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    SBC-B08

    SBC with NXP i.MX 6SoloX Processor

    • NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz
    • up to 2x Fast Eth; optional WiFi + BT LE
    • Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator
    • 32-bit DDR3L memory soldered on-board, up to 1GB
    Доступно в промышленном температурном диапазоне

      SBC-B08

    SBC-B08

    Q7-928

    Q7-928

    μQ7-A76-J

    μQ7-A76-J

    μQ7-A75-J

    μQ7-A75-J

     
    Статус разработки продукта
    Процессор
    NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz
    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6DP DualPlus - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core

    Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP
    Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP
    Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors

    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core

    Набор микросхем
    ...
    ...
    ...
    ...
    Макс. количество ядер
    1 + 1
    4
    2
    2
    Максимальное количество потоков
    ...
    0
    2
    ...
    Память

    Soldered on-board DDR3L memory, 32-bit interface
    SYS-B08-BASIC/D: 512MB
    SYS-B08-FULL/D: 1GB

    Up to 4GB DDR3L on-board (up to 2GB with i.MX6S)

    Soldered onboard DDR3L memory
    E3825, E3815:  up to 4GB Single-Channel DDR3L @ 1066MHz
    N2807: up to 4GB Single-Channel DDR3L @ 1333MHz

    Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F

    Графика

    Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator
    OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1 supported

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES 2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D, i.MX6DP and i.MX6Q)
    Enhanced 2D and 3D graphics with i.MX6DP
    Supports up to 3 independent displays with i.MX6D, i.MX6DPand i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S

    Integrated Intel® HD Graphics 4000 Series controller
    Dual independent display support
    HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats
    HW encoding of H.264, MPEG2 and MVC formats

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Supports 2 independent displays

    Видеоинтерфейс

    Single Channel 18-/24- bit LVDS connector + Touch Screen (I2C signals)
    24-bit Parallel RGB Connector

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4
    Video Input Port / Camera Connector

    Multimode Display Port (DP++) interface
    18 / 24 bit Dual Channel LVDS interface

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface

    Разрешение видео

    LVDS: up to 1366x768 @60Hz, 24bpp
    RGB: up to 1920x1080p @60Hz, 24bpp

    LVDS, up to 1920x1200
    HDMI, up to 1080p

    DP++ (HDMI compatible) Up to 2560x1600@60Hz
    LVDS interface Up to 1920x1200@60Hz

    LVDS, resolution up to 1920x1200
    HDMI, resolution up to 1080p

    Массовое хранение

    16MB NOR Quad-SPI Flash soldered onboard µSD Card slot
    SYS-B08-FULL/D: 8GB eMMC soldered onboard

    On-board eMMC drive, up to 32 GB
    SD / MMC / SDIO interface
    1 x μSD Card Slot on-board
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

    2 x external S-ATA channels
    SD interface
    Optional eMMC drive soldered onboard

    On-board eMMC drive, up to 8 GB
    SD / MMC / SDIO interface
    Internal SPI Flash for booting

    Сетевой

    SYS-B08-BASIC/D:1x Fast Ethernet RJ-45 connector
    SYS-B08-FULL/D: 2x Fast Ethernet RJ-45 connector + WiFi (802.11 b/g/n) +BT LE combo module + antenna onboard

    Gigabit Ethernet interface
    Gigabit Ethernet interface
    Fast Ethernet (10/100) interface
    USB
    1 x USB 2.0 OTG port
    3 x USB 2.0 Host ports on standard Type-A socket
    1 x USB 2.0 Host port on internal pin header

    1 x USB OTG interface
    4 x USB 2.0 Host interfaces

    1 x USB 3.0 Host port
    4 x USB 2.0 Host ports (one shared with USB 3.0 interface)

    1 x USB OTG interface
    1 x USB 2.0 Host interface

    PCI-e
    ...
    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
    3 x PCI-e x1 lanes (Gen2)

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    Аудио
    I2S Audio interface on programmable pin header
    S / PDIF interface (In and Out) on programmable pin header
    AC'97 Audio Interface
    I2S
    HD Audio Interface
    I2S / AC’97 Audio Interface
    Последовательные порты

