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    SBC-B08

    SBC with NXP i.MX 6SoloX Processor

    • NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz
    • up to 2x Fast Eth; optional WiFi + BT LE
    • Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator
    • 32-bit DDR3L memory soldered on-board, up to 1GB
    Available in Industrial Temperature Range

      SBC-B08

    SBC-B08

    SBC-A62-J

    SBC-A62-J

    Q7-928

    Q7-928

    μQ7-A75-J

    μQ7-A75-J

     
    Product Development Status
    Processor
    NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz

    NXP i.MX 6 Family, based on ARM Cortex-A9 processors:
    SBC-A62-J-SOLO: Single Core (i.MX6S) @1GHz
    SBC-A62-J-LITE: Dual Core Lite (i.MX6DL) @1GHz
    SBC-A62-J-PLUS: Dual Core Plus (i.MX6DP) @1GHz
    SBC-A62-J-QUAD: Quad Core (i.MX6Q) @1GHz

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6DP DualPlus - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors

    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core

    Chipset
    ...
    ...
    ...
    ...
    Max Cores
    1 + 1
    4
    4
    2
    Max Thread
    ...
    0
    0
    ...
    Memory

    Soldered on-board DDR3L memory, 32-bit interface
    SYS-B08-BASIC/D: 512MB
    SYS-B08-FULL/D: 1GB

    Soldered on-board DDR3L memory***:
    SBC-A62-J-SOLO: 512MB 32-bit interface
    SBC-A62-J-LITE: 1GB 64-bit interface
    SBC-A62-J-PLUS: 2GB 64-bit interface
    SBC-A62-J-QUAD: 1GB 64-bit interface

    *** For additional configurability please contact SECO

    Up to 4GB DDR3L on-board (up to 2GB with i.MX6S)

    Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F

    Graphics

    Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator
    OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1 supported

    Integrated Graphics, with up to 3 separate HW accelerators for 2D, OpenGL® ES2.0 3D
    OpenVG™ accelerator (only SBC-A62-J-PLUS and SBC-A62-J-QUAD)
    HW encoding of MPEG-4, H.263 V2, H.264, MJPEG
    HW decoding of MPEG-2, VC1, MPEG-4 / XviD, H.263, H.264, DivX
    SBC-A62-J-SOLO and SBC-A62-J-LITE support up to 2 independent displays
    SBC-A62-J-PLUS and SBC-A62-J-QUAD support up to 3independent displays

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES 2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D, i.MX6DP and i.MX6Q)
    Enhanced 2D and 3D graphics with i.MX6DP
    Supports up to 3 independent displays with i.MX6D, i.MX6DPand i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Supports 2 independent displays

    Video Interfaces

    Single Channel 18-/24- bit LVDS connector + Touch Screen (I2C signals)
    24-bit Parallel RGB Connector

    1 x Dual Channel or 2 x Single Channel 18 / 24 bit LVDS interface
    HDMI interface 1.4

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4
    Video Input Port / Camera Connector

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface

    Video Resolution

    LVDS: up to 1366x768 @60Hz, 24bpp
    RGB: up to 1920x1080p @60Hz, 24bpp

    HDMI: up to 1920 x 1080p
    LVDS: up to 1920 x 1200

    LVDS, up to 1920x1200
    HDMI, up to 1080p

    LVDS, resolution up to 1920x1200
    HDMI, resolution up to 1080p

    Mass Storage

    16MB NOR Quad-SPI Flash soldered onboard µSD Card slot
    SYS-B08-FULL/D: 8GB eMMC soldered onboard

    4GB eMMC drive soldered onboard***
    microSD Card slot
    SBC-A62-J-PLUS and SBC-A62-J-QUAD: SATA connector

    *** For additional configurability please contact SECO

    On-board eMMC drive, up to 32 GB
    SD / MMC / SDIO interface
    1 x μSD Card Slot on-board
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

    On-board eMMC drive, up to 8 GB
    SD / MMC / SDIO interface
    Internal SPI Flash for booting

    Networking

    SYS-B08-BASIC/D:1x Fast Ethernet RJ-45 connector
    SYS-B08-FULL/D: 2x Fast Ethernet RJ-45 connector + WiFi (802.11 b/g/n) +BT LE combo module + antenna onboard

    Gigabit Ethernet connector
    Internal USB connector for Wi-Fi Module

    Gigabit Ethernet interface
    Fast Ethernet (10/100) interface
    USB
    1 x USB 2.0 OTG port
    3 x USB 2.0 Host ports on standard Type-A socket
    1 x USB 2.0 Host port on internal pin header
    2 x USB 2.0 Type-A ports and 1 x USB 2.0 internal connector
    USB micro-B Client port

