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    Q7-928

    Qseven® standard module with NXP i.MX 6 Processor

    • Single-, Dual- and Quad- Core (ARM® Cortex® -A9 Cores)
    • 2x serial ports; CAN port
    • 2D/3D dedicated graphics processors
    • up to 4GB DDR3L on-board
    Available in Industrial Temperature Range

      Q7-928

    Q7-928

    μQ7-A76-J

    μQ7-A76-J

    SBC-B08

    SBC-B08

    μQ7-962

    μQ7-962

     
    Product Development Status
    Processor
    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6DP DualPlus - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core

    Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP
    Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP
    Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP

    NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz
    NXP i.MX 6 Family, based on ARM® CORTEX® -A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core
    Chipset
    ...
    ...
    ...
    ...
    Max Cores
    4
    2
    1 + 1
    4
    Max Thread
    0
    2
    ...
    0
    Memory
    Up to 4GB DDR3L on-board (up to 2GB with i.MX6S)

    Soldered onboard DDR3L memory
    E3825, E3815:  up to 4GB Single-Channel DDR3L @ 1066MHz
    N2807: up to 4GB Single-Channel DDR3L @ 1333MHz

    Soldered on-board DDR3L memory, 32-bit interface
    SYS-B08-BASIC/D: 512MB
    SYS-B08-FULL/D: 1GB

    up to 2GB DDR3L on-board (up to 1GB with i.MX6S)
    Graphics

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES 2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D, i.MX6DP and i.MX6Q)
    Enhanced 2D and 3D graphics with i.MX6DP
    Supports up to 3 independent displays with i.MX6D, i.MX6DPand i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S

    Integrated Intel® HD Graphics 4000 Series controller
    Dual independent display support
    HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats
    HW encoding of H.264, MPEG2 and MVC formats

    Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator
    OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1 supported

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D and i.MX6Q)
    Supports up to 3 independent displays with i.MX6D and i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S
    Video Interfaces

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4
    Video Input Port / Camera Connector

    Multimode Display Port (DP++) interface
    18 / 24 bit Dual Channel LVDS interface

    Single Channel 18-/24- bit LVDS connector + Touch Screen (I2C signals)
    24-bit Parallel RGB Connector

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4
    Video Resolution

    LVDS, up to 1920x1200
    HDMI, up to 1080p

    DP++ (HDMI compatible) Up to 2560x1600@60Hz
    LVDS interface Up to 1920x1200@60Hz

    LVDS: up to 1366x768 @60Hz, 24bpp
    RGB: up to 1920x1080p @60Hz, 24bpp

    HDMI, up to 1080p
    LVDS, up to 1920x1200
    Mass Storage

    On-board eMMC drive, up to 32 GB
    SD / MMC / SDIO interface
    1 x μSD Card Slot on-board
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

    2 x external S-ATA channels
    SD interface
    Optional eMMC drive soldered onboard

    16MB NOR Quad-SPI Flash soldered onboard µSD Card slot
    SYS-B08-FULL/D: 8GB eMMC soldered onboard

    Up to 8 GB eMMC drive soldered onboard
    SD / MMC / SDIO interface
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)
    Networking
    Gigabit Ethernet interface
    Gigabit Ethernet interface

    SYS-B08-BASIC/D:1x Fast Ethernet RJ-45 connector
    SYS-B08-FULL/D: 2x Fast Ethernet RJ-45 connector + WiFi (802.11 b/g/n) +BT LE combo module + antenna onboard

    Gigabit Ethernet interface
    USB

    1 x USB OTG interface
    4 x USB 2.0 Host interfaces

    1 x USB 3.0 Host port
    4 x USB 2.0 Host ports (one shared with USB 3.0 interface)
    1 x USB 2.0 OTG port
    3 x USB 2.0 Host ports on standard Type-A socket
    1 x USB 2.0 Host port on internal pin header
    1 x USB OTG interface
    4 x USB 2.0 Host interfaces
    PCI-e
    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
    3 x PCI-e x1 lanes (Gen2)
    ...
    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
    Audio
    AC'97 Audio Interface
    I2S
    HD Audio Interface
    I2S Audio interface on programmable pin header
    S / PDIF interface (In and Out) on programmable pin header
    I2S / AC’97 Audio Interface
    Serial Ports

