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    SM-B71

    SMARC Rel. 2.0 compliant module with the Xilinx® Zynq® Ultrascale+™ MPSoC

    • Xilinx® Zynq® Ultrascale+™ CG/EG/EV MPSoCs in C784 package
    • PCI-e x4; 2x GbE; 2x CAN Bus; 2x SPI; 12x GPI/Os
    • Integrated ARM Mali-400 MP2 GPU
    • Up to 8GB + 2GB DDR4 soldered down
    Available in Industrial Temperature Range

      SM-B71

    SM-B71

    SM-B69

    SM-B69

    SM-C12

    SM-C12

    Q7-C26

    Q7-C26

     
    Product Development Status
    Processor

    Xilinx® Zynq® Ultrascale+™ ZU2CG, ZU3CG, ZU4CG or ZU5CG MPSoCs:
    Dual-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit

    Xilinx® Zynq® Ultrascale+™ ZU2EG, ZU3EG, ZU4EG, ZU5EG, ZU4EV or ZU5EV MPSoCs:
    Quad-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    NXP i.MX 8 Family:
    i.MX 8QuadMax - 2x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8QuadPlus - 1x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8Quad - 4x Cortex®-A53 cores + 2x Cortex®-M4F cores

    Chipset
    ...
    ...
    ...
    ...
    Max Cores
    0
    4
    0
    0
    Max Thread
    0
    ...
    0
    0
    Memory
    Soldered Down DDR4-2400 memory
    Up to 8GB for Processing System Unit + up to 2GB for Programmable Logic
    Dual Channel Soldered Down LPDDR4-2400 memory, up to 8GB
    Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB

    soldered down LPDDR4-3200 memory, 64-bit interface

    Graphics
    Only on EG and EV MPSOcs:
    Integrated ARM Mali-400 MP2 Graphics Processing Unit
    Multicore 2D/3D acceleration at 667MHz
    OpenGL ES 1.1 / 2.0, OpenVG 1.0 / 1.1
    On EV MPSoCs only, H.264/H.265 integrated video codec

    Up to 3 independent displays
    Integrated Gen9-LP HD Graphics controller, with 18 Execution Units
    4K HW decoding and encoding of HEVC(H.265), H.264, VP8, SVC, MVC

    Integrated Graphics Processing Unit, supports 2 independent displays
    Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
    Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-2, VC-1, RV9, VP8, H.263 and MPEG4 part, HW encoding of AVC/H.264
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 3.x, DirectX 11

    Video Interfaces
    18- / 24-bit Dual Channel LVDS interface
    DP interface
    2 x CSI interfaces

    eDP + MIPI-DSI interfaces or Dual Channel 18/24bit LVDS interface through eDP-to-LVDS bridge
    HDMI or DP++ interface
    DP++ interface
    2 x CSI interfaces

    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
    18- / 24-bit Dual Channel LVDS interface or MIPI-DSI interface
    (factory alternatives)

    HDMI 2.0a or DP 1.3 interface, supporting HDCP 2.2
    Dual Channel or 2 x Single Channel 18- / 24-bit LVDS interface

    Video Resolution
    DPUp to 4096 x 2160
    LVDSDependent on the IP implemented in the programmable logic
    DP++ Up to 4096 x 2160
    eDP     Up to 3840 x 2160 (4K)
    HDMI Up to 3840 x 2160 (4K)
    LMIPI-DSI, LVDS Up to 1920 x 1200
    HDMIUp to 4096 x 2160 @ 60 (4K)
    MIPI-DSI, LVDSUp to 1920 x 1080 @ 60Hz
    HDMI:Up to 4Kp60
    LVDSUp to 1080p
    Mass Storage

    1 x external S-ATA Gen3 Channel
    SD interface
    QSPI Flash soldered-onboard
    Optional eMMC 4.51 drive soldered on-board

    1 x external S-ATA Gen3 Channel
    SD interface
    Optional eMMC 5.0 drive soldered on-board

    Optional SD 4-bit interface
    QSPI Flash soldered-onboard
    eMMC 5.0 drive soldered on-board

    1x SATA Gen3 interface (alternative to 1x PCI-e x1 port)
    eMMC 5.1 drive soldered on-board
    SD 4-bit interface
    QSPI Flash soldered-on-board

    Networking
    Up to 2 x Gigabit Ethernet interfaces

    Up to 2 x Gigabit Ethernet interfaces
    Intel® I210 or I211 Controller (MAC + PHY)

    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard

    1 x Gigabit Ethernet interface

    USB

    1x USB 2.0 OTG
    2x USB 2.0 Host
    2x USB 3.0 Host

    6 x USB 2.0 Host Ports
    2 x USB 3.0 Host Ports
    2 USB 3.0 Host ports
    2 USB 2.0 Host ports
    1 USB 2.0 OTG port

    4 x USB 2.0 Host Ports 
    1 x USB 3.0 Host Port
    1 x USB 2.0 OTG port

    PCI-e
    PCI-e x4 interface
    4 x PCI-e Root Ports
    2x PCI-e x1 ports

    Up to 2x PCI-e x1 Gen3 ports

    Audio
    Dependent on the IP implemented in the programmable logic
    HD Audio interface
    I2S Audio interface
    I2S Audio Interface