    1 x CAN Port reconfigurable as GPIO
    2x RS-232 (Tx/RX signals only) + 1x RS-485 serial ports on expansion pin header

    2 x serial ports (TTL interface)
    CAN port interface

    1 x Serial Port (TTL interface, Tx/Rx only)
    ...
    Другие интерфейсы

    2 x I2C dedicated connectors (one reserved for Touch Screen)
    6 analog inputs for A/D Conversion
    Programmable (*) expansion pin header connector, able to offer:
    • CSI interface input (PAL and NTSC formats supported)
    • Up to 20 GPIO
    • SPI interface
    • SPDIF Audio interface
    • I2S Audio interface
    • CAN interface (TTL level)
    • 5 x PWM
    • 3 x I2C
    • 3 x serial ports (2x RS-232 +1xRS-485 interface)
    Embedded Low Power RTC
    (*) Please note that some of these interfaces are factory options, other configurations are made via SW using the pin multiplexing possibilities of the i.MX6SX processor.

    Optional 9-Axis Motion Sensors (Accelerometer, Magnetometer and Digital Gyroscope)

    I2C Bus
    LPC Bus
    SM Bus
    Power Management Signals

    I2C bus
    LPC Bus
    SM Bus
    Thermal / FAN Management
    PWR Management signals

    On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
    - Additional SD interface
    - Up to 4 UARTs
    - CAN interface
    - Watchdog(s)
    - I2C interfaces
    - PWM outputs
    - SPI interface
    - Additional Audio interface

    (*) not all the combinations are allowed simultaneously Power Management Signals

    Блок питания

    +12VDC nominal voltage
    +3VDC cabled Coin Cell Battery

    +5VDC ± 5%

    +5VDC ± 5%

    +5VDC ± 5%
    Optional Low Power RTC

    Потребляемая мощность
    ...
    ...
    ...
    ...
    Операционная система
    Linux

    Linux
    Yocto
    Microsoft® Windows Embedded Compact 7

    Microsoft® Windows 7
    Microsoft® Windows 8.1
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7
    Microsoft® Windows Embedded Standard 8
    Microsoft® Windows Embedded Compact 7
    Linux
    Yocto

    Linux
    Yocto

    Рабочая температура

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (Industrial temp.)* 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Размеры
    89.5 x 87 mm (3.52” x 3.43”)
    70x70 mm (2.76” x 2.76”)
    40 x 70 mm (1.57 x 2.76)
    40x70 mm (1.57” x 2.76”)
    Security
    ...
    Н/Д
    Н/Д
    Н/Д
    BIOS
    ...
    Н/Д
    Н/Д
    Н/Д
    Embedded Controller Functionalities
    ...
    Н/Д
    Н/Д
    Н/Д

    Описание

    Подробности

    SBC-B08 is a new-generation all-in-one low-cost computer designed by SECO, equipped with a NXP i.MX 6SoloX applications processor able to run Linux. SBC-B08 is a revolutionary product in terms of connectivity, interactivity with the real world and cost: a new concept of single board computer ready for Internet of Things applications and for the Post-PC era.
    Дополнительная информация

    Дополнительная информация

    Процессор
    NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz
    Макс. количество ядер
    1 + 1
    Память

    Soldered on-board DDR3L memory, 32-bit interface
    SYS-B08-BASIC/D: 512MB
    SYS-B08-FULL/D: 1GB

    Графика

    Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator
    OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1 supported

    Видеоинтерфейс

    Single Channel 18-/24- bit LVDS connector + Touch Screen (I2C signals)
    24-bit Parallel RGB Connector

    Разрешение видео

    LVDS: up to 1366x768 @60Hz, 24bpp
    RGB: up to 1920x1080p @60Hz, 24bpp

    Массовое хранение

    16MB NOR Quad-SPI Flash soldered onboard µSD Card slot
    SYS-B08-FULL/D: 8GB eMMC soldered onboard

    Сетевой

    SYS-B08-BASIC/D:1x Fast Ethernet RJ-45 connector
    SYS-B08-FULL/D: 2x Fast Ethernet RJ-45 connector + WiFi (802.11 b/g/n) +BT LE combo module + antenna onboard

