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    COMe-953-BT6

    COM Express™ Basic Type 6 Module with Intel® Haswell family CPUs

    • Intel® Haswell family CPUs
    • 4x USB 3.0; 8x USB 2.0; 7x PCI-e x1
    • Integrated Intel® HD Graphics 4600
    • Up to 16GB DDR3L-1600 on two SO-DIMM slots

      COMe-953-BT6

    COMe-953-BT6

    COMe-A98-CT6

    COMe-A98-CT6

    COMe-C08-BT6

    COMe-C08-BT6

    SBC-B68-eNUC

    SBC-B68-eNUC

     
    Статус разработки продукта
    Процессор

    Intel® Core™ i3-4100E, Dual Core with HT @ 2.4GHz, 3MB Cache, 37W TDP
    Intel® Core™ i3-4102E, Dual Core with HT @ 1.6GHz, 3MB Cache, 25W TDP
    Intel® Core™ i5-4400E, Dual Core with HT @ 2.7GHz, 3MB Cache, 37W TDP
    Intel® Core™ i5-4402E, Dual Core with HT @ 1.6GHz, 3MB Cache, 25W TDP
    Intel® Core™ i7-4700E,Q Quad Core with HT @ 2.4GHz, 6MB Cache, 47W TDP
    Intel® Celeron® 2002E, Dual Core @1.5GHz, 2MB Cache, 25W TDP
    Intel® Celeron® 2000E, Dual Core @2.2GHz, 2MB Cache, 37W TDP

    AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), TDP 35W
    AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), TDP 35W
    AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), TDP 15W
    AMD RX-416GD, Quad Core @ 1.6 GHz (2.4GHz Max), TDP 15W, Industrial Temperature range

    AMD GX-217GI, Dual Core @1.7GHz (2.0GHz Max), TDP 15W

    Intel® Core™ i7-8850H, Six Core @ 2.6GHz (4.3GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP)
    Intel® Core™ i5-8400H, Quad Core @ 2.5GHz (4.2GHz in Turbo Boost),  with HT, 8MB Cache, 45W TDP
    Intel® Core™ i3-8100H, Quad Core @ 3.0GHz, 6MB Cache, 45W TDP
    Intel® Xeon® E-2176M, Six Core @ 2.7GHz (4.4GHz in Turbo Boost), with HT, 12MB Cache, 45W TDP 

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    Набор микросхем
    Intel® QM87 Chipset
    ...
    Intel® QM370, HM370 or CM246 PCH
    ...
    Макс. количество ядер
    4
    4
    6
    4
    Максимальное количество потоков
    ...
    0
    12
    4
    Память

    Up to 16GB 1.35V DDR3L-1600 on two SO-DIMM slots, supporting dual channel
    M953 modules support non-ECC SO-DIMMs only, MB28 modules support ECC modules only

    Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 2133MHz (up to 1600MHz with GX217GI)

    Two DDR4 SO-DIMM Slots supporting DDR4-2666 Memory, up to 32GB
    ECC DDR4 memory modules supported only with Xeon® and Core™ i3 CPUs combined with CM246 PCH

    Quad Channel soldered down LPDDR4 memory, up to 8GB
    Графика

    Integrated Intel® HD Graphics
    Up to 3 independent displays supported
    DirectX® 11, OpenGL4.0 supported

    AMD Radeon 3rd -Generation Graphics Core Next (GCN)
    AMD RX-421BD - Radeon™ R7
    AMD RX-418GD, RX-416GD - Radeon™ R6
    AMD GX-217GI - Radeon™ R6E
    Up to 3 independent displays supported (up to 2  with GX217GI)
    DirectX® 12 supported
    UVD 6 (4K H.265 and H.264 decode) and VCE 3.1 (4KH.264 encode) supported

    Intel® Gen9 LP graphic core architecture, up to 48 Execution Units
    Up to 3 independent displays supported
    DirectX 12, OpenGL 4.5, and OpenCL 2.1 support
    HW accelerated video decode MPEG2, VC1/WMV9,
    AVC/H.264, VP8, JPEG/MJPEG, HEVC/H.265 (8-/10-bit), VP9
    HW accelerated video encode MPEG2, AVC/H.264, VP8, JPEG
    HEVC/H.265, VP9

