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    SM-B69

    SMARC® Rel. 2.0 compliant module with the Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors

    • Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
    • 2x GbE; 6 x USB 2.0; 2 x USB 3.0; 4x PCI-e
    • Integrated Gen9-LP HD Graphics controller
    • Dual Channel Soldered Down LPDDR4-2400 memory
    Available in Industrial Temperature Range

      SM-B69

    SM-B69

    SM-B71

    SM-B71

    Q7-B03

    Q7-B03

    Q7-A36

    Q7-A36

     
    Product Development Status
    Processor

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    Xilinx® Zynq® Ultrascale+™ ZU2CG, ZU3CG, ZU4CG or ZU5CG MPSoCs:
    Dual-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit

    Xilinx® Zynq® Ultrascale+™ ZU2EG, ZU3EG, ZU4EG, ZU5EG, ZU4EV or ZU5EV MPSoCs:
    Quad-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    Intel® Atom™ E3845, Quad Core @1.91GHz, 2MB Cache, 10W TDP
    Intel® Atom™ E3827, Dual Core @1.75GHz, 1MB Cache, 8W TDP
    Intel® Atom™ E3826, Dual Core @1.46GHz, 1MB Cache, 7W TDP
    Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP
    Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP
    Intel® Atom E3805, Dual Core @ 1.33GHz, 1MB Cache, 3W TDP
    Intel® Celeron® J1900, Quad Core @2.0GHz, 2MB Cache, 10W TDP
    Intel® Celeron® N2930, Quad Core @1.83GHz, 2MB Cache, 7.5W TDP
    Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP

    Chipset
    ...
    ...
    ...
    ...
    Max Cores
    4
    0
    4
    4
    Max Thread
    4
    0
    4
    4
    Memory
    Dual Channel Soldered Down LPDDR4-2400 memory, up to 8GB
    Soldered Down DDR4-2400 memory
    Up to 8GB for Processing System Unit + up to 2GB for Programmable Logic
    Dual Channel Soldered Down DDR3L-1866 memory, up to 8GB

    Soldered on-board DDR3L memory
    E3845, E3827, J1900, N2930: up to 8GB Dual-Channel DDR3L @ 1333MHz
    E3826: up to 8GB Dual-Channel DDR3L @ 1066MHz
    N2807: up to 4GB Single-Channel DDR3L @ 1333MHz
    E3825, E3815: up to 4GB Single-Channel DDR3L @ 1066MHz

    Graphics

    Integrated Intel® HD Graphics 500 series controller with up to 18 Execution Units
    Three Independent displays supported
    HW decoding of HEVC(H.265), H.264, MVC, VP8, VP9, MPEG2, VC-1, WMV9, JPEG/MJPEG formats
    HW encoding of HEVC(H.265), H.264, MVC, VP8, VP9 and JPEG/MPEG formats

    Only on EG and EV MPSOcs:
    Integrated ARM Mali-400 MP2 Graphics Processing Unit
    Multicore 2D/3D acceleration at 667MHz
    OpenGL ES 1.1 / 2.0, OpenVG 1.0 / 1.1
    On EV MPSoCs only, H.264/H.265 integrated video codec

    Integrated Intel® HD Graphics 500 series controller with up to 18 Execution Units
    Three Independent displays supported
    HW decoding of HEVC(H.265), H.264, MVC, VP8, VP9, MPEG2, VC-1, WMV9, JPEG/MJPEG formats
    HW encoding of HEVC(H.265), H.264, MVC, VP8, VP9 and JPEG/MPEG formats

    Integrated Intel® HD Graphics 4000 Series controller (not for E3805)
    Dual independent display support
    HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats
    HW encoding of H.264, MPEG2 and MVC formats
    Video Interfaces

    eDP + MIPI-DSI interfaces or Dual Channel 18/24bit LVDS interface
    HDMI or DP++ interface
    DP++ interface
    2 x CSI interfaces

