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    COMe-B75-CT6

    COM Express™ Compact 3.0 Type 6 Module with the AMD Ryzen™ Embedded V1000 processors

    • AMD Ryzen™ Embedded V1000 processors
    • 4x USB 3.0; 8x USB 2.0; 4x PCI-e x1 Gen 3, PEG x8 Gen3
    • AMD Radeon™ Vega GPU with up to 11 Compute Units DirectX® 12 supported

    • Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory
    Доступно в промышленном температурном диапазоне

      COMe-B75-CT6

    COMe-B75-CT6

    COMe-C08-BT6

    COMe-C08-BT6

    SBC-B68-eNUC

    SBC-B68-eNUC

    SYS-A90-IPC

    SYS-A90-IPC

     
    Статус разработки продукта
    Процессор
    AMD Ryzen™ Embedded V1807B with AMD Radeon™ Vega 11 Graphics, Quad Core Dual Thread @ 3.35GHz (3.8 Boost), TDP 35-54W
    AMD Ryzen™ Embedded V1756B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 35-54W
    AMD Ryzen™ Embedded V1605B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 2.0GHz (3.6 Boost), TDP 12-25W
    AMD Ryzen™ Embedded V1202B with AMD Radeon™ Vega 3 Graphics, Dual Core Dual Thread @ 2.3GHz (3.2 Boost), TDP 12-25W
    AMD Ryzen™ Embedded V1404I with AMD Radeon™ Vega 3 Graphics, Quad Core / Single Thread, TDP 15W ,Industrial Temperature range (to be released

    Intel® 8th generation Core™ / Xeon® (formerly Coffee Lake H) CPUs:

    • Intel® Core™ i7-8850H, Six Core @ 2.6GHz (4.3GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with HyperThreading
    • Intel® Core™ i5-8400H, Quad Core @ 2.5GHz (4.2GHz Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), with HyperThreading
    • Intel® Core™ i3-8100H, Quad Core @ 3.0GHz, 6MB Cache, 45W TDP (35W cTDP)
    • Intel® Xeon® E-2176M, Six Core @ 2.7GHz (4.4GHz Max 1 Core Turbo), 12MB Cache, 45W TDP (35W cTDP), with HyperThreading

    Intel® 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs:

    • Intel® Xeon® E-2276ME Six Core @2.8GHz (4.5GHz Max 1 Core Turbo), 12MB Cache, 45W TDP (35W cTDP), with Hyperthreading
    • Intel® Xeon® E-2276ML Six Core @2.0GHz (4.2GHz Max 1 Core Turbo), 12MB Cache, 25W TDP, with Hyperthreading
    • Intel® Xeon® E-2254ME Quad Core @2.6GHz (3.8GHz Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), with Hyperthreading
    • Intel® Xeon® E-2254ML Quad Core @1.7GHz (3.5GHz Max 1 Core Turbo), 8MB Cache, 25W TDP, with Hyperthreading
    • Intel® Core™ i7-9850HE,  Six Core @2.7GHz (4.4GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with Hyperthreading
    • Intel® Core™ i7-9850HL, Six Core @1.9GHz (4.1GHz Max 1 Core Turbo), 9MB Cache, 25W TDP, with Hyperthreading
    • Intel® Core™ i3-9100HL, Quad Core @1.6GHz (2.9GHz Max 1 Core Turbo), 6MB Cache, 25W TDP
    • Intel® Pentium® G5600E, Dual Core @2.6GHz (3.1GHz Max 1 Core Turbo), 4MB Cache, 35W TDP
    • Intel® Celeron® G4930E, Dual Core @2.4GHz, 2MB Cache, 35W TDP
    • Intel® Celeron® G4932E,  Dual Core @1.9GHz, 2MB Cache, 25W TDP

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon)
    Набор микросхем
    ...
    Intel® QM370, HM370 or CM246 PCH
    ...
    ...
    Макс. количество ядер
    4
    6
    4
    0
    Максимальное количество потоков
    0
    12
    4
    0
    Память

    Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC and non- ECC Memory modules (DDR4-2400 with V1605B, V1202B and V1404I)

