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    COMe-B75-CT6

    COM Express™ Compact 3.0 Type 6 Module with the AMD Ryzen™ Embedded V1000 processors

    • AMD Ryzen™ Embedded V1000 processors
    • 4x USB 3.0; 8x USB 2.0; 4x PCI-e x1 Gen 3, PEG x8 Gen3
    • AMD Radeon™ Vega GPU with up to 11 Compute Units DirectX® 12 supported

    • Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory
    Доступно в промышленном температурном диапазоне

      COMe-B75-CT6

    COMe-B75-CT6

    COMe-A98-CT6

    COMe-A98-CT6

    SYS-A90-IPC

    SYS-A90-IPC

    SBC-B68-eNUC

    SBC-B68-eNUC

     
    Статус разработки продукта
    Процессор
    AMD Ryzen™ Embedded V1807B with AMD Radeon™ Vega 11 Graphics, Quad Core Dual Thread @ 3.35GHz (3.8 Boost), TDP 35-54W
    AMD Ryzen™ Embedded V1756B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 35-54W
    AMD Ryzen™ Embedded V1605B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 2.0GHz (3.6 Boost), TDP 12-25W
    AMD Ryzen™ Embedded V1202B with AMD Radeon™ Vega 3 Graphics, Dual Core Dual Thread @ 2.3GHz (3.2 Boost), TDP 12-25W
    AMD Ryzen™ Embedded V1404I with AMD Radeon™ Vega 3 Graphics, Quad Core / Single Thread, TDP 15W ,Industrial Temperature range (to be released

    AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), TDP 35W
    AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), TDP 35W
    AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), TDP 15W
    AMD RX-416GD, Quad Core @ 1.6 GHz (2.4GHz Max), TDP 15W, Industrial Temperature range

    AMD GX-217GI, Dual Core @1.7GHz (2.0GHz Max), TDP 15W

    AMD GX-224IJ, Dual Core @ 2.4GHz (2.8GHz Max), cTDP 10-15W
    AMD GX-215IJ, Dual Core @1.5GHz (2.0GHz Max), cTDP 6-10W

    AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon)

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    Набор микросхем
    ...
    ...
    ...
    ...
    Макс. количество ядер
    4
    4
    0
    4
    Максимальное количество потоков
    0
    0
    0
    4
    Память
    Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory (DDR4-2400 with V1605B, V1202B and V1404I)

    R-Series: Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 2133MHz
    G-Series SoC-I: Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 1600MHz
    G-Series SoC-J: One SO-DIMM slot supporting DDR4 non-ECC modules up to 2133MHz 

    Up to 2x 8GB DDR4 SODIMM modules

    Quad Channel soldered down LPDDR4 memory, up to 8GB
    Графика

    AMD Radeon™ Vega GPU with up to 11 Compute Units
    DirectX® 12 supported
    H.265 (10-bit) decode and 8-bit video encode
    VP9 decode
    4 independent displays supported

    AMD Radeon 3rd -Generation Graphics Core Next (GCN)
    AMD RX-421BD - Radeon R7
    AMD RX-418GD, RX-416GD - Radeon R6
    AMD-RX-216GD -  Radeon R5
    AMD GX-217GI - Radeon R6E
    AMD GX-224IJ - Radeon R4E
    AMD GX-215IJ - Radeon R2E
    Up to 3 independent displays supported (up to 2 with G-Series SoC-I and SoC-J)
    DirectX® 12 supported
    UVD 6 (4K H.265 and H.264 decode) and VCE 3.1 (4KH.264 encode) supported 

    AMD Radeon 3rd -Generation Graphics Core Next (GCN)
    RX-421BD -Radeon™ R7
    RX-418GD -Radeon™ R6
    RX-216GD -Radeon™ R5
    GX-217GI -Radeon™ R6E
    GX-224IJ, Radeon™ R4E

    Three independent displays supported (two with GX-217GJ and GX-224IJ) DirectX® 12 supported
    Unified Video Decode (UVD) 6 (4K H.265 and H.264 decode)
    Video Coding Engine (VCE) 3.1 (4K H.264 encode)

    Integrated Intel® HD Graphics 500 series controller, with up to 18 Execution Units
    4K HW decoding and encoding of HEVC(H.265), H.264, VP8, VP9, MVC
    Three independent display support