    1 x USB OTG interface
    4 x USB 2.0 Host interfaces

    1 x USB OTG interface
    1 x USB 2.0 Host interface

    PCI-e
    ...
    ...
    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    Audio
    I2S Audio interface on programmable pin header
    S / PDIF interface (In and Out) on programmable pin header

    SBC-A62-J-LITE, SBC-A62-J-PLUS and SBC-A62-J-QUAD:
    AC’97 Audio Codec Realtek ALC655 with Mic-In, Line-Out audio Jacks

    AC'97 Audio Interface
    I2S
    I2S / AC’97 Audio Interface
    Serial Ports

    1 x CAN Port reconfigurable as GPIO
    2x RS-232 (Tx/RX signals only) + 1x RS-485 serial ports on expansion pin header

    Debug UART interface, TTL voltage level.
    SBC-A62-J-LITE, SBC-A62-J-PLUS and SBC-A62-J-QUAD: dedicated CAN Bus connector (Transceiver CAN 3.3V)
    Other serial interfaces on the expansion connector:
    SBC-A62-J-SOLO: 1 x Serial (TTL level) - 2 x Serial (RS-232) -2 x CAN (TTL level);
    SBC-A62-J-LITE: 1 x Serial (TTL level) - 2 x Serial (RS-232) - 1 x CAN (TTL level);
    SBC-A62-J-PLUS and SBC-A62-J-QUAD: 1 x Serial (RS-485) - 2 x Serial (RS-232) - 1 x CAN (TTL level)

    2 x serial ports (TTL interface)
    CAN port interface

    ...
    Other Interfaces

    2 x I2C dedicated connectors (one reserved for Touch Screen)
    6 analog inputs for A/D Conversion
    Programmable (*) expansion pin header connector, able to offer:
    • CSI interface input (PAL and NTSC formats supported)
    • Up to 20 GPIO
    • SPI interface
    • SPDIF Audio interface
    • I2S Audio interface
    • CAN interface (TTL level)
    • 5 x PWM
    • 3 x I2C
    • 3 x serial ports (2x RS-232 +1xRS-485 interface)
    Embedded Low Power RTC
    (*) Please note that some of these interfaces are factory options, other configurations are made via SW using the pin multiplexing possibilities of the i.MX6SX processor.

    Optional 9-Axis Motion Sensors (Accelerometer, Magnetometer and Digital Gyroscope)

    Dedicated connector (I2C, GPIO signals) for external Touch Screen controller; MIPI-CSI Camera connector;
    Configurable* expansion connector with: Up to 28 GPIO - SPI interface - SPDIF Audio interface - CAN interface (TTL level) - SDIO interface - 3 x PWM - I2C - UARTs

    * Please note that some of these interfaces are factory options, other configurations are made via SW.

    I2C Bus
    LPC Bus
    SM Bus
    Power Management Signals

    On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
    - Additional SD interface
    - Up to 4 UARTs
    - CAN interface
    - Watchdog(s)
    - I2C interfaces
    - PWM outputs
    - SPI interface
    - Additional Audio interface

    (*) not all the combinations are allowed simultaneously Power Management Signals

    Power Supply

    +12VDC nominal voltage
    +3VDC cabled Coin Cell Battery

    +12VDC; Additional embedded Low Power RTC;
    SBC-A62-J-SOLO and SBC-A62-J-LITE: internal i.MX6 Real Time Clock (external battery required for time/date retention, not included)
    SBC-A62-J-PLUS and SBC-A62-J-QUAD: low power Real TimeClock with onboard battery

    +5VDC ± 5%

    +5VDC ± 5%
    Optional Low Power RTC

    Power Consumption
    ...
    ...
    ...
    ...
    Operating System

    Android
    Linux

    - Free Android and Linux community BSP available at UDOO.org
    - SECO Android (under development) and Linux BSP / WEC7 on request. Please contact us
    - Yocto Guideline valid for SECO BSP

    Linux
    Yocto
    Microsoft® Windows Embedded Compact 7

    Linux
    Yocto

    Operating Temperature

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial temp.)**
    For industrial temp. (-40°C ÷ +85°C)** please contact us

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (Industrial temp.)* 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    89.5 x 87 mm (3.52” x 3.43”)
    110 x 86.5 mm (4.5” x 3.7”)
    70x70 mm (2.76” x 2.76”)
    40x70 mm (1.57” x 2.76”)

    Description

    Details

    SBC-B08 is a new-generation all-in-one low-cost computer designed by SECO, equipped with a NXP i.MX 6SoloX applications processor able to run Android or Linux. SBC-B08 is a revolutionary product in terms of connectivity, interactivity with the real world and cost: a new concept of single board computer ready for Internet of Things applications and for the Post-PC era.
    Additional Information

