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    Q7-928

    Qseven® standard module with NXP i.MX 6 Processor

    • Single-, Dual- and Quad- Core (ARM® Cortex® -A9 Cores)
    • 2x serial ports; CAN port
    • 2D/3D dedicated graphics processors
    • up to 4GB DDR3L on-board
    Available in Industrial Temperature Range

      Q7-928

    Q7-928

    SBC-B08

    SBC-B08

    μQ7-A75-J

    μQ7-A75-J

    SYS-A62-10

    SYS-A62-10

     
    Product Development Status
    Processor
    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6DP DualPlus - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core
    NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors

    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core

    Multicore NXP i.MX 6 processor family
    SYS-A62-10/SOLO: i.MX6S Solo, 1 x ARM Cortex-A9 @1 GHz Core
    SYS-A62-10/LITE: i.MX6DL Dual Lite, 2 x ARM Cortex-A9 @1 GHz Cores
    SYS-A62-10/QUAD: i.MX6Q Quad, 4 x ARM Cortex-A9 @1 GHz Cores
    Chipset
    ...
    ...
    ...
    ...
    Max Cores
    4
    1 + 1
    2
    0
    Max Thread
    0
    ...
    ...
    0
    Memory
    Up to 4GB DDR3L on-board (up to 2GB with i.MX6S)

    Soldered on-board DDR3L memory, 32-bit interface
    SYS-B08-BASIC/D: 512MB
    SYS-B08-FULL/D: 1GB

    Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F

    On-board DDR3L soldered memory;
    SYS-A62-10/SOLO: 512MB 32-bit
    SYS-A62-10/LITE: 1GB 64-bit
    SYS-A62-10/QUAD: 1GB 64-bit
    Graphics

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES 2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D, i.MX6DP and i.MX6Q)
    Enhanced 2D and 3D graphics with i.MX6DP
    Supports up to 3 independent displays with i.MX6D, i.MX6DPand i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S

    Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator
    OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1 supported

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Supports 2 independent displays

    2D, OpenGL® ES2.0 3D HW accelerator
    OpenVG™ accelerator (SYS-A62/10/QUAD only)
    HW encoding of MPEG-4, H.263 V2, H.264, MJPEG
    HW decoding of MPEG-2, VC1, MPEG-4 / XviD, H.263, H.264, DivX
    Video Interfaces

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4
    Video Input Port / Camera Connector

    Single Channel 18-/24- bit LVDS connector + Touch Screen (I2C signals)
    24-bit Parallel RGB Connector

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface

    10,1” LVDS display, resolution 1280 x 800, 30K hours life
    P-Cap (Projected Capacitive touch screen), with 2mm glass cover
    Glass Hardness IK08, Surface Hardness 8H (450g)
    Video Resolution

    LVDS, up to 1920x1200
    HDMI, up to 1080p

    LVDS: up to 1366x768 @60Hz, 24bpp
    RGB: up to 1920x1080p @60Hz, 24bpp

    LVDS, resolution up to 1920x1200
    HDMI, resolution up to 1080p

    ...
    Mass Storage

    On-board eMMC drive, up to 32 GB
    SD / MMC / SDIO interface
    1 x μSD Card Slot on-board
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

    16MB NOR Quad-SPI Flash soldered onboard µSD Card slot
    SYS-B08-FULL/D: 8GB eMMC soldered onboard

    On-board eMMC drive, up to 8 GB
    SD / MMC / SDIO interface
    Internal SPI Flash for booting

    On-board 4GB eMMC drive
    microSD Card Slot
    SATA Connector (SYS-A62-10/QUAD only)
    Networking
    Gigabit Ethernet interface

    SYS-B08-BASIC/D:1x Fast Ethernet RJ-45 connector
    SYS-B08-FULL/D: 2x Fast Ethernet RJ-45 connector + WiFi (802.11 b/g/n) +BT LE combo module + antenna onboard

    Fast Ethernet (10/100) interface
    Gigabit Ethernet connector
    Optional WiFi pluggable module
    USB

    1 x USB OTG interface
    4 x USB 2.0 Host interfaces

    1 x USB 2.0 OTG port
    3 x USB 2.0 Host ports on standard Type-A socket
    1 x USB 2.0 Host port on internal pin header

    1 x USB OTG interface
    1 x USB 2.0 Host interface

    2 x USB 2.0 Type-A ports and 1 x USB 2.0 internal connector
    USB micro-B Client port
    PCI-e
    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
    ...

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    ...
    Audio
    AC'97 Audio Interface
    I2S
    I2S Audio interface on programmable pin header
    S / PDIF interface (In and Out) on programmable pin header
    I2S / AC’97 Audio Interface
    SYS-A62-10/LITE and SYS-A62-10/QUAD: Realtek ALC655
    AC’97 Audio Codec with Mic-In, Line-Out audio Jacks
    Serial Ports

    2 x serial ports (TTL interface)
    CAN port interface

    1 x CAN Port reconfigurable as GPIO
    2x RS-232 (Tx/RX signals only) + 1x RS-485 serial ports on expansion pin header

    ...
    Dedicated Serial ports:
    SYS-A62-10/SOLO: 2 x RS-232 ports 
    SYS-A62-10/LITE: 2 x RS-232 ports, 1 x CAN port
    SYS-A62-10/QUAD: 2 x RS-232 ports, 1 x RS-485 port, 1 x CAN port