    Up to 16GB @ 3200Mhz, up to 32GB @ 2400MHz supported

    Two DDR4 SO-DIMM Slots supporting DDR4-2666 Memory, up to 64GB 
    ECC DDR4 memory modules supported only with Xeon®, Core™ i3, Pentium® and Celeron® CPUs combined with CM246 PCH

    Quad Channel soldered down LPDDR4 memory, up to 8GB

    Up to 2x 8GB DDR4 SODIMM modules

    Графика

    AMD Radeon™ Vega GPU with up to 11 Compute Units
    DirectX® 12 supported
    H.265 (10-bit) decode and 8-bit video encode
    VP9 decode
    4 independent displays supported

    Intel® UHD Graphics 630/P630 architecture, up to 48 Execution Units
    Up to 3 independent displays supported
    DirectX 12, OpenGL 4.5, and OpenCL 2.1 support
    HW accelerated video decode MPEG2, VC1/WMV9, AVC/H.264, VP8, JPEG/MJPEG, HEVC/H.265 (8-/10-bit), VP9
    HW accelerated video encode MPEG2, AVC/H.264, VP8, JPEG, HEVC/H.265, VP9

    Integrated Intel® HD Graphics 500 series controller, with up to 18 Execution Units
    4K HW decoding and encoding of HEVC(H.265), H.264, VP8, VP9, MVC
    Three independent display support

    AMD Radeon 3rd -Generation Graphics Core Next (GCN)
    RX-421BD -Radeon™ R7
    RX-418GD -Radeon™ R6
    RX-216GD -Radeon™ R5
    GX-217GI -Radeon™ R6E
    GX-224IJ, Radeon™ R4E

    Three independent displays supported (two with GX-217GJ and GX-224IJ) DirectX® 12 supported
    Unified Video Decode (UVD) 6 (4K H.265 and H.264 decode)
    Video Coding Engine (VCE) 3.1 (4K H.264 encode)

    Видеоинтерфейс

    3 x Digital Display Interfaces (DDIs), supporting DP 1.3, DVI and HDMI 1.4/2.0
    eDP or Single/Dual-Channel 18-/24- bit LVDS interface

    Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI, HDMI 1.4
    eDP 1.4 or Single/Dual-Channel 18-/24-bit LVDS interface or LVDS + VGA interface

    Two DP++ 1.2 interfaces on miniDP connectors
    (supports HDMI displays through external adapter)
    embedded Display Port (eDP) internal connector
    LVDS through optional external adapter

    Up to 3 DP++ interfaces, supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0

    Разрешение видео

    DDIs, eDP: up to 4K
    LVDS: up to 1920 x 1200

    eDP, DP: up to 4096x2304 @ 60Hz, 24bpp
    HDMI: up to 4096x2160 @ 24Hz, 24bpp (HDMI 1.4)
    LVDS, VGA: up to 1920x1200 @ 60Hz

    DP Up to 4096 x 2160 @60HZ
    eDP     Up to 3840 x 2160 @60Hz
    HDMI Up to 3840 x 2160 @30Hz
    LVDS Up to 1920 x 1200 @ 60Hz

    Up to 4K

    Массовое хранение
    2 x S-ATA Gen3 Channels

     4 x S-ATA Gen3 Channels
    SD interface (shared with GPI/Os) 

    Optional eMMC drive onboard
    M.2 SATA SSD slot (Socket 2 Key B Type 3042/2260 **)
    microSD Card slot
    SATA 7p M connector

    ** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.

    Up to 2x internal SATA drives
    2x CFAST Slots
    1x microSD card slot
    PCI-e x4 M.2 Key M NVMe SSD Slot

    Сетевой

    Gigabit Ethernet interface
    Intel® I21x family GbE Controller 

    Gigabit Ethernet interface
    Intel® I219-LM GbE Controller

    2x Gbit LAN / Intel Gigabit Ethernet i21x family controller
    M.2 WWAN Slot for Modems (Socket 2 Key B Type 3042/2260 **)
    M.2 WLAN Connectivity Slot for WiFi/BT (Socket 1 Key E type 2230)

    ** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.

    2x Gigabit LAN / Realtek RTL8111G Gigabit Ethernet controllers

    USB
    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports

    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports 

    2 x USB 3.0 Host ports on USB 3.0 Type-A sockets
    2 x USB 2.0 Host ports on USB 2.0 Type-A sockets
    2 x USB 2.0 Host ports on internal pin header
    1 x USB 3.0 Host port on SSD/WWAN M.2 slot
    1 x USB 2.0 Host port on WLAN M.2 Slot

    2x USB 3.0 Type-A sockets
    2x USB 2.0 Type-A sockets
    2x USB 3.0 on internal pin header
    2x USB 2.0 on internal pin header

    PCI-e

    Up to 4x PCI-e x1 Gen3 lanes + 2 x PCI-e x1 Gen2 ports
    PCI-express Graphics (PEG) x 8 Gen3

    8 x PCI-e x 1 Gen3 lanes
    PCI-express Graphics (PEG) Gen3 x16

    1 x PCI-e x2 port on M.2 SSD/WWAN Slot
    1 x PCI-e x1 port on WLAN M.2 Slot

    1 x PCI-e x4 port on M.2 Key M SSD Slot

    Аудио
    HD Audio Interface
    HD Audio Interface
    HD Audio codec / Cirrus Logic CS4207
    Mic In and Line Out Audio jacks
    Amplified Speaker output on internal pin header

    5.1 non-amplified Jacks
    S/PDIF
    Amplified Audio Stereo + Sub 3x30W

    Последовательные порты

    2 x UARTs

    2 x UARTs
    2 x RS-232/RS-422/RS-485 UARTS software configurable, oninternal Pin Header

    4 x RS-232 Full Modem ports on external DB9 male connectors
    2 x RS-232 Full modem ports on internal IDC pin headers

    Другие интерфейсы

    SPI, I2C bus, SM Bus, LPC bus, FAN management
    LID#/SLEEP#/PWRBTN#, Watchdog
    4x GPI, 4 x GPO

    Optional TPM 1.2 module on-board

    SPI, I2C, SM Bus, Thermal Management, FAN management
    LPC bus
    Optional TPM 2.0 on-board
    LID#/SLEEP#/PWRBTN#, Watchdog 
    4 x GPI, 4 x GPO (pins shared with SD interface)

    2 x I2C + 8 x GPI/Os on Feature connector
    Button / LED front panel header
    CIR (Consumer InfraRed) sensor
    microSIM slot for M.2 WWAN Modem
    Optional TPM 2.0 on-board

    2x FAN connectors
    Optional TPM 1.2
    TPM 2.0 embedded in SoC (Windows support only)
    8 x GPI, 8 x GPO

    Блок питания

    +12VDC ± 10% and + 5VSB (optional)

    +12VDC ± 10% and + 5VSB (optional)

    +18VDC ÷ +32 VDC recommended
    +15VDC ÷ +36VDC absolute
    RTC Battery

    +12VDC ± 5%, mini-Fit 4x2 Power connector
    220mAh non-rechargeable Coin cell battery for RTC

    Потребляемая мощность
    ...
    ...
    ...
    ...
    Операционная система

    Microsoft® Windows 10
    Linux Ubuntu

    Microsoft® Windows 10 
    Linux

    Microsoft® Windows 10 Enterprise (64 bit)
    Microsoft® Windows 10 IoT Core
    Yocto (64 bit)
    Linux

    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Linux

    Рабочая температура

    0°C  ÷ +60 °C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (Commercial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial version)
    -40°C ÷ +85°C (Industrial version) 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Commercial
    Размеры
    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)

    125 x 95 mm (Com Express™ Basic Form factor, Type 6 pinout)

    101.6 x 101.6 mm (4” x 4”)

    300 x 230 x 90 mm (11.81” x 9.05” x 3.54”)

    Security
    ...
    ...
    ...
    ...
    BIOS
    ...
    ...
    ...
    ...
    Embedded Controller Functionalities
    ...
    ...
    ...
    ...
    CAN Bus
    ...
    ...
    ...
    ...
    Functional Safety Features
    ...
    ...
    ...
    ...

