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    μQ7-962

    μQseven® standard module with NXP i.MX 6 Processor

    • Single-, Dual- and Quad- Core (ARM® Cortex® -A9 Cores)
    • 4x USB 2.0; 2x Serial ports; CAN Bus
    • 2D/3D dedicated graphics processors
    • up to 2GB DDR3L on-board
    Available in Industrial Temperature Range

      μQ7-962

    μQ7-962

    SM-C12

    SM-C12

    SYS-A62-10

    SYS-A62-10

    SYS-B08-7/BD

    SYS-B08-7/BD

     
    Product Development Status
    Processor
    NXP i.MX 6 Family, based on ARM® CORTEX® -A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    Multicore NXP i.MX 6 processor family
    SYS-A62-10/SOLO: i.MX6S Solo, 1 x ARM Cortex-A9 @1 GHz Core
    SYS-A62-10/LITE: i.MX6DL Dual Lite, 2 x ARM Cortex-A9 @1 GHz Cores
    SYS-A62-10/QUAD: i.MX6Q Quad, 4 x ARM Cortex-A9 @1 GHz Cores
    NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz
    Chipset
    ...
    ...
    ...
    ...
    Max Cores
    4
    0
    0
    1 + 1
    Max Thread
    0
    0
    0
    ...
    Memory
    up to 2GB DDR3L on-board (up to 1GB with i.MX6S)
    Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB
    On-board DDR3L soldered memory;
    SYS-A62-10/SOLO: 512MB 32-bit
    SYS-A62-10/LITE: 1GB 64-bit
    SYS-A62-10/QUAD: 1GB 64-bit
    512MB RAM
    Graphics
    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D and i.MX6Q)
    Supports up to 3 independent displays with i.MX6D and i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S

    Integrated Graphics Processing Unit, supports 2 independent displays
    Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
    Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

    2D, OpenGL® ES2.0 3D HW accelerator
    OpenVG™ accelerator (SYS-A62/10/QUAD only)
    HW encoding of MPEG-4, H.263 V2, H.264, MJPEG
    HW decoding of MPEG-2, VC1, MPEG-4 / XviD, H.263, H.264, DivX

    Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator
    OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1 supported

    Video Interfaces
    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4
    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
    18- / 24-bit Dual Channel LVDS interface or MIPI-DSI interface
    (factory alternatives)
    10,1” LVDS display, resolution 1280 x 800, 30K hours life
    P-Cap (Projected Capacitive touch screen), with 2mm glass cover
    Glass Hardness IK08, Surface Hardness 8H (450g)

    Single Channel 18-/24- bit LVDS connector + Touch Screen (I2C signals)
    24-bit Parallel RGB Connector

    Video Resolution
    HDMI, up to 1080p
    LVDS, up to 1920x1200
    HDMIUp to 4096 x 2160 @ 60 (4K)
    MIPI-DSI, LVDSUp to 1920 x 1080 @ 60Hz
    ...

    LVDS: up to 1366x768 @60Hz, 24bpp
    RGB: up to 1920x1080p @60Hz, 24bpp

    Mass Storage
    Up to 8 GB eMMC drive soldered onboard
    SD / MMC / SDIO interface
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)
    Optional SD 4-bit interface
    QSPI Flash soldered-onboard
    eMMC 5.0 drive soldered on-board
    On-board 4GB eMMC drive
    microSD Card Slot
    SATA Connector (SYS-A62-10/QUAD only)

    16MB NOR Quad-SPI Flash soldered onboard µSD Card slot
    SYS-B08-FULL/D: 8GB eMMC soldered onboard

    Networking
    Gigabit Ethernet interface
    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard
    Gigabit Ethernet connector
    Optional WiFi pluggable module
    1x FastETH
    USB
    1 x USB OTG interface
    4 x USB 2.0 Host interfaces
    2 USB 3.0 Host ports
    2 USB 2.0 Host ports
    1 USB 2.0 OTG port
    2 x USB 2.0 Type-A ports and 1 x USB 2.0 internal connector
    USB micro-B Client port
    1 x USB 2.0 OTG port
    3 x USB 2.0 Host ports on standard Type-A socket
    1 x USB 2.0 Host port on internal pin header
    PCI-e
    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
    2x PCI-e x1 ports
    ...
    ...
    Audio
    I2S / AC’97 Audio Interface
    I2S Audio Interface
    SYS-A62-10/LITE and SYS-A62-10/QUAD: Realtek ALC655
    AC’97 Audio Codec with Mic-In, Line-Out audio Jacks
    I2S Audio interface on programmable pin header
    S / PDIF interface (In and Out) on programmable pin header
    Serial Ports
    2 x Serial ports (TTL interface)
    CAN port interface
    Up to 2x UART Tx/Rx/RTS/CTS
    2x UART Tx/Rx
    1x CAN Bus (TTL level)
    Dedicated Serial ports:
    SYS-A62-10/SOLO: 2 x RS-232 ports 
    SYS-A62-10/LITE: 2 x RS-232 ports, 1 x CAN port
    SYS-A62-10/QUAD: 2 x RS-232 ports, 1 x RS-485 port, 1 x CAN port

    Other serial ports can be realised on expansion connector (see ""Other interfaces"")

