDR3L memory soldered on-board, up to 1GB
    Available in Industrial Temperature Range

      SBC-B08

    SBC-B08

    μQ7-A75-J

    μQ7-A75-J

    μQ7-A76-J

    μQ7-A76-J

    SYS-B08-7/BD

    SYS-B08-7/BD

     
    Product Development Status
    Processor
    NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz

    NXP i.MX6 Family, based on ARM® CORTEX-A9 processors

    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core

    Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP
    Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP
    Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP

    NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz
    Chipset
    ...
    ...
    ...
    ...
    Max Cores
    1 + 1
    2
    2
    1 + 1
    Max Thread
    ...
    ...
    2
    ...
    Memory

    Soldered on-board DDR3L memory, 32-bit interface
    SYS-B08-BASIC/D: 512MB
    SYS-B08-FULL/D: 1GB

    Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F

    Soldered onboard DDR3L memory
    E3825, E3815:  up to 4GB Single-Channel DDR3L @ 1066MHz
    N2807: up to 4GB Single-Channel DDR3L @ 1333MHz

    512MB RAM
    Graphics

    Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator
    OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1 supported

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Supports 2 independent displays

    Integrated Intel® HD Graphics 4000 Series controller
    Dual independent display support
    HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats
    HW encoding of H.264, MPEG2 and MVC formats

    Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator
    OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1 supported

    Video Interfaces

    Single Channel 18-/24- bit LVDS connector + Touch Screen (I2C signals)
    24-bit Parallel RGB Connector

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface

    Multimode Display Port (DP++) interface
    18 / 24 bit Dual Channel LVDS interface

    Single Channel 18-/24- bit LVDS connector + Touch Screen (I2C signals)
    24-bit Parallel RGB Connector

    Video Resolution

    LVDS: up to 1366x768 @60Hz, 24bpp
    RGB: up to 1920x1080p @60Hz, 24bpp

    LVDS, resolution up to 1920x1200
    HDMI, resolution up to 1080p

    DP++ (HDMI compatible) Up to 2560x1600@60Hz
    LVDS interface Up to 1920x1200@60Hz

    LVDS: up to 1366x768 @60Hz, 24bpp
    RGB: up to 1920x1080p @60Hz, 24bpp

    Mass Storage

    16MB NOR Quad-SPI Flash soldered onboard µSD Card slot
    SYS-B08-FULL/D: 8GB eMMC soldered onboard

    On-board eMMC drive, up to 8 GB
    SD / MMC / SDIO interface
    Internal SPI Flash for booting

    2 x external S-ATA channels
    SD interface
    Optional eMMC drive soldered onboard

    16MB NOR Quad-SPI Flash soldered onboard µSD Card slot
    SYS-B08-FULL/D: 8GB eMMC soldered onboard

    Networking

    SYS-B08-BASIC/D:1x Fast Ethernet RJ-45 connector
    SYS-B08-FULL/D: 2x Fast Ethernet RJ-45 connector + WiFi (802.11 b/g/n) +BT LE combo module + antenna onboard

    Fast Ethernet (10/100) interface
    Gigabit Ethernet interface
    1x FastETH
    USB
    1 x USB 2.0 OTG port
    3 x USB 2.0 Host ports on standard Type-A socket
    1 x USB 2.0 Host port on internal pin header

    1 x USB OTG interface
    1 x USB 2.0 Host interface

    1 x USB 3.0 Host port
    4 x USB 2.0 Host ports (one shared with USB 3.0 interface)
    1 x USB 2.0 OTG port
    3 x USB 2.0 Host ports on standard Type-A socket
    1 x USB 2.0 Host port on internal pin header
    PCI-e
    ...