    Описание

    Подробности

    COMe-B75-CT6 is a COM Express™ Compact Type 6 with the AMD Ryzen™ Embedded V1000 processors designed by SECO mounting up to 4 Zen x86 CPU cores with the latest Radeon graphics and I/O controller on a single chip. It comes with up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory, a wide range of expansion ports, PCI-Express, Serial Ports, networking and video interfaces, all of which makes it an ideal solution for medical devices, digital signage, and gaming.
    Дополнительная информация

    Дополнительная информация

    Процессор
    AMD Ryzen™ Embedded V1807B with AMD Radeon™ Vega 11 Graphics, Quad Core Dual Thread @ 3.35GHz (3.8 Boost), TDP 35-54W
    AMD Ryzen™ Embedded V1756B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 35-54W
    AMD Ryzen™ Embedded V1605B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 2.0GHz (3.6 Boost), TDP 12-25W
    AMD Ryzen™ Embedded V1202B with AMD Radeon™ Vega 3 Graphics, Dual Core Dual Thread @ 2.3GHz (3.2 Boost), TDP 12-25W
    AMD Ryzen™ Embedded V1404I with AMD Radeon™ Vega 3 Graphics, Quad Core / Single Thread, TDP 15W ,Industrial Temperature range (to be released
    Макс. количество ядер
    4
    Память

    Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC and non- ECC Memory modules (DDR4-2400 with V1605B, V1202B and V1404I)

    Up to 16GB @ 3200Mhz, up to 32GB @ 2400MHz supported

    Графика

    AMD Radeon™ Vega GPU with up to 11 Compute Units
    DirectX® 12 supported
    H.265 (10-bit) decode and 8-bit video encode
    VP9 decode
    4 independent displays supported

    Видеоинтерфейс

    3 x Digital Display Interfaces (DDIs), supporting DP 1.3, DVI and HDMI 1.4/2.0
    eDP or Single/Dual-Channel 18-/24- bit LVDS interface

    Разрешение видео

    DDIs, eDP: up to 4K
    LVDS: up to 1920 x 1200

    Массовое хранение
    2 x S-ATA Gen3 Channels
    Сетевой

    Gigabit Ethernet interface
    Intel® I21x family GbE Controller 

    USB
    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports
    PCI-e

    Up to 4x PCI-e x1 Gen3 lanes + 2 x PCI-e x1 Gen2 ports
    PCI-express Graphics (PEG) x 8 Gen3

    Аудио
    HD Audio Interface
    Последовательные порты

    2 x UARTs

    Другие интерфейсы

    SPI, I2C bus, SM Bus, LPC bus, FAN management
    LID#/SLEEP#/PWRBTN#, Watchdog
    4x GPI, 4 x GPO

    Optional TPM 1.2 module on-board

    Блок питания

    +12VDC ± 10% and + 5VSB (optional)

    Операционная система

    Microsoft® Windows 10
    Linux Ubuntu

    Рабочая температура

    0°C  ÷ +60 °C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Размеры
    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)
    ПРОГРАММНОЕ ОБЕСПЕЧЕНИЕ
    EAPI
    • [Embedded application programming interface] - Release version 1.20.19*
    BIOS
    • [Bios] - Release version 1.06 - download with Chrome or Firefox*
    Windows 10
    • [Driver package] - Release version 02*
    Linux Kernel Patches
    • [Amdgpu kernel package] – Kernel package 4.14.14 for Ubuntu 18.04.1*
    • [Amdgpu kernel package] – Kernel package 4.19.8 for Ubuntu 18.04.1*

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    Документы

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    COMe-B75-CT6

    COMe-B75-CT6
    • ОЦЕНИТЕ НАШУ ПРОДУКЦИЮ

      Максимум 3 шт. на номер изделия
    • ЦЕНА ОБРАЗЦА

      Включена стоимость доставки 
    • ТОЛЬКО ДЛЯ КОРПОРАТИВНЫХ КЛИЕНТОВ

      Техническая поддержка, оказываемая исключительно корпоративным клиентам
    COM Express™ Compact 3.0 Type 6 Module with the AMD Ryzen™ Embedded V1000 processors
    Номер артикула описание номера детали конфигурация номера детали купить образцы онлайн свяжитесь с нами сравнить
    MB75-6001-2111-C0 COMe-B75-CT6 w/AMD Ryzen Embedded V1807B @ 3.35GHz - Ethernet Contr. I211 - EDP Port - Comm. Temp

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