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    Q7-974

    Qseven® Rel. 2.0 Compliant Module with the Intel® Atom™ E3800 and Celeron® families (formerly Bay Trail)

    • Intel® Atom™ E3800 and Celeron® families of System-on-Chip
    • 6x USB 2.0; 1x USB 3.0; 3x PCI-e x1
    • Integrated Intel® HD Graphics controller
    • up to 8GB Dual-Channel DDR3L 1333MHz
    Available in Industrial Temperature Range

      Q7-974

    Q7-974

    SBC-B68-eNUC

    SBC-B68-eNUC

    SM-B69

    SM-B69

    Q7-928

    Q7-928

     
    Product Development Status
    Processor
    Intel® Atom™ E3845, Quad Core @1.91GHz, 2MB Cache, 10W TDP
    Intel® Atom™ E3827, Dual Core @1.75GHz, 1MB Cache, 8W TDP
    Intel® Atom™ E3826, Dual Core @1.46GHz, 1MB Cache, 7W TDP
    Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP
    Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP
    Intel® Celeron® J1900, Quad Core @2.0GHz, 2MB Cache, 10W TDP
    Intel® Celeron® N2930, Quad Core @1.83GHz, 2MB Cache, 7.5W TDP
    Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6DP DualPlus - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core
    Chipset
    ...
    ...
    ...
    ...
    Max Cores
    4
    4
    4
    4
    Max Thread
    4
    4
    ...
    0
    Memory

    Soldered on-board DDR3L memory
    E3845, E3827, J1900, N2930: up to 8GB Dual-Channel DDR3L @ 1333MHz
    E3826: up to 8GB Dual-Channel DDR3L @ 1066MHz
    N2807: up to 4GB Single-Channel DDR3L @ 1333MHz
    E3825, E3815: up to 4GB Single-Channel DDR3L @ 1066MHz

    Quad Channel soldered down LPDDR4 memory, up to 8GB
    Dual Channel Soldered Down LPDDR4-2400 memory, up to 8GB
    Up to 4GB DDR3L on-board (up to 2GB with i.MX6S)
    Graphics

    Integrated Intel® HD Graphics 4000 Series controller
    Dual independent display support
    HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats
    HW encoding of H.264, MPEG2 and MVC formats

    Integrated Intel® HD Graphics 500 series controller, with up to 18 Execution Units
    4K HW decoding and encoding of HEVC(H.265), H.264, VP8, VP9, MVC
    Three independent display support

    Up to 3 independent displays
    Integrated Gen9-LP HD Graphics controller, with 18 Execution Units
    4K HW decoding and encoding of HEVC(H.265), H.264, VP8, SVC, MVC

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES 2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D, i.MX6DP and i.MX6Q)
    Enhanced 2D and 3D graphics with i.MX6DP
    Supports up to 3 independent displays with i.MX6D, i.MX6DPand i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S

    Video Interfaces
    HDMI or Multimode Display Port interface (factory options)
    Embedded Display Port or 18/24 bit dual channel LVDS interface (factory options)
    Additional VGA interface (optional external adapter is required)

    Two DP++ 1.2 interfaces on miniDP connectors
    (supports HDMI displays through external adapter)
    embedded Display Port (eDP) internal connector
    LVDS through optional external adapter

    eDP + MIPI-DSI interfaces or Dual Channel 18/24bit LVDS interface through eDP-to-LVDS bridge
    HDMI or DP++ interface
    DP++ interface
    2 x CSI interfaces

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4
    Video Input Port / Camera Connector

    Video Resolution
    HDMIUp to 1920x1080p@60Hz
    Display Port, eDP, CRT     Up to 2560x1600 @60Hz
    Optional LVDS interfaceUp to 1920x1200@60Hz
    DP Up to 4096 x 2160 @60HZ
    eDP     Up to 3840 x 2160 @60Hz
    HDMI Up to 3840 x 2160 @30Hz
    LVDS Up to 1920 x 1200 @ 60Hz
    DP++ Up to 4096 x 2160
    eDP     Up to 3840 x 2160 (4K)
    HDMI Up to 3840 x 2160 (4K)
    LMIPI-DSI, LVDS Up to 1920 x 1200