    1 x CAN Port reconfigurable as GPIO
    2x RS-232 (Tx/RX signals only) + 1x RS-485 serial ports on expansion pin header

    Other Interfaces
    I2C Bus
    SM Bus
    Power Management Signals

    1x 4-lanes + 1x 2-lanes CSI camera interfaces
    I2C Bus
    SM Bus
    2x SPI interfaces
    QuadSPI interface
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    MIPI-CSI Camera connector
    Programmable expansion connector with:
    SYS-A62-10/SOLO: up to 22 GPIOs, 2 x TTL CAN ports, 1 x UART TTL, 3 x PWM, 2 x I2C, SD, SPI or S/PDIF interfaces
    SYS-A62-10/LITE: up to 20 GPIOs, 1 x TTL CAN port, 1 x UART TTL, 3 x PWM, 2 x I2C, SD, SPI or S/PDIF interfaces
    SYS-A62-10/QUAD: up to 18 GPIOs, 1 x TTL CAN port, 3 x PWM, 2 x I2C, SD, SPI or S/PDIF interfaces

    2 x I2C dedicated connectors (one reserved for Touch Screen)
    6 analog inputs for A/D Conversion
    Programmable (*) expansion pin header connector, able to offer:
    • CSI interface input (PAL and NTSC formats supported)
    • Up to 20 GPIO
    • SPI interface
    • SPDIF Audio interface
    • I2S Audio interface
    • CAN interface (TTL level)
    • 5 x PWM
    • 3 x I2C
    • 3 x serial ports (2x RS-232 +1xRS-485 interface)
    Embedded Low Power RTC
    (*) Please note that some of these interfaces are factory options, other configurations are made via SW using the pin multiplexing possibilities of the i.MX6SX processor.

    Optional 9-Axis Motion Sensors (Accelerometer, Magnetometer and Digital Gyroscope)

    Power Supply
    +5VDC ± 5%

    +5VDC
    +3.3V_RTC

    +12VDC
    SYS-A62-10/SOLO and SYS-A62-10/LITE: internal i.MX6 RTC, require external battery for time/data retention
    SYS-A62-10/QUAD: low power RTC with on-board battery

    +12VDC nominal voltage
    +3VDC cabled Coin Cell Battery

    Power Consumption
    ...
    ...
    ...
    ...
    Operating System
    Linux
    Yocto
    Linux
    Android
    Linux
    Yocto
    Windows® Embedded Compact 7
    Linux
    Operating Temperature

    0°C ÷ +60°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ 50°C

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Commercial
    Dimensions
    40x70 mm (μQseven, 1.57” x 2.76”)
    50 x 82 mm (1.97” x 3.23”)
    269,60 x 189,20 x 17,17 mm
    189.60 x 121.40 x 28.20 mm
    Security
    N/A
    ...
    N/A
    N/A
    BIOS
    N/A
    ...
    N/A
    N/A
    Embedded Controller Functionalities
    N/A
    ...
    N/A
    N/A

    Descrizione

    Dettagli

    μQ7-962 is a Qseven® Rel. 2.0 Compliant Module designed by SECO that offers top computational and graphical performances given by low-power consuming ARM architecture.
    The board integrates i.MX 6 Multimedia Applications platform from NXP, a multimedia processor integrating a multicore Cortex® A9 ARM Core (up to Quad Core processors), ideal for applications requiring multimedia capabilities and/or high levels of parallel computing.
    All this comes in the μQseven form factor, just 40x70mm, introduced with the Qseven® specifications Rel. 2.0.
    Ulteriori informazioni

    Ulteriori informazioni

    Processor
    NXP i.MX 6 Family, based on ARM® CORTEX® -A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core
    Max Cores
    4
    Memory
    up to 2GB DDR3L on-board (up to 1GB with i.MX6S)
    Graphics
    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D and i.MX6Q)
    Supports up to 3 independent displays with i.MX6D and i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S
    Video Interfaces
    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4
    Video Resolution
    HDMI, up to 1080p
    LVDS, up to 1920x1200
    Mass Storage
    Up to 8 GB eMMC drive soldered onboard
    SD / MMC / SDIO interface
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)
    Networking
    Gigabit Ethernet interface
    USB
    1 x USB OTG interface
    4 x USB 2.0 Host interfaces
    PCI-e
    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
    Audio
    I2S / AC’97 Audio Interface
    Serial Ports
    2 x Serial ports (TTL interface)
    CAN port interface
    Other Interfaces
    I2C Bus
    SM Bus
    Power Management Signals
    Power Supply
    +5VDC ± 5%
    Operating System
    Linux
    Yocto
    Operating Temperature

    0°C ÷ +60°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    40x70 mm (μQseven, 1.57” x 2.76”)
    Software
    SECO WIKI
    Linux
    • SECO BSP*
    Linux-YOCTO
    • Yocto meta SECO BSP release Guideline*

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Documentazione

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    μQ7-962

    μQ7-962
    • EVALUATE OUR PRODUCTS

      Max. 3 pcs per part number
    • SAMPLING PRICE

      Shipping costs included
    • BUSINESS TO BUSINESS ONLY

      Technical support provided exclusively to business
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