    Видеоинтерфейс

    3 x Digital Display Interfaces (DDIs), supporting DP 1.3, DVI and HDMI 1.4/2.0
    eDP or Single/Dual-Channel 18-/24- bit LVDS interface

    Up to 3 x Digital Display Interfaces (DDIs), supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0 (up to 2x DDIs with G-Series SoC-I and SoC-J)
    Optional VGA interface (excludes one DDI Port)
    Optional eDP or Single / Dual-Channel 18- / 24- bit LVDS interface (excludes one DDI Port)

    Up to 3 DP++ interfaces, supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0

    Two DP++ 1.2 interfaces on miniDP connectors
    (supports HDMI displays through external adapter)
    embedded Display Port (eDP) internal connector
    LVDS through optional external adapter

    Разрешение видео

    DDIs, eDP: up to 4K
    LVDS: up to 1920 x 1200

    DDIs: up to 4K
    LVDS, VGA: up to 1920 x 1200 @ 60Hz 

    Up to 4K

    DP Up to 4096 x 2160 @60HZ
    eDP     Up to 3840 x 2160 @60Hz
    HDMI Up to 3840 x 2160 @30Hz
    LVDS Up to 1920 x 1200 @ 60Hz
    Массовое хранение
    2 x S-ATA Gen3 Channels
    2 x SATA Gen3 Channels
    SD interface shared with GPI/Os

    Up to 2x internal SATA drives
    2x CFAST Slots
    1x microSD card slot
    PCI-e x4 M.2 Key M NVMe SSD Slot

    Optional eMMC drive onboard
    M.2 SATA SSD slot (Socket 2 Key B Type 3042/2260 **)
    microSD Card slot
    SATA 7p M connector

    ** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.

    Сетевой

    Gigabit Ethernet interface
    Intel® I21x family GbE Controller 

    Gigabit Ethernet interface
    Intel® I210 / I211 GbE Controller

    2x Gigabit LAN / Realtek RTL8111G Gigabit Ethernet controllers

    2x Gbit LAN / Intel Gigabit Ethernet i21x family controller
    M.2 WWAN Slot for Modems (Socket 2 Key B Type 3042/2260 **)
    M.2 WLAN Connectivity Slot for WiFi/BT (Socket 1 Key E type 2230)

    ** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.

    USB
    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports
    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports

    2x USB 3.0 Type-A sockets
    2x USB 2.0 Type-A sockets
    2x USB 3.0 on internal pin header
    2x USB 2.0 on internal pin header

    2 x USB 3.0 Host ports on USB 3.0 Type-A sockets
    2 x USB 2.0 Host ports on USB 2.0 Type-A sockets
    2 x USB 2.0 Host ports on internal pin header
    1 x USB 3.0 Host port on SSD/WWAN M.2 slot
    1 x USB 2.0 Host port on WLAN M.2 Slot
    PCI-e

    Up to 4x PCI-e x1 Gen3 lanes + 2 x PCI-e x1 Gen2 ports
    PCI-express Graphics (PEG) x 8 Gen3

    3 x PCI-e x 1 lanes 
    PCI-express Graphics (PEG) x8 (R-Series SoCs) or x4 (G-Series SOC-I and SoC-J)

    1 x PCI-e x4 port on M.2 Key M SSD Slot

    1 x PCI-e x2 port on M.2 SSD/WWAN Slot
    1 x PCI-e x1 port on WLAN M.2 Slot
    Аудио
    HD Audio Interface
    HD Audio Interface

    5.1 non-amplified Jacks
    S/PDIF
    Amplified Audio Stereo + Sub 3x30W

    HD Audio codec / Cirrus Logic CS4207
    Mic In and Line Out Audio jacks
    Amplified Speaker output on internal pin header
    Последовательные порты

    2 x UARTs

    2 x HS UARTs

    4 x RS-232 Full Modem ports on external DB9 male connectors
    2 x RS-232 Full modem ports on internal IDC pin headers

    2 x RS-232/RS-422/RS-485 UARTS software configurable, oninternal Pin Header
    Другие интерфейсы

    SPI, I2C bus, SM Bus, LPC bus, FAN management
    LID#/SLEEP#/PWRBTN#, Watchdog
    4x GPI, 4 x GPO