    USB
    1 x USB 2.0 OTG port
    3 x USB 2.0 Host ports on standard Type-A socket
    1 x USB 2.0 Host port on internal pin header
    Аудио
    I2S Audio interface on programmable pin header
    S / PDIF interface (In and Out) on programmable pin header
    Последовательные порты

    1 x CAN Port reconfigurable as GPIO
    2x RS-232 (Tx/RX signals only) + 1x RS-485 serial ports on expansion pin header

    Другие интерфейсы

    2 x I2C dedicated connectors (one reserved for Touch Screen)
    6 analog inputs for A/D Conversion
    Programmable (*) expansion pin header connector, able to offer:
    • CSI interface input (PAL and NTSC formats supported)
    • Up to 20 GPIO
    • SPI interface
    • SPDIF Audio interface
    • I2S Audio interface
    • CAN interface (TTL level)
    • 5 x PWM
    • 3 x I2C
    • 3 x serial ports (2x RS-232 +1xRS-485 interface)
    Embedded Low Power RTC
    (*) Please note that some of these interfaces are factory options, other configurations are made via SW using the pin multiplexing possibilities of the i.MX6SX processor.

    Optional 9-Axis Motion Sensors (Accelerometer, Magnetometer and Digital Gyroscope)

    Блок питания

    +12VDC nominal voltage
    +3VDC cabled Coin Cell Battery

    Операционная система
    Linux
    Рабочая температура

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Размеры
    89.5 x 87 mm (3.52” x 3.43”)
    ПРОГРАММНОЕ ОБЕСПЕЧЕНИЕ

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    Документы

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    SBC-B08

    SBC-B08
    • ОЦЕНИТЕ НАШУ ПРОДУКЦИЮ

      Максимум 3 шт. на номер изделия
    • ЦЕНА ОБРАЗЦА

      Включена стоимость доставки 
    • ТОЛЬКО ДЛЯ КОРПОРАТИВНЫХ КЛИЕНТОВ

      Техническая поддержка, оказываемая исключительно корпоративным клиентам
    SBC with NXP i.MX 6SoloX Processor
    Номер артикула описание номера детали конфигурация номера детали купить образцы онлайн свяжитесь с нами сравнить
    SYS-B08-I-BASIC/D SBC - SBC-B08 Basic version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 512MB RAM - 1x FastETH - RTC LP - RS-485 - RS-232 - CAN - Ind. Temp. w/Heatsink SBC - SBC-B08 Basic version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 512MB RAM - 1x FastETH - RTC LP - RS-485 - RS-232 - CAN - Ind. Temp. w/Heatsink

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    Добавить в сравнение
    SYS-B08-BASIC/D SBC - SBC-B08 Basic version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 512MB RAM - 1x FastETH - RTC LP - RS-485 - RS-232 - CAN - Comm. Temp. w/Heatsink SBC - SBC-B08 Basic version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 512MB RAM - 1x FastETH - RTC LP - RS-485 - RS-232 - CAN - Comm. Temp. w/Heatsink

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    SYS-B08-FULL/D SBC - SBC-B08 Full version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 1GB RAM - 8GB eMMC - 2x FastETH - Wi-Fi/BLE - RTC LP - RS-485 - RS-232 - CAN - Comm. Temp. w/ Heatsink SBC - SBC-B08 Full version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 1GB RAM - 8GB eMMC - 2x FastETH - Wi-Fi/BLE - RTC LP - RS-485 - RS-232 - CAN - Comm. Temp. w/ Heatsink

    запросить информацию и наличие

    Добавить в сравнение
    SYS-B08-I-FULL/D SBC - SBC-B08 Full version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 1GB RAM - 8GB eMMC - 2x FastETH - Wi-Fi/BLE - RTC LP - RS-485 - RS-232 - CAN - Ind. Temp. w/ Heatsink SBC - SBC-B08 Full version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 1GB RAM - 8GB eMMC - 2x FastETH - Wi-Fi/BLE - RTC LP - RS-485 - RS-232 - CAN - Ind. Temp. w/ Heatsink

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