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    μQ7-A75-J

    μQseven® standard module with NXP i.MX 6 Processor

    • Single and Dual Core Lite (ARM Cortex™A9 Cores)
    • FastEthernet; GPI/Os
    • 2D/3D dedicated graphics processors
    • up to 1GB DDR3L on-board
    Доступно в промышленном температурном диапазоне

      μQ7-A75-J

    μQ7-A75-J

    SM-C12

    SM-C12

    Q7-C26

    Q7-C26

    SYS-A62-10

    SYS-A62-10

     
    Статус разработки продукта
    Процессор

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors

    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    NXP i.MX 8 Family:
    i.MX 8QuadMax - 2x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8QuadPlus - 1x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8Quad - 4x Cortex®-A53 cores + 2x Cortex®-M4F cores

    Multicore NXP i.MX 6 processor family
    SYS-A62-10/SOLO: i.MX6S Solo, 1 x ARM Cortex-A9 @1 GHz Core
    SYS-A62-10/LITE: i.MX6DL Dual Lite, 2 x ARM Cortex-A9 @1 GHz Cores
    SYS-A62-10/QUAD: i.MX6Q Quad, 4 x ARM Cortex-A9 @1 GHz Cores
    Набор микросхем
    ...
    ...
    ...
    ...
    Макс. количество ядер
    2
    0
    0
    0
    Максимальное количество потоков
    ...
    0
    0
    0
    Память

    Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F

    Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB

    soldered down LPDDR4-3200 memory, 64-bit interface

    On-board DDR3L soldered memory;
    SYS-A62-10/SOLO: 512MB 32-bit
    SYS-A62-10/LITE: 1GB 64-bit
    SYS-A62-10/QUAD: 1GB 64-bit
    Графика

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Supports 2 independent displays

    Integrated Graphics Processing Unit, supports 2 independent displays
    Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
    Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-2, VC-1, RV9, VP8, H.263 and MPEG4 part, HW encoding of AVC/H.264
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 3.x, DirectX 11

    2D, OpenGL® ES2.0 3D HW accelerator
    OpenVG™ accelerator (SYS-A62/10/QUAD only)
    HW encoding of MPEG-4, H.263 V2, H.264, MJPEG
    HW decoding of MPEG-2, VC1, MPEG-4 / XviD, H.263, H.264, DivX
    Видеоинтерфейс

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface

    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
    18- / 24-bit Dual Channel LVDS interface or MIPI-DSI interface
    (factory alternatives)

    HDMI 2.0a or DP 1.3 interface, supporting HDCP 2.2
    Dual Channel or 2 x Single Channel 18- / 24-bit LVDS interface

    10,1” LVDS display, resolution 1280 x 800, 30K hours life
    P-Cap (Projected Capacitive touch screen), with 2mm glass cover
    Glass Hardness IK08, Surface Hardness 8H (450g)
    Разрешение видео

    LVDS, resolution up to 1920x1200
    HDMI, resolution up to 1080p

    HDMIUp to 4096 x 2160 @ 60 (4K)
    MIPI-DSI, LVDSUp to 1920 x 1080 @ 60Hz
    HDMI:Up to 4Kp60
    LVDSUp to 1080p
    ...
    Массовое хранение

    On-board eMMC drive, up to 8 GB
    SD / MMC / SDIO interface
    Internal SPI Flash for booting

    Optional SD 4-bit interface
    QSPI Flash soldered-onboard
    eMMC 5.0 drive soldered on-board

    1x SATA Gen3 interface (alternative to 1x PCI-e x1 port)
    eMMC 5.1 drive soldered on-board
    SD 4-bit interface
    QSPI Flash soldered-on-board

    On-board 4GB eMMC drive
    microSD Card Slot
    SATA Connector (SYS-A62-10/QUAD only)
    Сетевой
    Fast Ethernet (10/100) interface
    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard

    1 x Gigabit Ethernet interface

    Gigabit Ethernet connector
    Optional WiFi pluggable module
    USB

    1 x USB OTG interface
    1 x USB 2.0 Host interface

    2 USB 3.0 Host ports
    2 USB 2.0 Host ports
    1 USB 2.0 OTG port

    4 x USB 2.0 Host Ports 
    1 x USB 3.0 Host Port
    1 x USB 2.0 OTG port

    2 x USB 2.0 Type-A ports and 1 x USB 2.0 internal connector
    USB micro-B Client port
    PCI-e

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    2x PCI-e x1 ports

    Up to 2x PCI-e x1 Gen3 ports

    ...
    Аудио
    I2S / AC’97 Audio Interface
    I2S Audio Interface

    I2S Audio Interface

    SYS-A62-10/LITE and SYS-A62-10/QUAD: Realtek ALC655
    AC’97 Audio Codec with Mic-In, Line-Out audio Jacks
    Последовательные порты
    ...
    Up to 2x UART Tx/Rx/RTS/CTS
    2x UART Tx/Rx
    1x CAN Bus (TTL level)

    1x UART Tx/Rx/RTS/CTS
    1x CAN Bus (TTL level)

    Dedicated Serial ports:
    SYS-A62-10/SOLO: 2 x RS-232 ports 
    SYS-A62-10/LITE: 2 x RS-232 ports, 1 x CAN port
    SYS-A62-10/QUAD: 2 x RS-232 ports, 1 x RS-485 port, 1 x CAN port

    Other serial ports can be realised on expansion connector (see ""Other interfaces"")
    Другие интерфейсы

    On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
    - Additional SD interface
    - Up to 4 UARTs
    - CAN interface
    - Watchdog(s)
    - I2C interfaces
    - PWM outputs
    - SPI interface
    - Additional Audio interface