    LVDS, up to 1920x1200
    HDMI, up to 1080p

    Mass Storage
    Up to 2 x external S-ATA channels
    SD Interface
    Optional SATA Flash Disk soldered on board

    Optional eMMC drive onboard
    M.2 SATA SSD slot (Socket 2 Key B Type 3042/2260 **)
    microSD Card slot
    SATA 7p M connector

    ** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.

    1 x external S-ATA Gen3 Channel
    SD interface
    Optional eMMC 5.0 drive soldered on-board

    On-board eMMC drive, up to 32 GB
    SD / MMC / SDIO interface
    1 x μSD Card Slot on-board
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

    Networking
    Gigabit Ethernet interface

    2x Gbit LAN / Intel Gigabit Ethernet i21x family controller
    M.2 WWAN Slot for Modems (Socket 2 Key B Type 3042/2260 **)
    M.2 WLAN Connectivity Slot for WiFi/BT (Socket 1 Key E type 2230)

    ** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.

    Up to 2 x Gigabit Ethernet interfaces
    Intel® I210 or I211 Controller (MAC + PHY)

    Gigabit Ethernet interface
    USB
    1 x USB 3.0 Host port
    6 x USB 2.0 Host ports (one shared with USB 3.0)
    2 x USB 3.0 Host ports on USB 3.0 Type-A sockets
    2 x USB 2.0 Host ports on USB 2.0 Type-A sockets
    2 x USB 2.0 Host ports on internal pin header
    1 x USB 3.0 Host port on SSD/WWAN M.2 slot
    1 x USB 2.0 Host port on WLAN M.2 Slot
    6 x USB 2.0 Host Ports
    2 x USB 3.0 Host Ports

    1 x USB OTG interface
    4 x USB 2.0 Host interfaces

    PCI-e
    3 x PCI-e x1 lanes
    1 x PCI-e x2 port on M.2 SSD/WWAN Slot
    1 x PCI-e x1 port on WLAN M.2 Slot
    4 x PCI-e Root Ports
    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
    Audio
    HD Audio Interface
    HD Audio codec / Cirrus Logic CS4207
    Mic In and Line Out Audio jacks
    Amplified Speaker output on internal pin header
    HD Audio interface
    I2S Audio interface
    AC'97 Audio Interface
    I2S
    Serial Ports

    1 x Serial port (TTL interface)

    2 x RS-232/RS-422/RS-485 UARTS software configurable, oninternal Pin Header

    2 x HS-UARTs
    2 x UARTs

    2 x serial ports (TTL interface)
    CAN port interface

    Other Interfaces
    I2C Bus
    LPC Bus
    SM Bus 
    Thermal / FAN management
    SPI interface
    Power  Management Signals

    2 x I2C + 8 x GPI/Os on Feature connector
    Button / LED front panel header
    CIR (Consumer InfraRed) sensor
    microSIM slot for M.2 WWAN Modem
    Optional TPM 2.0 on-board

    Up to 12x GPIOs
    I2C Bus
    SM Bus
    2x SPI interfaces
    LPC Bus
    FAN management
    Power Management Signals

    I2C Bus
    LPC Bus
    SM Bus
    Power Management Signals

    Power Supply

    +5VDC  ± 5%

    +18VDC ÷ +32VDC recommended
    +15VDC ÷ +36VDC absolute
    RTC Battery
    +5VDC and +3.3V_RTC

    +5VDC ± 5%

    Power Consumption
    ...
    ...
    ...
    ...
    Operating System
    Microsoft® Windows 7 (32/64 bit)
    Microsoft® Windows 8.1 (32/64 bit)
    Microsoft® Windows 10 (32/64 bit)
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7 (32/64 bit)
    Microsoft® Windows Embedded Standard 8 (32/64 bit)
    Microsoft® Windows Embedded Compact 7
    Linux (32/64 bit)
    Yocto

    Microsoft® Windows 10 Enterprise (64 bit)
    Microsoft® Windows 10 IoT Core
    Wind River Linux 64 bit
    Yocto (64 bit)
    Android (planning)

