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    Q7-C25

    Qseven® Rel. 2.1 compliant module with NXP i.MX 8M Applications Processors

    • NXP i.MX 8M Applications Processors

    • 1x USB 3.0; 4x USB2.0; 1x PCI-e x1; 1x CAN Bus; 2x UART; 8x GPI/Os
    • Integrated GPU, supports 2 independent displays

    • up to 4GB soldered down DDR4-2400 memory

    Available in Industrial Temperature Range

      Q7-C25

    Q7-C25

    μQ7-A76-J

    μQ7-A76-J

    SBC-A62-J

    SBC-A62-J

    μQ7-A75-J

    μQ7-A75-J

     
    Product Development Status
    Processor

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP
    Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP
    Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP

    NXP i.MX 6 Family, based on ARM Cortex-A9 processors:
    SBC-A62-J-SOLO: Single Core (i.MX6S) @1GHz
    SBC-A62-J-LITE: Dual Core Lite (i.MX6DL) @1GHz
    SBC-A62-J-PLUS: Dual Core Plus (i.MX6DP) @1GHz
    SBC-A62-J-QUAD: Quad Core (i.MX6Q) @1GHz

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors

    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core

    Chipset
    ...
    ...
    ...
    ...
    Max Cores
    0
    2
    4
    2
    Max Thread
    0
    2
    0
    ...
    Memory

    soldered down DDR4-2400 memory, 32-bit interface, up to 4GB

    Soldered onboard DDR3L memory
    E3825, E3815:  up to 4GB Single-Channel DDR3L @ 1066MHz
    N2807: up to 4GB Single-Channel DDR3L @ 1333MHz

    Soldered on-board DDR3L memory***:
    SBC-A62-J-SOLO: 512MB 32-bit interface
    SBC-A62-J-LITE: 1GB 64-bit interface
    SBC-A62-J-PLUS: 2GB 64-bit interface
    SBC-A62-J-QUAD: 1GB 64-bit interface

    *** For additional configurability please contact SECO

    Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F

    Graphics

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC,H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG (not for i.MX8M QuadLite).
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 2.x, DirectX 11

    Integrated Intel® HD Graphics 4000 Series controller
    Dual independent display support
    HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats
    HW encoding of H.264, MPEG2 and MVC formats

    Integrated Graphics, with up to 3 separate HW accelerators for 2D, OpenGL® ES2.0 3D
    OpenVG™ accelerator (only SBC-A62-J-PLUS and SBC-A62-J-QUAD)
    HW encoding of MPEG-4, H.263 V2, H.264, MJPEG
    HW decoding of MPEG-2, VC1, MPEG-4 / XviD, H.263, H.264, DivX
    SBC-A62-J-SOLO and SBC-A62-J-LITE support up to 2 independent displays
    SBC-A62-J-PLUS and SBC-A62-J-QUAD support up to 3independent displays

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Supports 2 independent displays

    Video Interfaces

    HDMI 2.0a / Display Port 1.3 interface, supporting HDCP 2.2 and HDCP 1.4/1.3
    eDP interface or 18- / 24-bit Dual Channel LVDS interface

    Multimode Display Port (DP++) interface
    18 / 24 bit Dual Channel LVDS interface

    1 x Dual Channel or 2 x Single Channel 18 / 24 bit LVDS interface
    HDMI interface 1.4

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface

    Video Resolution
    HDMI/DP: Up to 4096 x 2160p60
    LVDS/eDP: Up to 1920 x 1080 @ 60Hz
    DP++ (HDMI compatible) Up to 2560x1600@60Hz
    LVDS interface Up to 1920x1200@60Hz

    HDMI: up to 1920 x 1080p
    LVDS: up to 1920 x 1200

    LVDS, resolution up to 1920x1200
    HDMI, resolution up to 1080p

    Mass Storage

    eMMC 5.0 drive soldered on-board, up to 64GB
    Optional microSD slot on board
    QSPI Flash soldered-onboard

    2 x external S-ATA channels
    SD interface
    Optional eMMC drive soldered onboard

    4GB eMMC drive soldered onboard***
    microSD Card slot
    SBC-A62-J-PLUS and SBC-A62-J-QUAD: SATA connector

    *** For additional configurability please contact SECO

    On-board eMMC drive, up to 8 GB
    SD / MMC / SDIO interface
    Internal SPI Flash for booting

    Networking

    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard

    Gigabit Ethernet interface

    Gigabit Ethernet connector
    Internal USB connector for Wi-Fi Module

    Fast Ethernet (10/100) interface
    USB

    1 x USB 3.0 OTG Ports
    Up to 4 x USB 2.0 Host Ports

    1 x USB 3.0 Host port
    4 x USB 2.0 Host ports (one shared with USB 3.0 interface)
    2 x USB 2.0 Type-A ports and 1 x USB 2.0 internal connector
    USB micro-B Client port

    1 x USB OTG interface
    1 x USB 2.0 Host interface

    PCI-e

    1x PCI-e x1 port, optional

    3 x PCI-e x1 lanes (Gen2)
    ...