    (*) not all the combinations are allowed simultaneously Power Management Signals

    1x 4-lanes + 1x 2-lanes CSI camera interfaces
    I2C Bus
    SM Bus
    2x SPI interfaces
    QuadSPI interface
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    CSI camera connector
    2x I2C Bus
    SPI interface
    8 x GPI/Os
    Boot select signal
    Power Management Signals
    Watchdog

    MIPI-CSI Camera connector
    Programmable expansion connector with:
    SYS-A62-10/SOLO: up to 22 GPIOs, 2 x TTL CAN ports, 1 x UART TTL, 3 x PWM, 2 x I2C, SD, SPI or S/PDIF interfaces
    SYS-A62-10/LITE: up to 20 GPIOs, 1 x TTL CAN port, 1 x UART TTL, 3 x PWM, 2 x I2C, SD, SPI or S/PDIF interfaces
    SYS-A62-10/QUAD: up to 18 GPIOs, 1 x TTL CAN port, 3 x PWM, 2 x I2C, SD, SPI or S/PDIF interfaces
    Блок питания

    +5VDC ± 5%
    Optional Low Power RTC

    +5VDC
    +3.3V_RTC

    +5VDC ± 5%
    +3.3V_RTC

    +12VDC
    SYS-A62-10/SOLO and SYS-A62-10/LITE: internal i.MX6 RTC, require external battery for time/data retention
    SYS-A62-10/QUAD: low power RTC with on-board battery

    Потребляемая мощность
    ...
    ...
    ...
    ...
    Операционная система

    Linux
    Yocto

    Linux
    Android

    Linux
    Android

    Linux
    Yocto
    Windows® Embedded Compact 7
    Рабочая температура

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (Industrial temp.)* 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ 50°C

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Размеры
    40x70 mm (1.57” x 2.76”)
    50 x 82 mm (1.97” x 3.23”)
    70x70 mm (2.76” x 2.76”)
    269,60 x 189,20 x 17,17 mm
    Security
    Н/Д
    Н/Д
    Н/Д
    Н/Д
    BIOS
    Н/Д
    Н/Д
    Н/Д
    Н/Д
    Embedded Controller Functionalities
    Н/Д
    Н/Д
    Н/Д
    Н/Д

    Описание

    Подробности

    The extremely low power and low cost μQseven Rev. 2.0 Compliant Module with the NXP i.MX 6 Processor features all the processor and integrated native I/O capabilities of the SoC, in compliance with the Qseven standard, at the competitive cost of a proprietary module. This board is supplied with a complete and fully-featured BSP, for easy migration from, and to, the entire i.MX 6 product family, along with dedicated hardware and software development support.
    Дополнительная информация

    Дополнительная информация

    Процессор

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors

    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core

    Макс. количество ядер
    2
    Память

    Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F

    Графика

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Supports 2 independent displays

    Видеоинтерфейс

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface

    Разрешение видео

    LVDS, resolution up to 1920x1200
    HDMI, resolution up to 1080p

    Массовое хранение

    On-board eMMC drive, up to 8 GB
    SD / MMC / SDIO interface
    Internal SPI Flash for booting

    Сетевой
    Fast Ethernet (10/100) interface
    USB

    1 x USB OTG interface
    1 x USB 2.0 Host interface

    PCI-e

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    Аудио
    I2S / AC’97 Audio Interface
    Другие интерфейсы

    On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
    - Additional SD interface
    - Up to 4 UARTs
    - CAN interface
    - Watchdog(s)
    - I2C interfaces
    - PWM outputs
    - SPI interface
    - Additional Audio interface

    (*) not all the combinations are allowed simultaneously Power Management Signals

    Блок питания

    +5VDC ± 5%
    Optional Low Power RTC

    Операционная система

    Linux
    Yocto

    Рабочая температура

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (Industrial temp.)* 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Размеры
    40x70 mm (1.57” x 2.76”)
    ПРОГРАММНОЕ ОБЕСПЕЧЕНИЕ
    SECO WIKI
    Linux
    • SECO BSP*
    Linux-YOCTO
    • Yocto meta SECO BSP release Guideline*

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Документы

    * User need to register to site before download reserved files. Please login if you are a registered user.

    μQ7-A75-J

    μQ7-A75-J
    • ОЦЕНИТЕ НАШУ ПРОДУКЦИЮ

      Максимум 3 шт. на номер изделия
    • ЦЕНА ОБРАЗЦА

      Включена стоимость доставки 
    • ТОЛЬКО ДЛЯ КОРПОРАТИВНЫХ КЛИЕНТОВ

      Техническая поддержка, оказываемая исключительно корпоративным клиентам

    Orders placed between August 3dr and August 21st 2019 will be shipped from August 23rd 2019

    μQseven® standard module with NXP i.MX 6 Processor
    Номер артикула описание номера детали конфигурация номера детали купить образцы онлайн свяжитесь с нами сравнить
    QA75-1130-1000-C0 µQseven i.MX6 Solo μQ7 w / i.MX6 Solo - RAM DDR3L 256MB single chip - eMMC 4GB - RTC Low Power - Comm.Temp

    запросить информацию и наличие

    Добавить в сравнение
    QA75-2330-1000-C0 µQseven i.MX6 DualLite μQ7 w / i.MX6 DualLite - RAM DDR3L 512MB dual chip - eMMC 4GB - RTC Low Power - Comm.Temp

    запросить информацию и наличие

    Добавить в сравнение
    QA75-2430-1000-C0 µQseven i.MX6 DualLite μQ7 w / i.MX6 DualLite - RAM DDR3L 1GB dual chip - eMMC 4GB - RTC Low Power - Comm.Temp

    запросить информацию и наличие

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