    Integrated Intel® HD Graphics 500 series controller, with up to 18 Execution Units
    4K HW decoding and encoding of HEVC(H.265), H.264, VP8, VP9, MVC
    Three independent display support

    Видеоинтерфейс

    3 x HDMI / DVI / Multimode Display Port interfaces
    embedded Display Port or 18 / 24 bit single / dual channel
    LVDS interface
    CRT interface
    PCI Express Graphics (PEG) x 16 interface

    Up to 3 x Digital Display Interfaces (DDIs), supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0
    Optional VGA interface (excludes one DDI Port)
    Optional eDP or Single / Dual-Channel 18- / 24- bit LVDS interface (R-Series SOCs only, excludes one DDI Port)
    PCI-express Graphics (PEG) x 8 (x4 with GX217GI)

    Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI, HDMI 1.4
    eDP or Single/Dual-Channel 18-/24-bit LVDS interface or LVDS + VGA interface

    Two DP++ 1.2 interfaces on miniDP connectors
    (supports HDMI displays through external adapter)
    embedded Display Port (eDP) internal connector
    LVDS through optional external adapter

    Разрешение видео

    CRT Interface, up to 1920 x 1200 @ 60Hz
    HDMI, up to 4096x2304 @ 24Hz / 2560x1600 @ 60Hz
    DVI, up to 1920x1200 @ 60Hz
    Display Port, up to 3840 x 2160 @ 60Hz
    LVDS, eDP: up to 1920 x 1200 @ 60Hz

    DDIs: up to 4K
    LVDS, VGA: up to 1920 x 1200

    eDP, DP: up to 4096x2304 @ 60Hz, 24bpp
    HDMI: up to 4096x2160 @ 24Hz, 24bpp (HDMI 1.4)
    LVDS, VGA: up to 1920x1200 @ 60Hz

    DP Up to 4096 x 2160 @60HZ
    eDP     Up to 3840 x 2160 @60Hz
    HDMI Up to 3840 x 2160 @30Hz
    LVDS Up to 1920 x 1200 @ 60Hz
    Массовое хранение
    4 x external S-ATA channels
    2 x SATA Gen3 Channels
    SD interface shared with GPI/Os

     4 x S-ATA Gen3 Channels
    SD interface (shared with GPI/Os) 

    Optional eMMC drive onboard
    M.2 SATA SSD slot (Socket 2 Key B Type 3042/2260 **)
    microSD Card slot
    SATA 7p M connector

    ** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.

    Сетевой

    Gigabit Ethernet interface
    Supports remote management (Intel® AMT Technology)

    Gigabit Ethernet interface
    Intel® I210 / I211 GbE Controller

    Gigabit Ethernet interface
    Intel® I219-LM GbE Controller

    2x Gbit LAN / Intel Gigabit Ethernet i21x family controller
    M.2 WWAN Slot for Modems (Socket 2 Key B Type 3042/2260 **)
    M.2 WLAN Connectivity Slot for WiFi/BT (Socket 1 Key E type 2230)

    ** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.

    USB
    8 x USB 2.0 Host ports
    4 x USB 3.0 Host ports
    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports

    4 x USB 3.1 Gen2 Host ports
    8 x USB 2.0 Host ports

    2 x USB 3.0 Host ports on USB 3.0 Type-A sockets
    2 x USB 2.0 Host ports on USB 2.0 Type-A sockets
    2 x USB 2.0 Host ports on internal pin header
    1 x USB 3.0 Host port on SSD/WWAN M.2 slot
    1 x USB 2.0 Host port on WLAN M.2 Slot
    PCI-e
    7 x PCI Express x1 ports (configurable as 1 PCI-e x4 + 3 PCI-e x1)
    3 x PCI-e x1 Gen3 lanes