    18- / 24-bit Dual Channel LVDS interface
    DP interface
    2 x CSI interfaces

    eDP interface or Single/Dual Channel 18/24bit LVDS interface
    HDMI or DP++ interface

    HDMI or Multimode Display Port interface (factory options)
    eDP or 18/24 bit dual channel LVDS interface (factory options)
    Optional Camera Interface

    Video Resolution
    DP++ Up to 4096 x 2160 @60HZ
    eDP     Up to 3840 x 2160 @60Hz
    HDMI Up to 3840 x 2160 @30Hz
    MIPI-DSI, LVDS Up to 1920 x 1200 @ 60Hz
    DPUp to 4096 x 2160
    LVDSDependent on the IP implemented in the programmable logic
    DP Up to 4096 x 2160 @60HZ
    eDP     Up to 3840 x 2160 @60Hz
    HDMI Up to 3840 x 2160 @30Hz
    LVDS, VGA Up to 1920 x 1200 @ 60Hz
    HDMIUp to 1920x1080p @ 60Hz
    Display Port, eDP, CRTUp to 2560x1600 @ 60Hz
    Optional LVDS interfaceUp to 1920x1200 @ 60Hz
    Mass Storage

    Optional eMMC 5.0 drive soldered on-board
    External S-ATA Gen3 Channel
    SD interface

    1 x external S-ATA Gen3 Channel
    SD interface
    QSPI Flash soldered-onboard
    Optional eMMC 4.51 drive soldered on-board

    Optional eMMC 5.0 drive soldered on-board
    2 x external S-ATA Gen3 Channels
    SD interface

    2 x external S-ATA channels
    SD Interface
    Optional eMMC Drive soldered on board
    Networking

    Up to 2 x Gigabit Ethernet interfaces
    Intel® I210 or I211 Controller (MAC + PHY)

    Up to 2 x Gigabit Ethernet interfaces
    Gigabit Ethernet interface
    Intel® I210 or I211 Controller (MAC + PHY)
    Gigabit Ethernet interface
    USB
    6 x USB 2.0 Host Ports
    2 x USB 3.0 Host Ports

    1x USB 2.0 OTG
    2x USB 2.0 Host
    2x USB 3.0 Host

    6 x USB 2.0 Host Ports
    2 x USB 3.0 Host Ports (*)

    (*) Second USB 3.0 Host port can be exploited only using
    Qseven® Rel. 2.1 compliant Carrier boards
    1 x USB 3.0 Host port
    6 x USB 2.0 Host ports (one shared with USB 3.0 interface)
    PCI-e
    4 x PCI-e Root Ports
    PCI-e x4 interface
    4 x PCI-e Root Ports (including the PCI-e port used for Gigabit
    Ethernet controller)
    3 x PCI-e x1 lanes
    Audio
    HD Audio interface
    I2S Audio interface
    Dependent on the IP implemented in the programmable logic
    HD Audio interface
    HD Audio Interface
    Serial Ports

    2 x HS-UARTs
    2 x UARTs

    2 x UART Tx/Rx/RTS/CTS
    2 x UART Tx/Rx
    2 x CAN Bus

    1 x UART, TTL interface
    1 x Serial Port (TTL interface)
    Other Interfaces

    Up to 12x GPIOs
    I2C Bus
    SM Bus
    2x SPI interfaces
    FAN management
    Power Management Signals

    2 x I2C Bus
    2 x SPI interfaces
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    I2C Bus
    LPC Bus
    SM Bus
    SPI interface
    Watch Dog Timer
    Thermal / FAN management
    Power Management Signals

    I2C Bus
    LPC Bus
    SM Bus
    Thermal / FAN management
    SPI interface
    Power management signals

    Power Supply
    +5VDC and +3.3V_RTC
    +3÷+5.25VDC
    +3.3V_RTC
    +5VDC and +5VSB (optional)

    +5VDC ± 5%

    Power Consumption
    ...
    ...
    ...
    ...
    Operating System

    Microsoft® Windows 10 Enterprise (64 bit)
    Microsoft® Windows 10 IoT Core
    Linux
    Yocto