    2 x serial ports (TTL interface)
    CAN port interface

    1 x Serial Port (TTL interface, Tx/Rx only)

    1 x CAN Port reconfigurable as GPIO
    2x RS-232 (Tx/RX signals only) + 1x RS-485 serial ports on expansion pin header

    2 x Serial ports (TTL interface)
    CAN port interface
    Other Interfaces

    I2C Bus
    LPC Bus
    SM Bus
    Power Management Signals

    I2C bus
    LPC Bus
    SM Bus
    Thermal / FAN Management
    PWR Management signals

    2 x I2C dedicated connectors (one reserved for Touch Screen)
    6 analog inputs for A/D Conversion
    Programmable (*) expansion pin header connector, able to offer:
    • CSI interface input (PAL and NTSC formats supported)
    • Up to 20 GPIO
    • SPI interface
    • SPDIF Audio interface
    • I2S Audio interface
    • CAN interface (TTL level)
    • 5 x PWM
    • 3 x I2C
    • 3 x serial ports (2x RS-232 +1xRS-485 interface)
    Embedded Low Power RTC
    (*) Please note that some of these interfaces are factory options, other configurations are made via SW using the pin multiplexing possibilities of the i.MX6SX processor.

    Optional 9-Axis Motion Sensors (Accelerometer, Magnetometer and Digital Gyroscope)

    I2C Bus
    SM Bus
    Power Management Signals
    Power Supply

    +5VDC ± 5%

    +5VDC ± 5%

    +12VDC nominal voltage
    +3VDC cabled Coin Cell Battery

    +5VDC ± 5%
    Power Consumption
    ...
    ...
    ...
    ...
    Operating System

    Linux
    Yocto
    Microsoft® Windows Embedded Compact 7

    Microsoft® Windows 7
    Microsoft® Windows 8.1
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7
    Microsoft® Windows Embedded Standard 8
    Microsoft® Windows Embedded Compact 7
    Linux
    Yocto

    Android
    Linux

    Linux
    Yocto
    Operating Temperature

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    40 x 70 mm (1.57 x 2.76)
    89.5 x 87 mm (3.52” x 3.43”)
    40x70 mm (μQseven, 1.57” x 2.76”)

    Descrizione

    Dettagli

    Q7-928 is a Qseven® Rel. 2.0 Compliant Module designed by SECO that offers top computational and graphical performances given by low-power consuming ARM architecture.
    The board integrates i.MX6 Multimedia Applications platform from NXP, a multimedia processor integrating a multicore Cortex® A9 ARM Core (up to Quad Core processors), ideal for applications requiring multimedia capabilities and/or high levels of parallel computing.
    Ulteriori informazioni

    Ulteriori informazioni

    Processor
    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6DP DualPlus - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core
    Max Cores
    4
    Memory
    Up to 4GB DDR3L on-board (up to 2GB with i.MX6S)
    Graphics

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES 2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D, i.MX6DP and i.MX6Q)
    Enhanced 2D and 3D graphics with i.MX6DP
    Supports up to 3 independent displays with i.MX6D, i.MX6DPand i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S

    Video Interfaces

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4
    Video Input Port / Camera Connector

    Video Resolution

    LVDS, up to 1920x1200
    HDMI, up to 1080p

    Mass Storage

    On-board eMMC drive, up to 32 GB
    SD / MMC / SDIO interface
    1 x μSD Card Slot on-board
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

    Networking
    Gigabit Ethernet interface
    USB

    1 x USB OTG interface
    4 x USB 2.0 Host interfaces

    PCI-e
    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
    Audio
    AC'97 Audio Interface
    I2S
    Serial Ports

    2 x serial ports (TTL interface)
    CAN port interface

    Other Interfaces

    I2C Bus
    LPC Bus
    SM Bus
    Power Management Signals

    Power Supply

    +5VDC ± 5%

    Operating System

    Linux
    Yocto
    Microsoft® Windows Embedded Compact 7

    Operating Temperature

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    Software
    SECO WIKI
    Linux
    • SECO BSP*
    Linux-YOCTO
    • Yocto meta SECO BSP release Guideline*

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Documentazione

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Q7-928

    Q7-928
    • EVALUATE OUR PRODUCTS

      Max. 3 pcs per part number
    • SAMPLING PRICE

      Shipping costs included
    • BUSINESS TO BUSINESS ONLY

      Technical support provided exclusively to business
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