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Computer on Module with Intel®Atom™ Z5xx series – US15W Chipset
- Intel® Atom™ Z5xx series 1.1 GHz and 1,6 GHz
- 8x USB 2.0; I2C Bus; SMBus
- Intel® GMA500 Integrated Graphic Accelerator
- Up to 1GB DDR2 400/533MHz
SECO has developed its first Qseven® QuadMo747-Z5xx board based on the Intel® Atom™ platform. This module features a typical power consumption of 5 Watts with a passive cooling technology. Its small and squared form - the board measuring just 70mm x 70mm - targets perfectly all mobile applications with its easy integration in the final system of different fields such as Medical, Industrial and Automation.
SECO offers the module QuadMo747-Z5xx with Intel® Atom™ Z5XX series processors: a low end CPU, Intel® Atom™ Z510 at 1.1 GHz (400 MHz FSB), and an high end CPU, Intel® Atom™ Z530 at 1.6 GHz (533 MHz FSB). Both versions have a 512kB L2 cache and support up to 8GB flash modules soldered on board providing a rugged storage solution.
QuadMo747 also provides extensive legacy free connectivity, including: up to 2x PCI Express x1; 1 x SATA; 8 x USB 2.0; 1 x Gigabit Ethernet; 2 x SDIO 8 Bit (1x 8 bit external interface + 1 x microSD slot onboard); LVDS 18 or 24 Bit; 1 x SDVO; 1 x HDA (High Definition Audio); I2C Bus and LPC (Low Pin Count Bus).
The Qseven form factor offers unparalleled flexibility in configuration. By leveraging the Mobile PCI Express Module (MXM) connector format, Qseven® offers three different connector heights up to 7.8mm. Through this configuration it is hoped the Qseven® platform will be as simple to integrate as a DIMM memory module.
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Processor Intel® Atom™ Z5xx series 1.1 GHz and 1,6 GHz Chipset Intel® System Controller Hub US15W
CACHE - 512KB L2
Max Cores 1 Memory Up to 1GB DDR2 400/533MHz Graphics Intel® GMA500 Integrated Graphic Accelerator Video Interfaces Single Channel 18/24 Bit LVDS Transmitter
Video Resolution LVDS, up to 1366 x 768 Mass Storage Onboard Flash Disk up to 8GB
1 x S-ATA channel
SD I/O - 1 x 8-bit interface + 1 x μSD slot onboard
Networking Gigabit Ethernet port (optional) USB 8x USB 2.0 ports PCI-e Up to 2 x PCI Express x 1 ports Audio HD Audio Interface Other Interfaces
LPC BUS for legacy peripherals
Power management signals
Thermal cooling interface
+5VDC ± 5%
Operating System Microsoft® Windows® XP (32 bit)
Microsoft® Windows® 7 (32 bit)
Microsoft® Windows® Embedded Standard 7 (32 bit)
Microsoft® Windows® Embedded Standard 2009 (32 bit)
Microsoft® Windows® CE 6.0
0°C ÷ +60°C (commercial version)
*Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system.
Dimensions 70x70 mm (2.76” x 2.76”)
EVALUATE OUR PRODUCTSMax. 3 pcs per part number
SAMPLING PRICEShipping costs included
BUSINESS TO BUSINESS ONLYTechnical support provided exclusively to business
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|Out of production||Il prodotto è in stato Discontinued|