    SPI, I2C Bus, SM Bus, LPC Bus, 2 x Express Card, FAN management
    LID# / SLEEP# / PWRBTN#, Watchdog
    4 x GPI, 4 x GPO (multiplexed with SD interface)
    Optional TPM 1.2 or 2.0 module onboard 

    2x FAN connectors
    Optional TPM 1.2
    TPM 2.0 embedded in SoC (Windows support only)
    8 x GPI, 8 x GPO

    2 x I2C + 8 x GPI/Os on Feature connector
    Button / LED front panel header
    CIR (Consumer InfraRed) sensor
    microSIM slot for M.2 WWAN Modem
    Optional TPM 2.0 on-board

    Блок питания

    +12VDC ± 10% and + 5VSB (optional)

    +12VDC ± 10% and + 5VSB (optional)

    +12VDC ± 5%, mini-Fit 4x2 Power connector
    220mAh non-rechargeable Coin cell battery for RTC

    +18VDC ÷ +32 VDC recommended
    +15VDC ÷ +36VDC absolute
    RTC Battery

    Потребляемая мощность
    ...
    ...
    ...
    ...
    Операционная система

    Microsoft® Windows 10
    Linux Ubuntu

    Microsoft® Windows 7
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7
    Microsoft® Windows Embedded Standard 8
    Linux

    Microsoft® Windows 7
    Microsoft® Windows 8.1
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7
    Microsoft® Windows Embedded Standard 8
    Linux

    Microsoft® Windows 10 Enterprise (64 bit)
    Microsoft® Windows 10 IoT Core
    Wind River Linux 64 bit
    Yocto (64 bit)
    Android (planning)

    Рабочая температура

    0°C  ÷ +60 °C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Commercial
    0°C  ÷ +60 °C (commercial version)
    -40°C ÷ +85°C (Industrial version) 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Размеры
    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)
    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)

    300 x 230 x 90 mm (11.81” x 9.05” x 3.54”)

    101.6 x 101.6 mm (4” x 4”)
    Security
    ...
    ...
    ...
    ...
    BIOS
    ...
    ...
    ...
    ...
    Embedded Controller Functionalities
    ...
    ...
    ...
    ...

    Описание

    Подробности

    COMe-B75-CT6 is a COM Express™ Compact Type 6 with the AMD Ryzen™ Embedded V1000 processors designed by SECO mounting up to 4 Zen x86 CPU cores with the latest Radeon graphics and I/O controller on a single chip. It comes with up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory, a wide range of expansion ports, PCI-Express, Serial Ports, networking and video interfaces, all of which makes it an ideal solution for medical devices, digital signage, and gaming.
    Дополнительная информация

    Дополнительная информация

    Процессор
    AMD Ryzen™ Embedded V1807B with AMD Radeon™ Vega 11 Graphics, Quad Core Dual Thread @ 3.35GHz (3.8 Boost), TDP 35-54W
    AMD Ryzen™ Embedded V1756B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 35-54W
    AMD Ryzen™ Embedded V1605B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 2.0GHz (3.6 Boost), TDP 12-25W
    AMD Ryzen™ Embedded V1202B with AMD Radeon™ Vega 3 Graphics, Dual Core Dual Thread @ 2.3GHz (3.2 Boost), TDP 12-25W
    AMD Ryzen™ Embedded V1404I with AMD Radeon™ Vega 3 Graphics, Quad Core / Single Thread, TDP 15W ,Industrial Temperature range (to be released
    Макс. количество ядер
    4
    Память
    Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory (DDR4-2400 with V1605B, V1202B and V1404I)
    Графика

    AMD Radeon™ Vega GPU with up to 11 Compute Units
    DirectX® 12 supported
    H.265 (10-bit) decode and 8-bit video encode
    VP9 decode
    4 independent displays supported

    Видеоинтерфейс

    3 x Digital Display Interfaces (DDIs), supporting DP 1.3, DVI and HDMI 1.4/2.0
    eDP or Single/Dual-Channel 18-/24- bit LVDS interface

    Разрешение видео

    DDIs, eDP: up to 4K
    LVDS: up to 1920 x 1200

    Видеоинтерфейс
    SINGLE CHANNEL LVDS, DUAL CHANNEL LVDS, eDP, DDI
    Массовое хранение
    2 x S-ATA Gen3 Channels
    Сетевой

