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    COMe-A81-CT6

    COM-Express™ Type 6 Compact based on the NVIDIA® Tegra® K1 Mobile Processor SoC

    • NVIDIA 4-Plus-1™ ARM® Cortex® –A15 up to 2.3GHz clock frequency
    • 4x USB 3.0; 8x USB 2.0; 4 PCI-e x1
    • Low-power NVIDIA Kepler™ -based GPU with 192 CUDA® cores
    • Up to 4GB DDR3L soldered onboard

      COMe-A81-CT6

    COMe-A81-CT6

    COMe-B75-CT6

    COMe-B75-CT6

    COMe-C08-BT6

    COMe-C08-BT6

    COMe-A98-CT6

    COMe-A98-CT6

     
    Product Development Status
    Processor
    NVIDIA Tegra K1 Mobile Processor Quad-Core, 4-Plus-1™ ARM® Cortex® –A15 MPCore R3 processor
    AMD Ryzen™ Embedded V1807B with AMD Radeon™ Vega 11 Graphics, Quad Core Dual Thread @ 3.35GHz (3.8 Boost), TDP 35-54W
    AMD Ryzen™ Embedded V1756B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 35-54W
    AMD Ryzen™ Embedded V1605B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 2.0GHz (3.6 Boost), TDP 12-25W
    AMD Ryzen™ Embedded V1202B with AMD Radeon™ Vega 3 Graphics, Dual Core Dual Thread @ 2.3GHz (3.2 Boost), TDP 12-25W
    AMD Ryzen™ Embedded V1404I with AMD Radeon™ Vega 3 Graphics, Quad Core / Single Thread, TDP 15W ,Industrial Temperature range (to be released

    Intel® 8th generation Core™ / Xeon® (formerly Coffee Lake H) CPUs:

    • Intel® Core™ i7-8850H, Six Core @ 2.6GHz (4.3GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with HyperThreading
    • Intel® Core™ i5-8400H, Quad Core @ 2.5GHz (4.2GHz Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), with HyperThreading
    • Intel® Core™ i3-8100H, Quad Core @ 3.0GHz, 6MB Cache, 45W TDP (35W cTDP)
    • Intel® Xeon® E-2176M, Six Core @ 2.7GHz (4.4GHz Max 1 Core Turbo), 12MB Cache, 45W TDP (35W cTDP), with HyperThreading

    Intel® 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs:

    • Intel® Xeon® E-2276ME Six Core @2.8GHz (4.5GHz Max 1 Core Turbo), 12MB Cache, 45W TDP (35W cTDP), with Hyperthreading
    • Intel® Xeon® E-2276ML Six Core @2.0GHz (4.2GHz Max 1 Core Turbo), 12MB Cache, 25W TDP, with Hyperthreading
    • Intel® Xeon® E-2254ME Quad Core @2.6GHz (3.8GHz Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), with Hyperthreading
    • Intel® Xeon® E-2254ML Quad Core @1.7GHz (3.5GHz Max 1 Core Turbo), 8MB Cache, 25W TDP, with Hyperthreading
    • Intel® Core™ i7-9850HE,  Six Core @2.7GHz (4.4GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with Hyperthreading
    • Intel® Core™ i7-9850HL, Six Core @1.9GHz (4.1GHz Max 1 Core Turbo), 9MB Cache, 25W TDP, with Hyperthreading
    • Intel® Core™ i3-9100HL, Quad Core @1.6GHz (2.9GHz Max 1 Core Turbo), 6MB Cache, 25W TDP
    • Intel® Pentium® G5600E, Dual Core @2.6GHz (3.1GHz Max 1 Core Turbo), 4MB Cache, 35W TDP
    • Intel® Celeron® G4930E, Dual Core @2.4GHz, 2MB Cache, 35W TDP
    • Intel® Celeron® G4932E,  Dual Core @1.9GHz, 2MB Cache, 25W TDP

    AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), TDP 35W
    AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), TDP 35W
    AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), TDP 15W
    AMD RX-416GD, Quad Core @ 1.6 GHz (2.4GHz Max), TDP 15W, Industrial Temperature range

    AMD GX-217GI, Dual Core @1.7GHz (2.0GHz Max), TDP 15W

    AMD GX-224IJ, Dual Core @ 2.4GHz (2.8GHz Max), cTDP 10-15W
    AMD GX-215IJ, Dual Core @1.5GHz (2.0GHz Max), cTDP 6-10W

    Chipset
    ...
    ...
    Intel® QM370, HM370 or CM246 PCH
    ...
    Max Cores
    4
    4
    6
    4
    Max Thread
    0
    0
    12
    0
    Memory
    Dual Channel Soldered Down DDR3L-1833 memory, up to 4GB
    Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory (DDR4-2400 with V1605B, V1202B and V1404I)

    Two DDR4 SO-DIMM Slots supporting DDR4-2666 Memory, up to 64GB 
    ECC DDR4 memory modules supported only with Xeon®, Core™ i3, Pentium® and Celeron® CPUs combined with CM246 PCH

    R-Series: Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 2133MHz
    G-Series SoC-I: Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 1600MHz
    G-Series SoC-J: One SO-DIMM slot supporting DDR4 non-ECC modules up to 2133MHz 

    Graphics

    Low-power NVIDIA Kepler™ -based GeForce® graphics processor with 192 CUDA® cores
    Supports OpenGL® ES 3.0, OpenGL® 4.4, DirectX® 11.1, Tessellation, CUDA® 7
    Up to 2160p30 HW decoding
    Up to 2160p24 HW encoding

    AMD Radeon™ Vega GPU with up to 11 Compute Units
    DirectX® 12 supported
    H.265 (10-bit) decode and 8-bit video encode
    VP9 decode
    4 independent displays supported

    Intel® UHD Graphics 630/P630 architecture, up to 48 Execution Units
    Up to 3 independent displays supported
    DirectX 12, OpenGL 4.5, and OpenCL 2.1 support
    HW accelerated video decode MPEG2, VC1/WMV9, AVC/H.264, VP8, JPEG/MJPEG, HEVC/H.265 (8-/10-bit), VP9
    HW accelerated video encode MPEG2, AVC/H.264, VP8, JPEG, HEVC/H.265, VP9

    AMD Radeon 3rd -Generation Graphics Core Next (GCN)
    AMD RX-421BD - Radeon R7
    AMD RX-418GD, RX-416GD - Radeon R6
    AMD-RX-216GD -  Radeon R5
    AMD GX-217GI - Radeon R6E
    AMD GX-224IJ - Radeon R4E
    AMD GX-215IJ - Radeon R2E
    Up to 3 independent displays supported (up to 2 with G-Series SoC-I and SoC-J)
    DirectX® 12 supported
    UVD 6 (4K H.265 and H.264 decode) and VCE 3.1 (4KH.264 encode) supported 

    Video Interfaces

    eDP interface or native Single Channel 18 / 24 bit LVDS interface or Single / Dual Channel 18 / 24bit LVDS interface
    HDMI interface
    2 x MIPI CSI Camera interfaces

    3 x Digital Display Interfaces (DDIs), supporting DP 1.3, DVI and HDMI 1.4/2.0
    eDP or Single/Dual-Channel 18-/24- bit LVDS interface

    Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI, HDMI 1.4
    eDP 1.4 or Single/Dual-Channel 18-/24-bit LVDS interface or LVDS + VGA interface

    Up to 3 x Digital Display Interfaces (DDIs), supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0 (up to 2x DDIs with G-Series SoC-I and SoC-J)
    Optional VGA interface (excludes one DDI Port)
    Optional eDP or Single / Dual-Channel 18- / 24- bit LVDS interface (excludes one DDI Port)

    Video Resolution
    HDMIup to 4096 x 2160 (4K)
    eDPup to 3840 x 2160
    LVDSup to 1920 x 1200