    8 x PCI-e x 1 Gen3 lanes
    PCI-express Graphics (PEG) Gen3 x16

    1 x PCI-e x2 port on M.2 SSD/WWAN Slot
    1 x PCI-e x1 port on WLAN M.2 Slot
    Аудио
    HD Audio Interface
    HD Audio Interface
    HD Audio Interface
    HD Audio codec / Cirrus Logic CS4207
    Mic In and Line Out Audio jacks
    Amplified Speaker output on internal pin header
    Последовательные порты
    2 x serial ports (Tx/Rx only, TTL interface) (MB28 module only)
    ...
    2 x UARTs
    2 x RS-232/RS-422/RS-485 UARTS software configurable, oninternal Pin Header
    Другие интерфейсы

    2 x Express Card Interfaces
    LPC Bus
    I2C Bus
    SM Bus
    4 x GPI, 4 x GPO
    Thermal / FAN management
    WatchDog timer
    Optional TPM onboard (M953 modules only)
    Power Management Signals

    SPI, I2C Bus, SM Bus, LPC Bus, 2 x Express Card, FAN management
    LID# / SLEEP# / PWRBTN#, Watchdog
    4 x GPI, 4 x GPO (multiplexed with SD interface)

    SPI, I2C, SM Bus, Thermal Management, FAN management
    LPC bus
    Optional TPM 2.0 on-board
    LID#/SLEEP#/PWRBTN#, Watchdog
    4 x GPI, 4 x GPO

    2 x I2C + 8 x GPI/Os on Feature connector
    Button / LED front panel header
    CIR (Consumer InfraRed) sensor
    microSIM slot for M.2 WWAN Modem
    Optional TPM 2.0 on-board

    Блок питания

    +12VDC ± 10% and + 5VSB (optional) 

    +12VDC ± 10% and + 5VSB (optional)

    +12VDC ± 10% and + 5VSB (optional)

    +18VDC ÷ +32VDC recommended
    +15VDC ÷ +36VDC absolute
    RTC Battery
    Потребляемая мощность
    ...
    ...
    ...
    ...
    Операционная система

    Microsoft® Windows 7 (32/64 bit)
    Microsoft® Windows 8.1 (32/64 bit)
    Microsoft® Windows 10 (32/64 bit)
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7 (32/64 bit)
    Microsoft® Windows Embedded Standard 8 (32/64 bit)
    Microsoft® Windows Embedded Compact 7
    Linux

    Microsoft® Windows 7
    Microsoft® Windows 8.1
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7
    Microsoft® Windows Embedded Standard 8
    Linux

    Microsoft® Windows 10 
    Linux

    Microsoft® Windows 10 Enterprise (64 bit)
    Microsoft® Windows 10 IoT Core
    Wind River Linux 64 bit
    Yocto (64 bit)
    Android (planning)

    Рабочая температура

    0°C ÷ +60°C (commercial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (Commercial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial version)
    -40°C ÷ +85°C (Industrial version) 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Размеры
    125 x 95 mm (COM Express Basic, 4.92” x 3,74”)
    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)

    125 x 95 mm (Com Express™ Basic Form factor, Type 6 pinout)

    101.6 x 101.6 mm (4” x 4”)

    Описание

    Подробности

    The COMe-953-BT6 is a COM-Express™ type 6, Basic Form Factor module designed by SECO, based on the 4th generation of Intel® iCore CPUs, a series of Dual / Quad Core CPUs with Hyper Threading capabilities and a 64-bit instruction set.

    Integrating a high performance 2D and 3D GPU, along with the QM87 Chipset, which supports many standard x86 interfaces (like SATA, PCI-express, USB 2.0, USB 3.0), this family of processors offers very high performance for all kinds of applications, from graphics to industrial automation.