    I2S Audio Interface

    Serial Ports

    2 x UART Tx/Rx/RTS/CTS
    2 x UART Tx/Rx
    2 x CAN Bus

    2 x HS-UARTs
    2 x UARTs

    Up to 2x UART Tx/Rx/RTS/CTS
    2x UART Tx/Rx
    1x CAN Bus (TTL level)

    1x UART Tx/Rx/RTS/CTS
    1x CAN Bus (TTL level)

    Other Interfaces

    2 x I2C Bus
    2 x SPI interfaces
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    Up to 12x GPIOs
    I2C Bus
    SM Bus
    2x SPI interfaces
    LPC Bus
    FAN management
    Power Management Signals

    1x 4-lanes + 1x 2-lanes CSI camera interfaces
    I2C Bus
    SM Bus
    2x SPI interfaces
    QuadSPI interface
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    CSI camera connector
    2x I2C Bus
    SPI interface
    8 x GPI/Os
    Boot select signal
    Power Management Signals
    Watchdog

    Power Supply
    +3÷+5.25VDC
    +3.3V_RTC
    +5VDC and +3.3V_RTC

    +5VDC
    +3.3V_RTC

    +5VDC ± 5%
    +3.3V_RTC

    Power Consumption
    ...
    ...
    ...
    ...
    Operating System
    Linux
    Android

    Microsoft® Windows 10 Enterprise (64 bit)
    Microsoft® Windows 10 IoT Core
    Linux
    Yocto
    Android

    Linux
    Android

    Linux
    Android

    Operating Temperature

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    50 x 82 mm (1.97” x 3.23”)
    50 x 82 mm (1.97” x 3.23”)
    50 x 82 mm (1.97” x 3.23”)
    70x70 mm (2.76” x 2.76”)
    Security
    N/A
    N/A
    N/A
    N/A
    BIOS
    N/A
    N/A
    N/A
    N/A
    Embedded Controller Functionalities
    N/A
    N/A
    N/A
    N/A

    Descrizione

    Dettagli

    The SM-B71 is a SMARC Rel. 2.0 compliant module with the Xilinx® Zynq® Ultrascale+™ MPSoC. Delivering flexibile ARM + FPGA Heterogeneous processing in a standard form factor, this solution is able to merge wide scalability, from cost effective Dual-Core to high performance Quad-Core ARM® Cortex®-A53 MPSoCs with GPU/VCU, and extreme flexibility (up to 256k FPGA logic cells). It also features dedicated Real-Time ARM® Cortex®-R5 processors, along with LVDS and DP video interfaces up to 4K resolution and high-speed interfaces.
    Ulteriori informazioni

    Ulteriori informazioni

    Processor

    Xilinx® Zynq® Ultrascale+™ ZU2CG, ZU3CG, ZU4CG or ZU5CG MPSoCs:
    Dual-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit

    Xilinx® Zynq® Ultrascale+™ ZU2EG, ZU3EG, ZU4EG, ZU5EG, ZU4EV or ZU5EV MPSoCs:
    Quad-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit

    Memory
    Soldered Down DDR4-2400 memory
    Up to 8GB for Processing System Unit + up to 2GB for Programmable Logic
    Graphics
    Only on EG and EV MPSOcs:
    Integrated ARM Mali-400 MP2 Graphics Processing Unit
    Multicore 2D/3D acceleration at 667MHz
    OpenGL ES 1.1 / 2.0, OpenVG 1.0 / 1.1
    On EV MPSoCs only, H.264/H.265 integrated video codec
    Video Interfaces
    18- / 24-bit Dual Channel LVDS interface
    DP interface
    2 x CSI interfaces
    Video Resolution
    DPUp to 4096 x 2160
    LVDSDependent on the IP implemented in the programmable logic
    Mass Storage

    1 x external S-ATA Gen3 Channel
    SD interface
    QSPI Flash soldered-onboard
    Optional eMMC 4.51 drive soldered on-board

    Networking
    Up to 2 x Gigabit Ethernet interfaces
    USB

    1x USB 2.0 OTG
    2x USB 2.0 Host
    2x USB 3.0 Host

    PCI-e
    PCI-e x4 interface
    Audio
    Dependent on the IP implemented in the programmable logic
    Serial Ports

    2 x UART Tx/Rx/RTS/CTS
    2 x UART Tx/Rx
    2 x CAN Bus

    Other Interfaces

    2 x I2C Bus
    2 x SPI interfaces
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    Power Supply
    +3÷+5.25VDC
    +3.3V_RTC
    Operating System
    Linux
    Android
    Operating Temperature

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    50 x 82 mm (1.97” x 3.23”)
    Software

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    Documentazione

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    SM-B71

    SM-B71
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      Max. 3 pcs per part number
    • SAMPLING PRICE

      Shipping costs included
    • BUSINESS TO BUSINESS ONLY

      Technical support provided exclusively to business
    SMARC Rel. 2.0 compliant module with the Xilinx® Zynq® Ultrascale+™ MPSoC
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