    Other serial ports can be realised on expansion connector (see ""Other interfaces"")
    Other Interfaces

    I2C Bus
    LPC Bus
    SM Bus
    Power Management Signals

    2 x I2C dedicated connectors (one reserved for Touch Screen)
    6 analog inputs for A/D Conversion
    Programmable (*) expansion pin header connector, able to offer:
    • CSI interface input (PAL and NTSC formats supported)
    • Up to 20 GPIO
    • SPI interface
    • SPDIF Audio interface
    • I2S Audio interface
    • CAN interface (TTL level)
    • 5 x PWM
    • 3 x I2C
    • 3 x serial ports (2x RS-232 +1xRS-485 interface)
    Embedded Low Power RTC
    (*) Please note that some of these interfaces are factory options, other configurations are made via SW using the pin multiplexing possibilities of the i.MX6SX processor.

    Optional 9-Axis Motion Sensors (Accelerometer, Magnetometer and Digital Gyroscope)

    On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
    - Additional SD interface
    - Up to 4 UARTs
    - CAN interface
    - Watchdog(s)
    - I2C interfaces
    - PWM outputs
    - SPI interface
    - Additional Audio interface

    (*) not all the combinations are allowed simultaneously Power Management Signals

    MIPI-CSI Camera connector
    Programmable expansion connector with:
    SYS-A62-10/SOLO: up to 22 GPIOs, 2 x TTL CAN ports, 1 x UART TTL, 3 x PWM, 2 x I2C, SD, SPI or S/PDIF interfaces
    SYS-A62-10/LITE: up to 20 GPIOs, 1 x TTL CAN port, 1 x UART TTL, 3 x PWM, 2 x I2C, SD, SPI or S/PDIF interfaces
    SYS-A62-10/QUAD: up to 18 GPIOs, 1 x TTL CAN port, 3 x PWM, 2 x I2C, SD, SPI or S/PDIF interfaces
    Power Supply

    +5VDC ± 5%

    +12VDC nominal voltage
    +3VDC cabled Coin Cell Battery

    +5VDC ± 5%
    Optional Low Power RTC

    +12VDC
    SYS-A62-10/SOLO and SYS-A62-10/LITE: internal i.MX6 RTC, require external battery for time/data retention
    SYS-A62-10/QUAD: low power RTC with on-board battery

    Power Consumption
    ...
    ...
    ...
    ...
    Operating System

    Linux
    Yocto
    Microsoft® Windows Embedded Compact 7

    Linux

    Linux
    Yocto

    Linux
    Yocto
    Windows® Embedded Compact 7
    Operating Temperature

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (Industrial temp.)* 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ 50°C

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    89.5 x 87 mm (3.52” x 3.43”)
    40x70 mm (1.57” x 2.76”)
    269,60 x 189,20 x 17,17 mm
    Security
    N/A
    N/A
    N/A
    N/A
    BIOS
    N/A
    N/A
    N/A
    N/A
    Embedded Controller Functionalities
    N/A
    N/A
    N/A
    N/A

    Descrizione

    Dettagli

    Q7-928 is a Qseven® Rel. 2.0 Compliant Module designed by SECO that offers top computational and graphical performances given by low-power consuming ARM architecture.
    The board integrates i.MX6 Multimedia Applications platform from NXP, a multimedia processor integrating a multicore Cortex® A9 ARM Core (up to Quad Core processors), ideal for applications requiring multimedia capabilities and/or high levels of parallel computing.
    Ulteriori informazioni

    Ulteriori informazioni

    Processor
    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6DP DualPlus - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core
    Max Cores
    4
    Memory
    Up to 4GB DDR3L on-board (up to 2GB with i.MX6S)
    Graphics

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES 2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D, i.MX6DP and i.MX6Q)
    Enhanced 2D and 3D graphics with i.MX6DP
    Supports up to 3 independent displays with i.MX6D, i.MX6DPand i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S

    Video Interfaces

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4
    Video Input Port / Camera Connector

    Video Resolution

    LVDS, up to 1920x1200
    HDMI, up to 1080p

    Mass Storage

    On-board eMMC drive, up to 32 GB
    SD / MMC / SDIO interface
    1 x μSD Card Slot on-board
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

    Networking
    Gigabit Ethernet interface
    USB

    1 x USB OTG interface
    4 x USB 2.0 Host interfaces

    PCI-e
    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
    Audio
    AC'97 Audio Interface
    I2S
    Serial Ports

    2 x serial ports (TTL interface)
    CAN port interface

    Other Interfaces

    I2C Bus
    LPC Bus
    SM Bus
    Power Management Signals

    Power Supply

    +5VDC ± 5%

    Operating System

    Linux
    Yocto
    Microsoft® Windows Embedded Compact 7

    Operating Temperature

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    Software
    SECO WIKI
    Linux
    • SECO BSP*
    Linux-YOCTO
    • Yocto meta SECO BSP release Guideline*

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Documentazione

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Q7-928

    Q7-928
    • EVALUATE OUR PRODUCTS

      Max. 3 pcs per part number
    • SAMPLING PRICE

      Shipping costs included
    • BUSINESS TO BUSINESS ONLY

      Technical support provided exclusively to business
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