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    Q7-C25

    Qseven® Rel. 2.1 compliant module with NXP i.MX 8M Applications Processors

    • NXP i.MX 8M Applications Processors

    • 1x USB 3.0; 4x USB2.0; 1x PCI-e x1; 1x CAN Bus; 2x UART; 8x GPI/Os
    • Integrated GPU, supports 2 independent displays

    • up to 4GB soldered down DDR4-2400 memory

    Available in Industrial Temperature Range

      Q7-C25

    Q7-C25

    Q7-928

    Q7-928

    μQ7-962

    μQ7-962

    μQ7-A75-J

    μQ7-A75-J

     
    Product Development Status
    Processor

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6DP DualPlus - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core
    NXP i.MX 6 Family, based on ARM® CORTEX® -A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors

    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core

    Chipset
    ...
    ...
    ...
    ...
    Max Cores
    0
    4
    4
    2
    Max Thread
    0
    0
    0
    ...
    Memory

    soldered down DDR4-2400 memory, 32-bit interface, up to 4GB

    Up to 4GB DDR3L on-board (up to 2GB with i.MX6S)
    up to 2GB DDR3L on-board (up to 1GB with i.MX6S)

    Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F

    Graphics

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC,H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG (not for i.MX8M QuadLite).
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 2.x, DirectX 11

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES 2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D, i.MX6DP and i.MX6Q)
    Enhanced 2D and 3D graphics with i.MX6DP
    Supports up to 3 independent displays with i.MX6D, i.MX6DPand i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D and i.MX6Q)
    Supports up to 3 independent displays with i.MX6D and i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Supports 2 independent displays

    Video Interfaces

    HDMI 2.0a / Display Port 1.3 interface, supporting HDCP 2.2 and HDCP 1.4/1.3
    eDP interface or 18- / 24-bit Dual Channel LVDS interface

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4
    Video Input Port / Camera Connector

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface

    Video Resolution
    HDMI/DP: Up to 4096 x 2160p60
    LVDS/eDP: Up to 1920 x 1080 @ 60Hz

    LVDS, up to 1920x1200
    HDMI, up to 1080p

    HDMI, up to 1080p
    LVDS, up to 1920x1200

    LVDS, resolution up to 1920x1200
    HDMI, resolution up to 1080p

    Mass Storage

    eMMC 5.0 drive soldered on-board, up to 64GB
    Optional microSD slot on board
    QSPI Flash soldered-onboard

    On-board eMMC drive, up to 32 GB
    SD / MMC / SDIO interface
    1 x μSD Card Slot on-board
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

    Up to 8 GB eMMC drive soldered onboard
    SD / MMC / SDIO interface
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

    On-board eMMC drive, up to 8 GB
    SD / MMC / SDIO interface
    Internal SPI Flash for booting

    Networking

    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard

    Gigabit Ethernet interface
    Gigabit Ethernet interface
    Fast Ethernet (10/100) interface
    USB

    1 x USB 3.0 OTG Ports
    Up to 4 x USB 2.0 Host Ports

    1 x USB OTG interface
    4 x USB 2.0 Host interfaces

    1 x USB OTG interface
    4 x USB 2.0 Host interfaces

    1 x USB OTG interface
    1 x USB 2.0 Host interface

    PCI-e

    1x PCI-e x1 port, optional

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    Audio

    I2S Audio Interface

    AC'97 Audio Interface
    I2S
    I2S / AC’97 Audio Interface
    I2S / AC’97 Audio Interface
    Serial Ports

    1x UART Tx/Rx/RTS/CTS (Optional)
    1x Debug UART
    Optional CAN Bus interface (TTL Level)

    2 x serial ports (TTL interface)
    CAN port interface

    2 x Serial ports (TTL interface)
    CAN port interface
    ...
    Other Interfaces

    I2C Bus
    SM Bus
    Optional SPI interface
    8 x GPI/Os
    UltraLow Power RTC
    Power Management Signals
    Watchdog