    Microsoft® Windows 10 Enterprise (64 bit)
    Microsoft® Windows 10 IoT Core
    Linux
    Yocto
    Android

    Linux
    Yocto
    Microsoft® Windows Embedded Compact 7

    Operating Temperature

    0°C ÷ +60°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial version)
    -40°C ÷ +85°C (Industrial version) 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    101.6 x 101.6 mm (4” x 4”)
    50 x 82 mm (1.97” x 3.23”)
    70x70 mm (2.76” x 2.76”)
    Security
    N/A
    N/A
    N/A
    N/A
    BIOS
    N/A
    N/A
    N/A
    N/A
    Embedded Controller Functionalities
    N/A
    N/A
    N/A
    N/A

    Description

    Details

    The Q7-974 is a Qseven® Rel. 2.0 Compliant Module designed by SECO, based on the Intel® Atom™ E3800 family of System-on-Chip with a 64-bit instruction set.
    Integrating all the interfaces in a Single Chip, which also embeds a high performance 2D and 3D GPU, this family of SOCs offers a very high level of performance for all kinds of applications, from graphics to industrial automation.
    The board is also available in an EXTREME configuration, with all the components mounted onboard certified for industrial temperature ranges (not available with the Celeron® processors).
    Additional Information

    Additional Information

    Processor
    Intel® Atom™ E3845, Quad Core @1.91GHz, 2MB Cache, 10W TDP
    Intel® Atom™ E3827, Dual Core @1.75GHz, 1MB Cache, 8W TDP
    Intel® Atom™ E3826, Dual Core @1.46GHz, 1MB Cache, 7W TDP
    Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP
    Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP
    Intel® Celeron® J1900, Quad Core @2.0GHz, 2MB Cache, 10W TDP
    Intel® Celeron® N2930, Quad Core @1.83GHz, 2MB Cache, 7.5W TDP
    Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP
    Max Cores
    4
    Max Thread
    4
    Memory

    Soldered on-board DDR3L memory
    E3845, E3827, J1900, N2930: up to 8GB Dual-Channel DDR3L @ 1333MHz
    E3826: up to 8GB Dual-Channel DDR3L @ 1066MHz
    N2807: up to 4GB Single-Channel DDR3L @ 1333MHz
    E3825, E3815: up to 4GB Single-Channel DDR3L @ 1066MHz

    Graphics

    Integrated Intel® HD Graphics 4000 Series controller
    Dual independent display support
    HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats
    HW encoding of H.264, MPEG2 and MVC formats

    Video Interfaces
    HDMI or Multimode Display Port interface (factory options)
    Embedded Display Port or 18/24 bit dual channel LVDS interface (factory options)
    Additional VGA interface (optional external adapter is required)
    Video Resolution
    HDMIUp to 1920x1080p@60Hz
    Display Port, eDP, CRT     Up to 2560x1600 @60Hz
    Optional LVDS interfaceUp to 1920x1200@60Hz
    Mass Storage
    Up to 2 x external S-ATA channels
    SD Interface
    Optional SATA Flash Disk soldered on board
    Networking
    Gigabit Ethernet interface
    USB
    1 x USB 3.0 Host port
    6 x USB 2.0 Host ports (one shared with USB 3.0)
    PCI-e
    3 x PCI-e x1 lanes
    Audio
    HD Audio Interface
    Serial Ports

    1 x Serial port (TTL interface)

    Other Interfaces
    I2C Bus
    LPC Bus
    SM Bus 
    Thermal / FAN management
    SPI interface
    Power  Management Signals
    Power Supply

    +5VDC  ± 5%

    Operating System
    Microsoft® Windows 7 (32/64 bit)
    Microsoft® Windows 8.1 (32/64 bit)
    Microsoft® Windows 10 (32/64 bit)
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7 (32/64 bit)
    Microsoft® Windows Embedded Standard 8 (32/64 bit)
    Microsoft® Windows Embedded Compact 7
    Linux (32/64 bit)
    Yocto
    Operating Temperature