    DDIs, eDP: up to 4K
    LVDS: up to 1920 x 1200

    eDP, DP: up to 4096x2304 @ 60Hz, 24bpp
    HDMI: up to 4096x2160 @ 24Hz, 24bpp (HDMI 1.4)
    LVDS, VGA: up to 1920x1200 @ 60Hz

    DDIs: up to 4K
    LVDS, VGA: up to 1920 x 1200 @ 60Hz 

    Mass Storage
    1 x external S-ATA Gen2 Channel
    Optional eMMC drive soldered onboard, up to 32GB
    SD Card interface (multiplexed with GPIO signals)
    2 x S-ATA Gen3 Channels

     4 x S-ATA Gen3 Channels
    SD interface (shared with GPI/Os) 

    2 x SATA Gen3 Channels
    SD interface shared with GPI/Os
    Networking

    Gigabit Ethernet interface
    Realtek RTL8111G Controller (MAC + PHY)

    Gigabit Ethernet interface
    Intel® I21x family GbE Controller 

    Gigabit Ethernet interface
    Intel® I219-LM GbE Controller

    Gigabit Ethernet interface
    Intel® I210 / I211 GbE Controller
    USB
    8 x USB 2.0 Host Ports
    4 x USB 3.0 Host Ports
    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports

    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports 

    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports
    PCI-e
    Up to 4 x PCI-e x1 lanes (factory options)

    Up to 4x PCI-e x1 Gen3 lanes + 2 x PCI-e x1 Gen2 ports
    PCI-express Graphics (PEG) x 8 Gen3

    8 x PCI-e x 1 Gen3 lanes
    PCI-express Graphics (PEG) Gen3 x16

    3 x PCI-e x 1 lanes 
    PCI-express Graphics (PEG) x8 (R-Series SoCs) or x4 (G-Series SOC-I and SoC-J)

    Audio
    HD Audio Interface
    HD Audio Interface
    HD Audio Interface
    HD Audio Interface
    Serial Ports
    2 x UARTS, TX/RX signals only, TTL interface

    2 x UARTs

    2 x UARTs
    2 x HS UARTs
    Other Interfaces

    I2C Bus
    LPC Bus
    SM Bus
    4 x GPI, 4 x GPO
    SPI Interface
    Watch Dog Timer
    Real Time Clock (optional, additional Low Power RTC)
    Power Management Signals
    Thermal / Fan Management
    On-board FAN connector

    SPI, I2C bus, SM Bus, LPC bus, FAN management
    LID#/SLEEP#/PWRBTN#, Watchdog
    4x GPI, 4 x GPO

    SPI, I2C, SM Bus, Thermal Management, FAN management
    LPC bus
    Optional TPM 2.0 on-board
    LID#/SLEEP#/PWRBTN#, Watchdog 
    4 x GPI, 4 x GPO (pins shared with SD interface)

    SPI, I2C Bus, SM Bus, LPC Bus, 2 x Express Card, FAN management
    LID# / SLEEP# / PWRBTN#, Watchdog
    4 x GPI, 4 x GPO (multiplexed with SD interface)
    Optional TPM 1.2 or 2.0 module onboard 

    Power Supply
    +12VDC and +5VSB (optional)

    +12VDC ± 10% and + 5VSB (optional)

    +12VDC ± 10% and + 5VSB (optional)

    +12VDC ± 10% and + 5VSB (optional)
    Power Consumption
    ...
    ...
    ...
    ...
    Operating System
    Linux for Tegra (L4T) provides flashing utilities, bootloader, Linux kernel, Tegra hardware acceleration libraries for graphics, multimedia and compute (EGL, OpenGL-ES, GLX, OpenGL), and a reference File System for evaluating Linux on the Tegra platform

    Microsoft® Windows 10
    Linux Ubuntu

    Microsoft® Windows 10 
    Linux

    Microsoft® Windows 7
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7
    Microsoft® Windows Embedded Standard 8
    Linux

    Operating Temperature

    0°C ÷ +60 °C (commercial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (Commercial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    95x95 mm (COM Express Compact, 3,74” x 3,74”)
    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)

    125 x 95 mm (Com Express™ Basic Form factor, Type 6 pinout)

    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)
    Security
    N/A
    ...
    N/A
    ...
    BIOS
    N/A
    ...
    N/A
    ...
    Embedded Controller Functionalities
    N/A
    ...
    N/A
    ...