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    3 x PCI-e x1 lanes (Gen2)
    ...
    Audio
    I2S Audio interface on programmable pin header
    S / PDIF interface (In and Out) on programmable pin header
    I2S / AC’97 Audio Interface
    HD Audio Interface
    I2S Audio interface on programmable pin header
    S / PDIF interface (In and Out) on programmable pin header
    Serial Ports

    1 x CAN Port reconfigurable as GPIO
    2x RS-232 (Tx/RX signals only) + 1x RS-485 serial ports on expansion pin header

    ...
    1 x Serial Port (TTL interface, Tx/Rx only)

    1 x CAN Port reconfigurable as GPIO
    2x RS-232 (Tx/RX signals only) + 1x RS-485 serial ports on expansion pin header

    Other Interfaces

    2 x I2C dedicated connectors (one reserved for Touch Screen)
    6 analog inputs for A/D Conversion
    Programmable (*) expansion pin header connector, able to offer:
    • CSI interface input (PAL and NTSC formats supported)
    • Up to 20 GPIO
    • SPI interface
    • SPDIF Audio interface
    • I2S Audio interface
    • CAN interface (TTL level)
    • 5 x PWM
    • 3 x I2C
    • 3 x serial ports (2x RS-232 +1xRS-485 interface)
    Embedded Low Power RTC
    (*) Please note that some of these interfaces are factory options, other configurations are made via SW using the pin multiplexing possibilities of the i.MX6SX processor.

    Optional 9-Axis Motion Sensors (Accelerometer, Magnetometer and Digital Gyroscope)

    On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
    - Additional SD interface
    - Up to 4 UARTs
    - CAN interface
    - Watchdog(s)
    - I2C interfaces
    - PWM outputs
    - SPI interface
    - Additional Audio interface

    (*) not all the combinations are allowed simultaneously Power Management Signals

    I2C bus
    LPC Bus
    SM Bus
    Thermal / FAN Management
    PWR Management signals

    2 x I2C dedicated connectors (one reserved for Touch Screen)
    6 analog inputs for A/D Conversion
    Programmable (*) expansion pin header connector, able to offer:
    • CSI interface input (PAL and NTSC formats supported)
    • Up to 20 GPIO
    • SPI interface
    • SPDIF Audio interface
    • I2S Audio interface
    • CAN interface (TTL level)
    • 5 x PWM
    • 3 x I2C
    • 3 x serial ports (2x RS-232 +1xRS-485 interface)
    Embedded Low Power RTC
    (*) Please note that some of these interfaces are factory options, other configurations are made via SW using the pin multiplexing possibilities of the i.MX6SX processor.

    Optional 9-Axis Motion Sensors (Accelerometer, Magnetometer and Digital Gyroscope)

    Power Supply

    +12VDC nominal voltage
    +3VDC cabled Coin Cell Battery

    +5VDC ± 5%
    Optional Low Power RTC

    +5VDC ± 5%

    +12VDC nominal voltage
    +3VDC cabled Coin Cell Battery

    Power Consumption
    ...
    ...
    ...
    ...
    Operating System

    Android
    Linux

    Linux
    Yocto

    Microsoft® Windows 7
    Microsoft® Windows 8.1
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7
    Microsoft® Windows Embedded Standard 8
    Microsoft® Windows Embedded Compact 7
    Linux
    Yocto

    Android
    Linux
    Operating Temperature

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (Industrial temp.)* 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Commercial
    Dimensions
    89.5 x 87 mm (3.52” x 3.43”)
    40x70 mm (1.57” x 2.76”)
    40 x 70 mm (1.57 x 2.76)
    189.60 x 121.40 x 28.20 mm

    Description

    Details

    SBC-B08 is a new-generation all-in-one low-cost computer designed by SECO, equipped with a NXP i.MX 6SoloX applications processor able to run Android or Linux. SBC-B08 is a revolutionary product in terms of connectivity, interactivity with the real world and cost: a new concept of single board computer ready for Internet of Things applications and for the Post-PC era.
    Additional Information

    Additional Information

    Processor
    NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz
    Max Cores
    1 + 1
    Memory

    Soldered on-board DDR3L memory, 32-bit interface
    SYS-B08-BASIC/D: 512MB
    SYS-B08-FULL/D: 1GB

    Graphics

    Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator
    OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1 supported

    Video Interfaces

    Single Channel 18-/24- bit LVDS connector + Touch Screen (I2C signals)
    24-bit Parallel RGB Connector