    0°C ÷ +60°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    Software
    BIOS
    • [BIOS] - Release version 1.22*
    Windows Embedded Compact 7
    • [BSP] - Package version 3.2.0 MR2 V1.0*
    EAPI
    • [Embedded application programming interface] - Release version 1.20.12*
    Linux-YOCTO
    • [BSP] - Yocto Pyro*
    • [Images] - Sample images (sato and minimal) (pyro 64bit)*
    Windows 8
    • [Chipset - 32/64 bit] - Driver version 10.0.17*
    • [I/O drivers - 32/64 bit] - Driver version 545879*
    • [LAN - 32 bit] - Driver version 19.1*
    • [Video - 32 bit] - Driver version 15.33.20.3574*
    • [LAN - 64 bit] - Driver version 19.1*
    • [Video - 64 bit] - Driver version 15.33.20.64.3574*
    • [TXE installer only for Nxxx & Jxxx - 32/64 bit] - Driver version 1.1.0.1064 *
    Windows 8.1
    • [Chipset - 32/64 bit] - Driver version 10.1.1.8*
    • [I/O drivers - 32/64 bit] - Driver version MR1*
    • [LAN - 32 bit] - Driver version 19.1*
    • [LAN - 64 bit] - Driver version 19.1*
    • [Video - 32 bit] - Driver version 15.33.19.3540*
    • [Video - 64 bit] - Driver version 15.33.19.3540*
    • [TXE installer - 32/64 bit] - Driver version 1.0.5.1120*
    Windows 7
    • [Chipset - 32/64 bit] - Driver version 10.1.1.8*
    • [I/O drivers - 32/64 bit] - Driver version MR3*
    • [LAN - 32 bit] - Driver version 23.5.1*
    • [LAN - 64 bit] - Driver version 23.5.1*
    • [USB 3.0 eXtensible Host Controller - 32/64 bit] - Driver version 4.0.0.27*
    • [Video - 32 bit] - Driver version 36.15.0.1127*
    • [Video - 64 bit] - Driver version 37.15.0.1127*
    • [TXE installer - 32/64 bit] - Driver version 1.0.5.1120*
    Windows Embedded Standard 7
    • [Chipset - 32/64 bit] - Driver version 10.1.1.8*
    • [I/O drivers - 32/64 bit] - Driver version MR3*
    • [LAN - 32 bit] - Driver version 19.1*
    • [LAN - 64 bit] - Driver version 19.1*
    • [USB 3.0 eXtensible Host Controller - 32/64 bit] - Driver version 4.0.0.27*
    • [Video - 32 bit] - Driver version 36.15.0.1127*
    • [Video - 64 bit] - Driver version 37.15.0.1127*
    • [TXE installer - 32/64 bit] - Driver version 1.0.5.1120*
    Windows 10
    • [Chipset - 32/64 bit] - Driver version 10.1.1.8*
    • [Video - 32 bit] - Driver version 15.33.19.3540*
    • [IO Tools - 32/64bit] - SPB Test Tool sample code (demonstration only) - Build_1265_18_02_22*
    • [Video - 64 bit] - Driver version 15.33.19.3540*
    • [IO Tools - 32/64bit] - HSUART Virtual COM sample code (demonstration only) - v1.1 *
    • [TXE installer - 32/64 bit] - Driver version 1.0.5.1120*
    • [LAN - 32 bit] - Driver version 23.5.1*
    • [LAN - 64 bit] - Driver version 23.5.1*
    • [MBI(Sideband Fabric Device) only for Nxxx & Jxxx - 32/64 bit ] - Driver version 604.10125.2655.573*
    • [Serial I/O] - Driver Gold edition*

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    Documents

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    Q7-974

    Q7-974
    • EVALUATE OUR PRODUCTS

      Max. 3 pcs per part number
    • SAMPLING PRICE

      Shipping costs included
    • BUSINESS TO BUSINESS ONLY

      Technical support provided exclusively to businesses

    Orders placed between August 3dr and August 21st 2019 will be shipped from August 23rd 2019

    Qseven® Rel. 2.0 Compliant Module with the Intel® Atom™ E3800 and Celeron® families (formerly Bay Trail)
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