    I2C Bus
    LPC Bus
    SM Bus
    Power Management Signals

    I2C Bus
    SM Bus
    Power Management Signals

    On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
    - Additional SD interface
    - Up to 4 UARTs
    - CAN interface
    - Watchdog(s)
    - I2C interfaces
    - PWM outputs
    - SPI interface
    - Additional Audio interface

    (*) not all the combinations are allowed simultaneously Power Management Signals

    Power Supply

    +5VDC ±5% and +5VSB (optional)
    +3.3V_RTC

    +5VDC ± 5%

    +5VDC ± 5%

    +5VDC ± 5%
    Optional Low Power RTC

    Power Consumption
    ...
    ...
    ...
    ...
    Operating System

    Linux
    Android

    Linux
    Yocto
    Microsoft® Windows Embedded Compact 7

    Linux
    Yocto

    Linux
    Yocto

    Operating Temperature

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version, without WiF+BT optional module)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (Industrial temp.)* 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    70x70 mm (2.76” x 2.76”)
    40x70 mm (μQseven, 1.57” x 2.76”)
    40x70 mm (1.57” x 2.76”)
    Security
    N/A
    N/A
    N/A
    N/A
    BIOS
    N/A
    N/A
    N/A
    N/A
    Embedded Controller Functionalities
    N/A
    N/A
    N/A
    N/A

    Description

    Details

    The Q7-C25 is a Qseven® Rel. 2.1 compliant module based on the NXP i.MX 8M Applications Processors with multicore processing: Dual or Quad ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor for realtime applications and 4Kp60 HEVC decoding with HDR. Q7-C25 is a scalable solution for applications like domotics or vending, requiring advanced security, connectivity and multimedia.

    Additional Information

    Additional Information

    Processor

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    Memory

    soldered down DDR4-2400 memory, 32-bit interface, up to 4GB

    Graphics

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC,H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG (not for i.MX8M QuadLite).
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 2.x, DirectX 11

    Video Interfaces

    HDMI 2.0a / Display Port 1.3 interface, supporting HDCP 2.2 and HDCP 1.4/1.3
    eDP interface or 18- / 24-bit Dual Channel LVDS interface

    Video Resolution
    HDMI/DP: Up to 4096 x 2160p60
    LVDS/eDP: Up to 1920 x 1080 @ 60Hz
    Mass Storage

    eMMC 5.0 drive soldered on-board, up to 64GB
    Optional microSD slot on board
    QSPI Flash soldered-onboard

    Networking

    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard

    USB

    1 x USB 3.0 OTG Ports
    Up to 4 x USB 2.0 Host Ports

    PCI-e

    1x PCI-e x1 port, optional

    Audio

    I2S Audio Interface

    Serial Ports

    1x UART Tx/Rx/RTS/CTS (Optional)
    1x Debug UART
    Optional CAN Bus interface (TTL Level)

    Other Interfaces

    I2C Bus
    SM Bus
    Optional SPI interface
    8 x GPI/Os
    UltraLow Power RTC
    Power Management Signals
    Watchdog

    Power Supply

    +5VDC ±5% and +5VSB (optional)
    +3.3V_RTC

    Operating System

    Linux
    Android

    Operating Temperature

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version, without WiF+BT optional module)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    Software

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    Documents

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    Q7-C25

    Q7-C25
    • EVALUATE OUR PRODUCTS

      Max. 3 pcs per part number
    • SAMPLING PRICE

      Shipping costs included
    • BUSINESS TO BUSINESS ONLY

      Technical support provided exclusively to businesses

    Orders placed between August 3dr and August 21st 2019 will be shipped from August 23rd 2019

    Qseven® Rel. 2.1 compliant module with the NXP i.MX 8M Applications Processors
    sku part number part number description part number configuration buy samples online contact us compare
    QC25-0000-2200-C0 Qseven with NXP i.MX 8M Q7-C25 Qseven - NXP i.MX 8M, LVDS Add to Compare

    • Building Automation/Domotics
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    • Industrial Automation
    • Infotainment/Vending
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