    Дополнительная информация

    Дополнительная информация

    Процессор

    Intel® Core™ i3-4100E, Dual Core with HT @ 2.4GHz, 3MB Cache, 37W TDP
    Intel® Core™ i3-4102E, Dual Core with HT @ 1.6GHz, 3MB Cache, 25W TDP
    Intel® Core™ i5-4400E, Dual Core with HT @ 2.7GHz, 3MB Cache, 37W TDP
    Intel® Core™ i5-4402E, Dual Core with HT @ 1.6GHz, 3MB Cache, 25W TDP
    Intel® Core™ i7-4700E,Q Quad Core with HT @ 2.4GHz, 6MB Cache, 47W TDP
    Intel® Celeron® 2002E, Dual Core @1.5GHz, 2MB Cache, 25W TDP
    Intel® Celeron® 2000E, Dual Core @2.2GHz, 2MB Cache, 37W TDP

    Набор микросхем
    Intel® QM87 Chipset
    Макс. количество ядер
    4
    Память

    Up to 16GB 1.35V DDR3L-1600 on two SO-DIMM slots, supporting dual channel
    M953 modules support non-ECC SO-DIMMs only, MB28 modules support ECC modules only

    Графика

    Integrated Intel® HD Graphics
    Up to 3 independent displays supported
    DirectX® 11, OpenGL4.0 supported

    Видеоинтерфейс

    3 x HDMI / DVI / Multimode Display Port interfaces
    embedded Display Port or 18 / 24 bit single / dual channel
    LVDS interface
    CRT interface
    PCI Express Graphics (PEG) x 16 interface

    Разрешение видео

    CRT Interface, up to 1920 x 1200 @ 60Hz
    HDMI, up to 4096x2304 @ 24Hz / 2560x1600 @ 60Hz
    DVI, up to 1920x1200 @ 60Hz
    Display Port, up to 3840 x 2160 @ 60Hz
    LVDS, eDP: up to 1920 x 1200 @ 60Hz

    Массовое хранение
    4 x external S-ATA channels
    Сетевой

    Gigabit Ethernet interface
    Supports remote management (Intel® AMT Technology)

    USB
    8 x USB 2.0 Host ports
    4 x USB 3.0 Host ports
    PCI-e
    7 x PCI Express x1 ports (configurable as 1 PCI-e x4 + 3 PCI-e x1)
    Аудио
    HD Audio Interface
    Последовательные порты
    2 x serial ports (Tx/Rx only, TTL interface) (MB28 module only)
    Другие интерфейсы

    2 x Express Card Interfaces
    LPC Bus
    I2C Bus
    SM Bus
    4 x GPI, 4 x GPO
    Thermal / FAN management
    WatchDog timer
    Optional TPM onboard (M953 modules only)
    Power Management Signals

    Блок питания

    +12VDC ± 10% and + 5VSB (optional) 

    Операционная система

    Microsoft® Windows 7 (32/64 bit)
    Microsoft® Windows 8.1 (32/64 bit)
    Microsoft® Windows 10 (32/64 bit)
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7 (32/64 bit)
    Microsoft® Windows Embedded Standard 8 (32/64 bit)
    Microsoft® Windows Embedded Compact 7
    Linux