    Additional Information

    Processor
    NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz
    Max Cores
    1 + 1
    Memory

    Soldered on-board DDR3L memory, 32-bit interface
    SYS-B08-BASIC/D: 512MB
    SYS-B08-FULL/D: 1GB

    Graphics

    Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator
    OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1 supported

    Video Interfaces

    Single Channel 18-/24- bit LVDS connector + Touch Screen (I2C signals)
    24-bit Parallel RGB Connector

    Video Resolution

    LVDS: up to 1366x768 @60Hz, 24bpp
    RGB: up to 1920x1080p @60Hz, 24bpp

    Mass Storage

    16MB NOR Quad-SPI Flash soldered onboard µSD Card slot
    SYS-B08-FULL/D: 8GB eMMC soldered onboard

    Networking

    SYS-B08-BASIC/D:1x Fast Ethernet RJ-45 connector
    SYS-B08-FULL/D: 2x Fast Ethernet RJ-45 connector + WiFi (802.11 b/g/n) +BT LE combo module + antenna onboard

    USB
    1 x USB 2.0 OTG port
    3 x USB 2.0 Host ports on standard Type-A socket
    1 x USB 2.0 Host port on internal pin header
    Audio
    I2S Audio interface on programmable pin header
    S / PDIF interface (In and Out) on programmable pin header
    Serial Ports

    1 x CAN Port reconfigurable as GPIO
    2x RS-232 (Tx/RX signals only) + 1x RS-485 serial ports on expansion pin header

    Other Interfaces

    2 x I2C dedicated connectors (one reserved for Touch Screen)
    6 analog inputs for A/D Conversion
    Programmable (*) expansion pin header connector, able to offer:
    • CSI interface input (PAL and NTSC formats supported)
    • Up to 20 GPIO
    • SPI interface
    • SPDIF Audio interface
    • I2S Audio interface
    • CAN interface (TTL level)
    • 5 x PWM
    • 3 x I2C
    • 3 x serial ports (2x RS-232 +1xRS-485 interface)
    Embedded Low Power RTC
    (*) Please note that some of these interfaces are factory options, other configurations are made via SW using the pin multiplexing possibilities of the i.MX6SX processor.

    Optional 9-Axis Motion Sensors (Accelerometer, Magnetometer and Digital Gyroscope)

    Power Supply

    +12VDC nominal voltage
    +3VDC cabled Coin Cell Battery

    Operating System

    Android
    Linux

    Operating Temperature

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    89.5 x 87 mm (3.52” x 3.43”)
    Software

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    Documents

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    SBC-B08

    SBC-B08
    • EVALUATE OUR PRODUCTS

      Max. 3 pcs per part number
    • SAMPLING PRICE

      Shipping costs included
    • BUSINESS TO BUSINESS ONLY

      Technical support provided exclusively to businesses
    SBC with NXP i.MX 6SoloX Processor
    sku part number part number description part number configuration buy samples online contact us compare
    SYS-B08-I-FULL/D SBC - SBC-B08 Full version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 1GB RAM - 8GB eMMC - 2x FastETH - Wi-Fi/BLE - RTC LP - RS-485 - RS-232 - CAN - Ind. Temp. w/ Heatsink SBC - SBC-B08 Full version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 1GB RAM - 8GB eMMC - 2x FastETH - Wi-Fi/BLE - RTC LP - RS-485 - RS-232 - CAN - Ind. Temp. w/ Heatsink Add to Compare
    SYS-B08-I-BASIC/D SBC - SBC-B08 Basic version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 512MB RAM - 1x FastETH - RTC LP - RS-485 - RS-232 - CAN - Ind. Temp. w/Heatsink SBC - SBC-B08 Basic version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 512MB RAM - 1x FastETH - RTC LP - RS-485 - RS-232 - CAN - Ind. Temp. w/Heatsink Add to Compare
    SYS-B08-BASIC/D SBC - SBC-B08 Basic version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 512MB RAM - 1x FastETH - RTC LP - RS-485 - RS-232 - CAN - Comm. Temp. w/Heatsink SBC - SBC-B08 Basic version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 512MB RAM - 1x FastETH - RTC LP - RS-485 - RS-232 - CAN - Comm. Temp. w/Heatsink Add to Compare
    SYS-B08-FULL/D SBC - SBC-B08 Full version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 1GB RAM - 8GB eMMC - 2x FastETH - Wi-Fi/BLE - RTC LP - RS-485 - RS-232 - CAN - Comm. Temp. w/ Heatsink SBC - SBC-B08 Full version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 1GB RAM - 8GB eMMC - 2x FastETH - Wi-Fi/BLE - RTC LP - RS-485 - RS-232 - CAN - Comm. Temp. w/ Heatsink Add to Compare

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