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    Q7-B03

    Qseven® Rel. 2.1 compliant module with the Intel® Atom X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors

    • Intel® Atom X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series
    • 2x USB 3.0; 4x PCI-e; 6x USB 2.0
    • Integrated Gen9-LP Graphics controller
    • up to 8GB Dual-Channel DDR3L-1866
    Available in Industrial Temperature Range

      Q7-B03

    Q7-B03

    COMe-A41-CT6

    COMe-A41-CT6

    SM-B69

    SM-B69

    SBC-B68-eNUC

    SBC-B68-eNUC

     
    Product Development Status
    Processor

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    Intel® Atom™ E3845, Quad Core @ 1.91GHz, 2MB Cache, 10W TDP
    Intel® Atom™ E3827, Dual Core @ 1.75GHz, 1MB Cache, 8W TDP
    Intel® Atom™ E3826, Dual Core @ 1.46GHz, 1MB Cache, 7W TDP
    Intel® Atom™ E3825, Dual Core @ 1.33GHz, 1MB Cache, 6W TDP
    Intel® Atom™ E3815, Single Core @ 1.46GHz, 512KB Cache, 5W TDP
    Intel® Celeron® J1900, Quad Core @ 2.0GHz, 2MB Cache, 10W TDP
    Intel® Celeron® N2930, Quad Core @ 1.83GHz, 2MB Cache, 7.5W TDP

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    Chipset
    ...
    ...
    ...
    ...
    Max Cores
    4
    4
    4
    4
    Max Thread
    4
    ...
    ...
    4
    Memory
    Dual Channel Soldered Down DDR3L-1866 memory, up to 8GB

    DDR3L non-ECC SO-DIMM slots, 4GB modules supported per each slot
    E3845, E3827, J1900, N2930: up to 8GB Dual-Channel DDR3L 1333MHz
    E3826: up to 8GB Dual-Channel DDR3L 1066MHz
    N2807: up to 4GB Single-Channel DDR3L 1333MHz
    E3825, E3815: up to 4GB Single-Channel DDR3L 1066MHz

    Dual Channel Soldered Down LPDDR4-2400 memory, up to 8GB
    Quad Channel soldered down LPDDR4 memory, up to 8GB
    Graphics
    Integrated Gen9-LP Graphics controller, with 18 Execution Units
    4K HW decoding and encoding of HEVC(H.265), H.264, VP8,
    SVC, MVC

    Integrated Intel® HD Graphics 4000 series controller Dual independent display support
    HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats
    HW encoding of H.264, MPEG2 and MVC formats



    Up to 3 independent displays
    Integrated Gen9-LP HD Graphics controller, with 18 Execution Units
    4K HW decoding and encoding of HEVC(H.265), H.264, VP8, SVC, MVC

    Integrated Intel® HD Graphics 500 series controller, with up to 18 Execution Units
    4K HW decoding and encoding of HEVC(H.265), H.264, VP8, VP9, MVC
    Three independent display support

    Video Interfaces
    eDP interface or Single/Dual Channel 18/24bit LVDS interface
    through eDP-to-LVDS bridge
    HDMI or DP++ interface

    1 x Digital Display Interface (DDI) able to drive HDMI / DVI / DP++ interface
    Additional DDI, can be switched to manage embedded
    Display Port or 18 / 24 bit single / dual channel LVDS interface CRT interface

    eDP + MIPI-DSI interfaces or Dual Channel 18/24bit LVDS interface through eDP-to-LVDS bridge
    HDMI or DP++ interface
    DP++ interface
    2 x CSI interfaces

    Two DP++ 1.2 interfaces on miniDP connectors
    (supports HDMI displays through external adapter)
    embedded Display Port (eDP) internal connector
    LVDS through optional external adapter

    Video Resolution
    DP Up to 4096 x 2160 @60HZ
    eDP     Up to 3840 x 2160 @60Hz
    HDMI Up to 3840 x 2160 @30Hz
    LVDS, VGA Up to 1920 x 1200 @ 60Hz

    CRT Interface: Up to 2560x1600@60Hz
    HDMI: Up to 1920x1080p@60Hz 
    Display Port, eDP: Up to 2560x1600@60Hz 
    Optional LVDS interface: Up to 1920x1200@60Hz