    Gigabit Ethernet interface
    Intel® I21x family GbE Controller 

    USB
    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports
    PCI-e

    Up to 4x PCI-e x1 Gen3 lanes + 2 x PCI-e x1 Gen2 ports
    PCI-express Graphics (PEG) x 8 Gen3

    Аудио
    HD Audio Interface
    Последовательные порты

    2 x UARTs

    Другие интерфейсы

    SPI, I2C bus, SM Bus, LPC bus, FAN management
    LID#/SLEEP#/PWRBTN#, Watchdog
    4x GPI, 4 x GPO

    Блок питания

    +12VDC ± 10% and + 5VSB (optional)

    Операционная система

    Microsoft® Windows 10
    Linux Ubuntu

    Рабочая температура

    0°C  ÷ +60 °C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Размеры
    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)
    ПРОГРАММНОЕ ОБЕСПЕЧЕНИЕ
    EAPI
    • [Embedded application programming interface] - Release version 1.20.19*
    BIOS
    • [Bios] - Release version 1.05*
    Windows 10
    • [Driver package] - Release version 02*
    Linux Kernel Patches
    • [Amdgpu kernel package] – Kernel package 4.14.14 for Ubuntu 18.04.1*
    • [Amdgpu kernel package] – Kernel package 4.19.8 for Ubuntu 18.04.1*

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    Документы

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    COMe-B75-CT6

    COMe-B75-CT6
    • ОЦЕНИТЕ НАШУ ПРОДУКЦИЮ

      Максимум 3 шт. на номер изделия
    • ЦЕНА ОБРАЗЦА

      Включена стоимость доставки 
    • ТОЛЬКО ДЛЯ КОРПОРАТИВНЫХ КЛИЕНТОВ

      Техническая поддержка, оказываемая исключительно корпоративным клиентам
    COM Express™ Compact 3.0 Type 6 Module with the AMD Ryzen™ Embedded V1000 processors
    Номер артикула описание номера детали конфигурация номера детали купить образцы онлайн свяжитесь с нами сравнить
    MB75-3001-1211-C0 COMe-B75-CT6 w/AMD Ryzen Embedded V1202B @ 2.5GHz - Packet Switch - Ethernet Contr. I210 - EDP Port - HUB - TPM - Comm. Temp

    запросить информацию и наличие

    Добавить в сравнение
    MB75-3001-2111-C0 COMe-B75-CT6 w/AMD Ryzen Embedded V1202B @ 2.5GHz - Ethernet Contr. I211 - EDP Port - Comm. Temp

    запросить информацию и наличие

    Добавить в сравнение
    MB75-4001-1211-C0 COMe-B75-CT6 w/AMD Ryzen Embedded V1605B @ 2.0GHz - Packet Switch - Ethernet Contr. I210 - EDP Port - HUB - TPM - Comm. Temp

    запросить информацию и наличие

    Добавить в сравнение
    MB75-4001-2111-C0 COMe-B75-CT6 w/AMD Ryzen Embedded V1605B @ 2.0GHz - Ethernet Contr. I211 - EDP Port - Comm. Temp

    запросить информацию и наличие

    Добавить в сравнение
    MB75-5001-2111-C0 COMe-B75-CT6 w/AMD Ryzen Embedded V1756B @ 3.25GHz - Ethernet Contr. I211 - EDP Port - Comm. Temp

    запросить информацию и наличие

    Добавить в сравнение
    MB75-6001-1211-C0 COMe-B75-CT6 w/AMD Ryzen Embedded V1807B @ 3.35GHz - Packet Switch - Ethernet Contr. I210 - EDP Port - HUB - TPM - Comm. Temp

    запросить информацию и наличие

    Добавить в сравнение
    MB75-6001-2111-C0 COMe-B75-CT6 w/AMD Ryzen Embedded V1807B @ 3.35GHz - Ethernet Contr. I211 - EDP Port - Comm. Temp

    запросить информацию и наличие

    Добавить в сравнение

    • Безопасность/Наблюдение
    • Информационно-развлекательные системы/Вендинг
    • Медицина
    • Промышленная автоматизация
    • Решения для транспорта
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