    Video Resolution

    LVDS: up to 1366x768 @60Hz, 24bpp
    RGB: up to 1920x1080p @60Hz, 24bpp

    Mass Storage

    16MB NOR Quad-SPI Flash soldered onboard µSD Card slot
    SYS-B08-FULL/D: 8GB eMMC soldered onboard

    Networking

    SYS-B08-BASIC/D:1x Fast Ethernet RJ-45 connector
    SYS-B08-FULL/D: 2x Fast Ethernet RJ-45 connector + WiFi (802.11 b/g/n) +BT LE combo module + antenna onboard

    USB
    1 x USB 2.0 OTG port
    3 x USB 2.0 Host ports on standard Type-A socket
    1 x USB 2.0 Host port on internal pin header
    Audio
    I2S Audio interface on programmable pin header
    S / PDIF interface (In and Out) on programmable pin header
    Serial Ports

    1 x CAN Port reconfigurable as GPIO
    2x RS-232 (Tx/RX signals only) + 1x RS-485 serial ports on expansion pin header

    Other Interfaces

    2 x I2C dedicated connectors (one reserved for Touch Screen)
    6 analog inputs for A/D Conversion
    Programmable (*) expansion pin header connector, able to offer:
    • CSI interface input (PAL and NTSC formats supported)
    • Up to 20 GPIO
    • SPI interface
    • SPDIF Audio interface
    • I2S Audio interface
    • CAN interface (TTL level)
    • 5 x PWM
    • 3 x I2C
    • 3 x serial ports (2x RS-232 +1xRS-485 interface)
    Embedded Low Power RTC
    (*) Please note that some of these interfaces are factory options, other configurations are made via SW using the pin multiplexing possibilities of the i.MX6SX processor.

    Optional 9-Axis Motion Sensors (Accelerometer, Magnetometer and Digital Gyroscope)

    Power Supply

    +12VDC nominal voltage
    +3VDC cabled Coin Cell Battery

    Operating System

    Android
    Linux

    Operating Temperature

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    89.5 x 87 mm (3.52” x 3.43”)
    Software

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    Documents

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    SBC-B08

    SBC-B08
    • EVALUATE OUR PRODUCTS

      Max. 3 pcs per part number
    • SAMPLING PRICE

      Shipping costs included
    • BUSINESS TO BUSINESS ONLY

      Technical support provided exclusively to businesses
    SBC with NXP i.MX 6SoloX Processor
    sku part number part number description part number configuration buy samples online contact us compare
    SYS-B08-I-BASIC/D SBC - SBC-B08 Basic version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 512MB RAM - 1x FastETH - RTC LP - RS-485 - RS-232 - CAN - Ind. Temp. w/Heatsink SBC - SBC-B08 Basic version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 512MB RAM - 1x FastETH - RTC LP - RS-485 - RS-232 - CAN - Ind. Temp. w/Heatsink Add to Compare
    SYS-B08-BASIC/D SBC - SBC-B08 Basic version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 512MB RAM - 1x FastETH - RTC LP - RS-485 - RS-232 - CAN - Comm. Temp. w/Heatsink SBC - SBC-B08 Basic version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 512MB RAM - 1x FastETH - RTC LP - RS-485 - RS-232 - CAN - Comm. Temp. w/Heatsink Add to Compare
    SYS-B08-FULL/D SBC - SBC-B08 Full version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 1GB RAM - 8GB eMMC - 2x FastETH - Wi-Fi/BLE - RTC LP - RS-485 - RS-232 - CAN - Comm. Temp. w/ Heatsink SBC - SBC-B08 Full version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 1GB RAM - 8GB eMMC - 2x FastETH - Wi-Fi/BLE - RTC LP - RS-485 - RS-232 - CAN - Comm. Temp. w/ Heatsink Add to Compare
    SYS-B08-I-FULL/D SBC - SBC-B08 Full version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 1GB RAM - 8GB eMMC - 2x FastETH - Wi-Fi/BLE - RTC LP - RS-485 - RS-232 - CAN - Ind. Temp. w/ Heatsink SBC - SBC-B08 Full version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 1GB RAM - 8GB eMMC - 2x FastETH - Wi-Fi/BLE - RTC LP - RS-485 - RS-232 - CAN - Ind. Temp. w/ Heatsink Add to Compare

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