    DP++ Up to 4096 x 2160
    eDP     Up to 3840 x 2160 (4K)
    HDMI Up to 3840 x 2160 (4K)
    LMIPI-DSI, LVDS Up to 1920 x 1200
    DP Up to 4096 x 2160 @60HZ
    eDP     Up to 3840 x 2160 @60Hz
    HDMI Up to 3840 x 2160 @30Hz
    LVDS Up to 1920 x 1200 @ 60Hz
    Mass Storage

    Optional eMMC drive soldered onboard
    2 x external S-ATA Gen3 Channel
    SD interface

    Optional eMMC drive soldered on board
    2 x external SATA channels
    SD Card interface (multiplexed with GPIO signals)

    1 x external S-ATA Gen3 Channel
    SD interface
    Optional eMMC 5.0 drive soldered on-board

    Optional eMMC drive onboard
    M.2 SATA SSD slot (Socket 2 Key B Type 3042/2260 **)
    microSD Card slot
    SATA 7p M connector

    ** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.

    Networking
    Gigabit Ethernet interface
    Intel® I210 or I211 Controller (MAC + PHY)
    Optional Gigabit Ethernet interface (uses one PCI-e lane)

    Up to 2 x Gigabit Ethernet interfaces
    Intel® I210 or I211 Controller (MAC + PHY)

    2x Gbit LAN / Intel Gigabit Ethernet i21x family controller
    M.2 WWAN Slot for Modems (Socket 2 Key B Type 3042/2260 **)
    M.2 WLAN Connectivity Slot for WiFi/BT (Socket 1 Key E type 2230)

    ** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.

    USB
    6 x USB 2.0 Host Ports
    2 x USB 3.0 Host Ports (*)

    (*) Second USB 3.0 Host port can be exploited only using
    Qseven® Rel. 2.1 compliant Carrier boards
    7 x USB 2.0 Host ports
    4 x USB 3.0 Host ports
    6 x USB 2.0 Host Ports
    2 x USB 3.0 Host Ports
    2 x USB 3.0 Host ports on USB 3.0 Type-A sockets
    2 x USB 2.0 Host ports on USB 2.0 Type-A sockets
    2 x USB 2.0 Host ports on internal pin header
    1 x USB 3.0 Host port on SSD/WWAN M.2 slot
    1 x USB 2.0 Host port on WLAN M.2 Slot
    PCI-e
    4 x PCI-e Root Ports (including the PCI-e port used for Gigabit
    Ethernet controller)
    Up to 4 x PCI-e x1 Gen2 lanes
    4 x PCI-e Root Ports
    1 x PCI-e x2 port on M.2 SSD/WWAN Slot
    1 x PCI-e x1 port on WLAN M.2 Slot
    Audio
    HD Audio interface
    HD Audio Interface
    HD Audio interface
    I2S Audio interface
    HD Audio codec / Cirrus Logic CS4207
    Mic In and Line Out Audio jacks
    Amplified Speaker output on internal pin header
    Serial Ports
    1 x UART, TTL interface
    2 x Serial port (TX/RX only, TTL interface)

    2 x HS-UARTs
    2 x UARTs

    2 x RS-232/RS-422/RS-485 UARTS software configurable, oninternal Pin Header
    Other Interfaces
    I2C Bus
    LPC Bus
    SM Bus
    SPI interface
    Watch Dog Timer
    Thermal / FAN management
    Power Management Signals

    2 x Express Card interfaces
    I2C bus
    LPC Bus
    SM Bus
    4 x GPI, 4 x GPO
    Thermal / FAN management
    WatchDog timer
    Power management signals

    Up to 12x GPIOs
    I2C Bus
    SM Bus
    2x SPI interfaces
    LPC Bus
    FAN management
    Power Management Signals

    2 x I2C + 8 x GPI/Os on Feature connector
    Button / LED front panel header
    CIR (Consumer InfraRed) sensor
    microSIM slot for M.2 WWAN Modem
    Optional TPM 2.0 on-board

    Power Supply
    +5VDC and +5VSB (optional)
    +12VDC ± 10% and + 5VSB (optional)
    +5VDC and +3.3V_RTC
    +18VDC ÷ +32VDC recommended
    +15VDC ÷ +36VDC absolute
    RTC Battery
    Power Consumption
    ...
    ...
    ...
    ...
    Operating System