    Description

    Details

    The COMe-A81-CT6 features the most advanced and innovative SoC for unique mobile experiences in the COM Express Form Factor, ideal for applications in Visual Computing, Automotive and In-Vehicle Infotainment Systems. The board integrates 192 CUDA® cores and low-power NVIDIA Kepler™ graphics for extreme performance and powerful computing with extraordinary power efficiency. The NVIDIA TK1 is the first ARM SoC that fully complies with the COM Express Type 6 pinout with the best combination of performance and low power consumption while remaining highly cost-effective.
    Additional Information

    Additional Information

    Processor
    NVIDIA Tegra K1 Mobile Processor Quad-Core, 4-Plus-1™ ARM® Cortex® –A15 MPCore R3 processor
    Max Cores
    4
    Memory
    Dual Channel Soldered Down DDR3L-1833 memory, up to 4GB
    Graphics

    Low-power NVIDIA Kepler™ -based GeForce® graphics processor with 192 CUDA® cores
    Supports OpenGL® ES 3.0, OpenGL® 4.4, DirectX® 11.1, Tessellation, CUDA® 7
    Up to 2160p30 HW decoding
    Up to 2160p24 HW encoding

    Video Interfaces

    eDP interface or native Single Channel 18 / 24 bit LVDS interface or Single / Dual Channel 18 / 24bit LVDS interface
    HDMI interface
    2 x MIPI CSI Camera interfaces

    Video Resolution
    HDMIup to 4096 x 2160 (4K)
    eDPup to 3840 x 2160
    LVDSup to 1920 x 1200
    Mass Storage
    1 x external S-ATA Gen2 Channel
    Optional eMMC drive soldered onboard, up to 32GB
    SD Card interface (multiplexed with GPIO signals)
    Networking

    Gigabit Ethernet interface
    Realtek RTL8111G Controller (MAC + PHY)

    USB
    8 x USB 2.0 Host Ports
    4 x USB 3.0 Host Ports
    PCI-e
    Up to 4 x PCI-e x1 lanes (factory options)
    Audio
    HD Audio Interface
    Serial Ports
    2 x UARTS, TX/RX signals only, TTL interface
    Other Interfaces

    I2C Bus
    LPC Bus
    SM Bus
    4 x GPI, 4 x GPO
    SPI Interface
    Watch Dog Timer
    Real Time Clock (optional, additional Low Power RTC)
    Power Management Signals
    Thermal / Fan Management
    On-board FAN connector

    Power Supply
    +12VDC and +5VSB (optional)
    Operating System
    Linux for Tegra (L4T) provides flashing utilities, bootloader, Linux kernel, Tegra hardware acceleration libraries for graphics, multimedia and compute (EGL, OpenGL-ES, GLX, OpenGL), and a reference File System for evaluating Linux on the Tegra platform
    Operating Temperature

    0°C ÷ +60 °C (commercial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    95x95 mm (COM Express Compact, 3,74” x 3,74”)
    Software

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    Documents

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    COMe-A81-CT6

    COMe-A81-CT6
    • EVALUATE OUR PRODUCTS

      Max. 3 pcs per part number
    • SAMPLING PRICE

      Shipping costs included
    • BUSINESS TO BUSINESS ONLY

      Technical support provided exclusively to businesses
    COM-Express™ Type 6 Compact based on the NVIDIA® Tegra® K1 Mobile Processor SoC
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