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    News

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    8/1/2019 7

    Knowing how valuable it is for our customers and partners to interact using their own language, we are pleased to announce that the new French version of SECO website is now online at www.seco.com/fr

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    6/17/2019

    After having obtained the necessary authorization from the Chinese government, SECO acquired the majority shares of Fannal Electronics Co. Ltd.

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    6/10/2019

    Simultaneously with Intel®’s launch, SECO is making available a new range of solutions based on the latest Intel® technologies: the 8th Gen Intel® Core™ U processor family (codename “Whiskey Lake”) and the 9th Generation Intel® Core™ H processor family (codename “Coffee Lake Refresh”).

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    5/27/2019

    From cross-platform solutions to SECO’s Industrial Internet of Things platform to the disruptive UDOO BOLT, SECO is going to present the widest range of solutions for the IoT industry of tomorrow.

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    4/19/2019

    We’re in a garage in the 1970s and two guys are in the process of inventing the future.

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    4/16/2019

    SECO’s NXP i.MX8 solutions will be on display during the show on May 15/16, 2019

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    4/11/2019

    "IL's Best Suppliers exemplify true partnership, continuous improvement, organizational commitment & operational excellence".

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    3/19/2019

    The domain of Human-Computer Interaction does not only concern the design of technology that is easy to use, useful, and fancy—it has to do with our role in shaping our environment, our ecological niche that today involves the whole earth.

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    2/26/2019

    SECO, a proven partner of NXP as well as a leading-edge partner of Arm is investing much effort in the partnership with NXP with both Layerscape®  LX2160A Multicore Communications Processor and the i.MX 8 Family.

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    2/26/2019

    SECO makes your business IoT-ready in three easy steps

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    2/26/2019

    SECO's services: customized computing platforms, software customization, system integration and assembly

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    2/26/2019

    Heterogeneous processing systems based on the Xilinx® Zynq® Ultrascale+™ MPSoCs

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    2/26/2019

    Among the innovations presented this year, SECO will be showcasing its vast array of state-of-the-art and fully scalable solutions - from low power to high-end SBCs and standard modules - built on the latest Intel® technologies in a large number of form factors, to fully meet a broad range of market demands and design requirements.

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    2/26/2019

    Among the innovations, SECO will be showcasing at embedded world its vast array of state-of-the-art solutions in COM Express™ standard form factor.

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    2/26/2019

    SECO’s latest NXP-based solutions for Edge Computing Strategy ranging from i.MX8 Family up to the high-performance Layerscape® LX2160A

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    2/26/2019

    SECO's products based on AMD Ryzen™ Embedded V1000 processors for high-end graphics performance at the Embedded World 2019.

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    2/25/2019

    Hangzhou, February 25th, 2019 - SECO SpA (Arezzo), a high-tech manufacturer of computer miniaturization and “ready-to-use” integrated systems, with shareholder FII Tech Growth fund backed by Cassa Depositi e Prestiti, is pleased to announce that today it has signed an agreement to acquire the majority of Fannal Electronics Co. Ltd., a leading manufacturer of Human Machine Interaction technologies based in Hangzhou (China).  

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    12/6/2018

    SECO choose MICRO TERRA as a new distributor to accelerate the already fast growth of its business in Russia, with the aim to improve support for Russian companies that use SECO products.

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    10/30/2018

    SECO supports the FAI - Fondo Ambiente Italiano joining the Corporate Golden Donor membership program.

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    10/3/2018

    On October 13th SECO will be in Pisa at the Officine Garibaldi for the TECH JOBS FAIR: an entire day dedicated to meetings between companies and professionals in the technology sector.

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    5/30/2018

    Two years after the stunning Kickstarter success of UDOO X86 the UDOO Team is back in the game with the UDOO BOLT.

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    5/13/2018

    SECO will showcase a comprehensive range of products at Nangang Exhibition Hall 1, booth No K0102, focused around SECO's cross-platform philosophy and its modular solutions with embedded system form factor standards (Qseven®, COM Express™, SMARC).

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    5/10/2018

    On 14-17 May 2018, SECO will take part to Intel® Partner Connect, an invite-only, premier-partner event by Intel® to be held at the Prague Congress Center in Prague, Czech Republic.

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