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    Audio

    I2S Audio Interface

    HD Audio Interface

    SBC-A62-J-LITE, SBC-A62-J-PLUS and SBC-A62-J-QUAD:
    AC’97 Audio Codec Realtek ALC655 with Mic-In, Line-Out audio Jacks

    I2S / AC’97 Audio Interface
    Serial Ports

    1x UART Tx/Rx/RTS/CTS (Optional)
    1x Debug UART
    Optional CAN Bus interface (TTL Level)

    1 x Serial Port (TTL interface, Tx/Rx only)

    Debug UART interface, TTL voltage level.
    SBC-A62-J-LITE, SBC-A62-J-PLUS and SBC-A62-J-QUAD: dedicated CAN Bus connector (Transceiver CAN 3.3V)
    Other serial interfaces on the expansion connector:
    SBC-A62-J-SOLO: 1 x Serial (TTL level) - 2 x Serial (RS-232) -2 x CAN (TTL level);
    SBC-A62-J-LITE: 1 x Serial (TTL level) - 2 x Serial (RS-232) - 1 x CAN (TTL level);
    SBC-A62-J-PLUS and SBC-A62-J-QUAD: 1 x Serial (RS-485) - 2 x Serial (RS-232) - 1 x CAN (TTL level)

    ...
    Other Interfaces

    I2C Bus
    SM Bus
    Optional SPI interface
    8 x GPI/Os
    UltraLow Power RTC
    Power Management Signals
    Watchdog

    I2C bus
    LPC Bus
    SM Bus
    Thermal / FAN Management
    PWR Management signals

    Dedicated connector (I2C, GPIO signals) for external Touch Screen controller; MIPI-CSI Camera connector;
    Configurable* expansion connector with: Up to 28 GPIO - SPI interface - SPDIF Audio interface - CAN interface (TTL level) - SDIO interface - 3 x PWM - I2C - UARTs

    * Please note that some of these interfaces are factory options, other configurations are made via SW.

    On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
    - Additional SD interface
    - Up to 4 UARTs
    - CAN interface
    - Watchdog(s)
    - I2C interfaces
    - PWM outputs
    - SPI interface
    - Additional Audio interface

    (*) not all the combinations are allowed simultaneously Power Management Signals

    Power Supply

    +5VDC ±5% and +5VSB (optional)
    +3.3V_RTC

    +5VDC ± 5%

    +12VDC; Additional embedded Low Power RTC;
    SBC-A62-J-SOLO and SBC-A62-J-LITE: internal i.MX6 Real Time Clock (external battery required for time/date retention, not included)
    SBC-A62-J-PLUS and SBC-A62-J-QUAD: low power Real TimeClock with onboard battery

    +5VDC ± 5%
    Optional Low Power RTC

    Power Consumption
    ...
    ...
    ...
    ...
    Operating System

    Linux
    Android

    Microsoft® Windows 7
    Microsoft® Windows 8.1
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7
    Microsoft® Windows Embedded Standard 8
    Microsoft® Windows Embedded Compact 7
    Linux
    Yocto

    - Free Android and Linux community BSP available at UDOO.org
    - SECO Android (under development) and Linux BSP / WEC7 on request. Please contact us
    - Yocto Guideline valid for SECO BSP

    Linux
    Yocto

    Operating Temperature

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version, without WiF+BT optional module)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial temp.)**
    For industrial temp. (-40°C ÷ +85°C)** please contact us

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (Industrial temp.)* 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    40 x 70 mm (1.57 x 2.76)
    110 x 86.5 mm (4.5” x 3.7”)
    40x70 mm (1.57” x 2.76”)
    Security
    N/A
    N/A
    ...
    N/A
    BIOS
    N/A
    N/A
    ...
    N/A
    Embedded Controller Functionalities
    N/A
    N/A
    ...
    N/A

    Description

    Details

    The Q7-C25 is a Qseven® Rel. 2.1 compliant module based on the NXP i.MX 8M Applications Processors with multicore processing: Dual or Quad ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor for realtime applications and 4Kp60 HEVC decoding with HDR. Q7-C25 is a scalable solution for applications like domotics or vending, requiring advanced security, connectivity and multimedia.

    Additional Information

    Additional Information

    Processor

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    Memory

    soldered down DDR4-2400 memory, 32-bit interface, up to 4GB

    Graphics

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC,H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG (not for i.MX8M QuadLite).
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 2.x, DirectX 11

    Video Interfaces

    HDMI 2.0a / Display Port 1.3 interface, supporting HDCP 2.2 and HDCP 1.4/1.3
    eDP interface or 18- / 24-bit Dual Channel LVDS interface

    Video Resolution
    HDMI/DP: Up to 4096 x 2160p60
    LVDS/eDP: Up to 1920 x 1080 @ 60Hz
    Mass Storage

    eMMC 5.0 drive soldered on-board, up to 64GB
    Optional microSD slot on board
    QSPI Flash soldered-onboard

    Networking

    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard

    USB

    1 x USB 3.0 OTG Ports
    Up to 4 x USB 2.0 Host Ports

    PCI-e

    1x PCI-e x1 port, optional

    Audio

    I2S Audio Interface

    Serial Ports

    1x UART Tx/Rx/RTS/CTS (Optional)
    1x Debug UART
    Optional CAN Bus interface (TTL Level)

    Other Interfaces

    I2C Bus
    SM Bus
    Optional SPI interface
    8 x GPI/Os
    UltraLow Power RTC
    Power Management Signals
    Watchdog

    Power Supply

    +5VDC ±5% and +5VSB (optional)
    +3.3V_RTC

    Operating System

    Linux
    Android

    Operating Temperature

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version, without WiF+BT optional module)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    Software

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    Documents

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    Q7-C25

    Q7-C25
    • EVALUATE OUR PRODUCTS

      Max. 3 pcs per part number
    • SAMPLING PRICE

      Shipping costs included
    • BUSINESS TO BUSINESS ONLY

      Technical support provided exclusively to businesses
    Qseven® Rel. 2.1 compliant module with the NXP i.MX 8M Applications Processors
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    QC25-0000-2200-C0 Qseven with NXP i.MX 8M Q7-C25 Qseven - NXP i.MX 8M, LVDS Add to Compare

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    • Industrial Automation
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