    Рабочая температура

    0°C ÷ +60°C (commercial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Размеры
    125 x 95 mm (COM Express Basic, 4.92” x 3,74”)
    Software
    BIOS
    • [BIOS] - Release version 1.01*
    EAPI
    • [Embedded application programming interface] - Release version 1.20.11*
    Windows 8
    • [CHIPSET - 32/64 bit] - Driver version 10.0.22*
    • [VIDEO - 32 bit] - Driver version 15.36.3.3907*
    • [VIDEO - 64 bit] - Driver version 15.36.3.64.3907*
    • [RETE - 32 bit] - Driver version 19.3*
    • [RETE - 64 bit] - Driver version 19.3*
    • [MANAGEMENT ENGINE - 32/64 bit] - Driver version 9.5.15.1730*
    Windows 8.1
    • [CHIPSET - 32/64 bit] - Driver version 10.0.22*
    • [VIDEO - 32 bit] - Driver version 15.36.3.3907*
    • [VIDEO - 64 bit] - Driver version 15.36.3.64.3907*
    • [RETE - 32 bit] - Driver version 19.3*
    • [RETE - 64 bit] - Driver version 19.3*
    • [MANAGEMENT ENGINE - 32/64 bit] - Driver version 9.5.15.1730*
    Windows 7
    • [CHIPSET - 32/64 bit] - Driver version 10.0.22*
    • [VIDEO - 32 bit] - Driver version 15.36.3.3907*
    • [VIDEO - 64 bit] - Driver version 15.36.3.64.3907*
    • USB 3.0 eXtensible Host Controller - 32/64 bit - Driver version 3.0.0.33*
    • [RETE - 32 bit] - Driver version 19.3*
    • [RETE - 64 bit] - Driver version 19.3*
    • [MANAGEMENT ENGINE - 32/64 bit] - Driver version 9.5.15.1730*
    Windows Embedded Standard 7
    • [CHIPSET - 32/64 bit] - Driver version 10.0.22*
    • [VIDEO - 32 bit] - Driver version 15.36.3.3907*
    • [VIDEO - 64 bit] - Driver version 15.36.3.64.3907*
    • USB 3.0 eXtensible Host Controller - 32/64 bit - Driver version 3.0.0.33*
    • [RETE - 32 bit] - Driver version 19.3*
    • [RETE - 64 bit] - Driver version 19.3*
    • [MANAGEMENT ENGINE - 32/64 bit] - Driver version 9.5.15.1730*

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    Документы

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    COMe-953-BT6

    COMe-953-BT6
    • ОЦЕНИТЕ НАШУ ПРОДУКЦИЮ

      Максимум 3 шт. на номер изделия
    • ЦЕНА ОБРАЗЦА

      Включена стоимость доставки 
    • ТОЛЬКО ДЛЯ КОРПОРАТИВНЫХ КЛИЕНТОВ

      Техническая поддержка, оказываемая исключительно корпоративным клиентам
    COM Express™ Basic Type 6 Module with Intel® Haswell family CPUs
    Номер артикула описание номера детали конфигурация номера детали купить образцы онлайн свяжитесь с нами сравнить
    M953-5200-1100-C0 COM-Express Type 6 Intel i7-4700EQ Intel i7-4700EQ, Chipset QM87, LVDS output, TPM - non-ECC SO-DIMM memories only

    запросить информацию и наличие

    Добавить в сравнение
    M953-1200-1100-C0 COM-Express Type 6 Intel i3-4102E Intel i3-4102E, Chipset QM87, LVDS output, TPM - non-ECC SO-DIMM memories only

    запросить информацию и наличие

    Добавить в сравнение
    M953-2200-1100-C0 COM-Express Type 6 Intel i3-4100E Intel i3-4100E, Chipset QM87, LVDS output, TPM - non-ECC SO-DIMM memories only

    запросить информацию и наличие

    Добавить в сравнение
    MB28-2200-2000-C0 COM-Express Type 6 Intel i3-4100E Intel i3-4100E, Chipset QM87, eDP output - ECC SO-DIMM memories only

    запросить информацию и наличие

    Добавить в сравнение
    M953-3200-1100-C0 COM-Express Type 6 Intel i5-4402E Intel i5-4402E, Chipset QM87, LVDS output, TPM - non-ECC SO-DIMM memories only

    запросить информацию и наличие

    Добавить в сравнение
    M953-4200-1100-C0 COM-Express Type 6 Intel i5-4400E Intel i5-4400E, Chipset QM87, LVDS output, TPM - non-ECC SO-DIMM memories only

    запросить информацию и наличие

    Добавить в сравнение
    MB28-5200-2000-C0 COM-Express Type 6 Intel i7-4700EQ Intel i7-4700EQ, Chipset QM87, eDP output - ECC SO-DIMM memories only

    запросить информацию и наличие

    Добавить в сравнение

    • Измерительные приборы
    • Информационно-развлекательные системы/Вендинг
    • Медицина
    • Промышленная автоматизация
    • Умные услуги (Электроэнергия-Телеком)
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