    Linux
    Android

    Microsoft® Windows 10 Enterprise (64bit)
    Microsoft® Windows 10 IoT Core
    Linux
    Yocto (64 bit)

    Microsoft® Windows 7 (32/64 bit)
    Microsoft® Windows 8.1 (32/64 bit)
    Microsoft® Windows 10 (32/64 bit)
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7 (32/64 bit)
    Microsoft® Windows Embedded Compact 7
    Linux (32/64 bit)
    Yocto

    Operating Temperature

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    50 x 82 mm (1.97” x 3.23”)
    50 x 82 mm (1.97” x 3.23”)
    70x70 mm (2.76” x 2.76”)
    70x70 mm (2.76” x 2.76”)
    Security
    ...
    ...
    ...
    ...
    BIOS
    ...
    ...
    ...
    ...
    Embedded Controller Functionalities
    ...
    ...
    ...
    ...
    CAN Bus
    ...
    ...
    ...
    ...
    Functional Safety Features
    ...
    ...
    ...
    ...

    Descrizione

    Dettagli

    The SM-B69 is a SMARC Rel. 2.0 compliant module with the Intel® Atom X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly code name Apollo Lake) Processors. This high performance, low power and feature-rich solution is able to run up to 3 independent displays, with 4K HW decoding and encoding of HEVC(H.265), H.264, VP8, SVC, MVC. It features Quad Channel Soldered Down LPDDR4-2400 memory up to 8GB, up to 2 x Gigabit Ethernet interfaces and 2 x MIPI CSI interfaces.

    Ulteriori informazioni

    Ulteriori informazioni

    Processor

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    Max Cores
    4
    Max Thread
    4
    Memory
    Dual Channel Soldered Down LPDDR4-2400 memory, up to 8GB
    Graphics

    Integrated Intel® HD Graphics 500 series controller with up to 18 Execution Units
    Three Independent displays supported
    HW decoding of HEVC(H.265), H.264, MVC, VP8, VP9, MPEG2, VC-1, WMV9, JPEG/MJPEG formats
    HW encoding of HEVC(H.265), H.264, MVC, VP8, VP9 and JPEG/MPEG formats

    Video Interfaces

    eDP + MIPI-DSI interfaces or Dual Channel 18/24bit LVDS interface
    HDMI or DP++ interface
    DP++ interface
    2 x CSI interfaces

    Video Resolution
    DP++ Up to 4096 x 2160 @60HZ
    eDP     Up to 3840 x 2160 @60Hz
    HDMI Up to 3840 x 2160 @30Hz
    MIPI-DSI, LVDS Up to 1920 x 1200 @ 60Hz
    Mass Storage

    Optional eMMC 5.0 drive soldered on-board
    External S-ATA Gen3 Channel
    SD interface

    Networking

    Up to 2 x Gigabit Ethernet interfaces
    Intel® I210 or I211 Controller (MAC + PHY)

    USB
    6 x USB 2.0 Host Ports
    2 x USB 3.0 Host Ports
    PCI-e
    4 x PCI-e Root Ports
    Audio
    HD Audio interface
    I2S Audio interface
    Serial Ports

    2 x HS-UARTs
    2 x UARTs

    Other Interfaces

    Up to 12x GPIOs
    I2C Bus
    SM Bus
    2x SPI interfaces
    FAN management
    Power Management Signals

    Power Supply
    +5VDC and +3.3V_RTC
    Operating System

    Microsoft® Windows 10 Enterprise (64 bit)
    Microsoft® Windows 10 IoT Core
    Linux
    Yocto

    Operating Temperature

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    50 x 82 mm (1.97” x 3.23”)
    Documentazione

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    SM-B69

    SM-B69
    • EVALUATE OUR PRODUCTS

      Max. 3 pcs per part number
    • SAMPLING PRICE

      Shipping costs included
    • BUSINESS TO BUSINESS ONLY

      Technical support provided exclusively to business
    SMARC® Rel. 2.0 compliant module with the Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
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