    Microsoft® Windows 10 Enterprise (64bit)
    Microsoft® Windows 10 IoT Core
    Wind River Linux 64 bit
    Yocto (64 bit)
    Android (planning)

    Microsoft® Windows 7 (32/64 bit)
    Microsoft® Windows 8.1 (32/64 bit)
    Microsoft® Windows 10 (32/64 bit)
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7 (32/64 bit)
    Microsoft® Windows Embedded Standard 8 (32/64 bit)
    Microsoft® Windows Embedded Compact 7
    Linux (32/64 bit)
    Yocto

    Microsoft® Windows 10 Enterprise (64 bit)
    Microsoft® Windows 10 IoT Core
    Linux
    Yocto
    Android

    Microsoft® Windows 10 Enterprise (64 bit)
    Microsoft® Windows 10 IoT Core
    Wind River Linux 64 bit
    Yocto (64 bit)
    Android (planning)

    Operating Temperature

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial version)
    -40°C ÷ +85°C (Industrial version) 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    95 x 95 mm (3.74” x 3.74”)
    50 x 82 mm (1.97” x 3.23”)
    101.6 x 101.6 mm (4” x 4”)

    Description

    Details

    The Q7-B03 is a Qseven® Rel. 2.1 compliant module based on the Intel® Atom X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly code name Apollo Lake) Processors. This solution is able to merge its high graphics performance (4K HW Video both decoding and encoding) and extreme temperature with excellent power efficiency. Also featuring wide connectivity capability and support for the most popular operating systems, the Q7-B03 is particularly suitable for low power embedded applications.

    Additional Information

    Additional Information

    Processor

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    Max Cores
    4
    Max Thread
    4
    Memory
    Dual Channel Soldered Down DDR3L-1866 memory, up to 8GB
    Graphics
    Integrated Gen9-LP Graphics controller, with 18 Execution Units
    4K HW decoding and encoding of HEVC(H.265), H.264, VP8,
    SVC, MVC
    Video Interfaces
    eDP interface or Single/Dual Channel 18/24bit LVDS interface
    through eDP-to-LVDS bridge
    HDMI or DP++ interface
    Video Resolution
    DP Up to 4096 x 2160 @60HZ
    eDP     Up to 3840 x 2160 @60Hz
    HDMI Up to 3840 x 2160 @30Hz
    LVDS, VGA Up to 1920 x 1200 @ 60Hz
    Mass Storage

    Optional eMMC drive soldered onboard
    2 x external S-ATA Gen3 Channel
    SD interface

    Networking
    Gigabit Ethernet interface
    Intel® I210 or I211 Controller (MAC + PHY)
    USB
    6 x USB 2.0 Host Ports
    2 x USB 3.0 Host Ports (*)

    (*) Second USB 3.0 Host port can be exploited only using
    Qseven® Rel. 2.1 compliant Carrier boards
    PCI-e
    4 x PCI-e Root Ports (including the PCI-e port used for Gigabit
    Ethernet controller)
    Audio
    HD Audio interface
    Serial Ports
    1 x UART, TTL interface
    Other Interfaces
    I2C Bus
    LPC Bus
    SM Bus
    SPI interface
    Watch Dog Timer
    Thermal / FAN management
    Power Management Signals
    Power Supply
    +5VDC and +5VSB (optional)
    Operating System

    Microsoft® Windows 10 Enterprise (64bit)
    Microsoft® Windows 10 IoT Core
    Wind River Linux 64 bit
    Yocto (64 bit)
    Android (planning)

    Operating Temperature

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    Software
    EAPI
    • [Embedded application programming interface] - Release version 1.20.15*
    BIOS
    • [Bios] - Release version 1.06*
    Windows 10
    • [DRIVER PACKAGE] - Release version 03*
    Linux
    • [I/O tools - Linux] - Using I2C and SPI bus in Linux *
    Linux-YOCTO
    • [BSP] - Yocto Pyro*
    • [Images] - Sample images (sato and minimal) (pyro 64bit)*

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Documents

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    Q7-B03

    Q7-B03
    • EVALUATE OUR PRODUCTS

      Max. 3 pcs per part number
    • SAMPLING PRICE

      Shipping costs included
    • BUSINESS TO BUSINESS ONLY

      Technical support provided exclusively to businesses
    Qseven® Rel. 2.1 compliant module with the Intel® Atom X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
    sku part number part number description part number configuration buy samples online contact us compare
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