Benvenuti nel sito SECO S.p.A.

×

Registrazione

Informazioni Account

  • Dati di Login

    o Accedi

    Nome obbligatorio!
    Cognome obbligatorio!
    Codice Fiscale obbligatorio
    Società obbligatoria!
    Partita IVA obbligatoria!
    Paese Obbligatorio!
    Nome non valido!
    Cognome non valido!
    Questo non è un indirizzo e-mail!
    Indirizzo e-mail obbligatorio!
    Questa e-mail esiste già!
    Password obbligatoria!
    Inserisci una password valida!
    Inserisci 6 o più caratteri!
    Inserisci 16 o meno caratteri!
    Le password non coincidono!
    Termini e Condizioni obbligatorio!
    E-mail o Password errata!
    Account confirmation is required. Please, check your email for the confirmation link. To resend the confirmation email pleaseclick here

    Q7-796

    Computer on Module based on the Texas Instruments® OMAP™ 37xx Family

    • OMAP™ 37xx Family - ARM Cortex™ A8 up to 1 GHz core
    • 2 x COM ports; CAN interface; 10/100 Base-T interface
    • PowerVR SGX™ Graphics Accelerator + Up to 800MHz TMS320C64x+™ DSP Core
    • Mobile DDR 128 / 256MB / 512 MB onboard
    Available in Industrial Temperature Range

      Q7-796

    Q7-796

    Q7-C25

    Q7-C25

    Q7-C26

    Q7-C26

    μQ7-A75-J

    μQ7-A75-J

     
    Product Development Status
    Processor

    Texas Instruments® OMAP™ 37xx Family:
    AM3703 (Cortex™ A8 up to 1 GHz core)
    DM3730 (Cortex™ A8, up to 1GHz core + PowerVR
    SGX™ Graphics Accelerator + Up to 800MHz
    TMS320C64x+™ DSP Core

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    NXP i.MX 8 Family:
    i.MX 8QuadMax - 2x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8QuadPlus - 1x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8Quad - 4x Cortex®-A53 cores + 2x Cortex®-M4F cores

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors

    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core

    Chipset
    ...
    ...
    ...
    ...
    Max Cores
    1
    0
    0
    2
    Max Thread
    0
    0
    0
    ...
    Memory
    Mobile DDR 128 / 256MB / 512 MB onboard

    soldered down DDR4-2400 memory, 32-bit interface, up to 4GB

    soldered down LPDDR4-3200 memory, 64-bit interface

    Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F

    Graphics
    ...

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC,H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG (not for i.MX8M QuadLite).
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 2.x, DirectX 11

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-2, VC-1, RV9, VP8, H.263 and MPEG4 part, HW encoding of AVC/H.264
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 3.x, DirectX 11

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Supports 2 independent displays

    Video Interfaces
    LVDS Single/Dual Channel 18/24 Bit

    HDMI 2.0a / Display Port 1.3 interface, supporting HDCP 2.2 and HDCP 1.4/1.3
    eDP interface or 18- / 24-bit Dual Channel LVDS interface

    HDMI 2.0a or DP 1.3 interface, supporting HDCP 2.2
    Dual Channel or 2 x Single Channel 18- / 24-bit LVDS interface

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface

    Video Resolution
    LVDS, up to 1366 x 768
    HDMI/DP: Up to 4096 x 2160p60
    LVDS/eDP: Up to 1920 x 1080 @ 60Hz
    HDMI:Up to 4Kp60
    LVDSUp to 1080p

    LVDS, resolution up to 1920x1200
    HDMI, resolution up to 1080p

    Mass Storage
    256 MB / 512MB / 1GB NAND Flash
    eMMC soldered onboard up to 16GB

    eMMC 5.0 drive soldered on-board, up to 64GB
    Optional microSD slot on board
    QSPI Flash soldered-onboard

    1x SATA Gen3 interface (alternative to 1x PCI-e x1 port)
    eMMC 5.1 drive soldered on-board
    SD 4-bit interface
    QSPI Flash soldered-on-board

    On-board eMMC drive, up to 8 GB
    SD / MMC / SDIO interface
    Internal SPI Flash for booting

    Networking
    10/100 Base-T interface

    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard

    1 x Gigabit Ethernet interface

    Fast Ethernet (10/100) interface
    USB
    1x USB OTG
    2x USB 2.0 Host

    1 x USB 3.0 OTG Ports
    Up to 4 x USB 2.0 Host Ports

    4 x USB 2.0 Host Ports 
    1 x USB 3.0 Host Port
    1 x USB 2.0 OTG port

    1 x USB OTG interface
    1 x USB 2.0 Host interface

    PCI-e
    ...

    1x PCI-e x1 port, optional

    Up to 2x PCI-e x1 Gen3 ports

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    Audio
    AC’97 Audio Interface

    I2S Audio Interface

    I2S Audio Interface

    I2S / AC’97 Audio Interface
    Serial Ports
    2 x COM ports

    CAN interface

    1x UART Tx/Rx/RTS/CTS (Optional)
    1x Debug UART
    Optional CAN Bus interface (TTL Level)

    1x UART Tx/Rx/RTS/CTS
    1x CAN Bus (TTL level)

    ...
    Other Interfaces

    MMC/HC MMC/SD/SDHC/SDIO interface
    Video Input Port / Camera Connector
    LPC Bus
    SMBus
    SPI interface
    I2C bus
    JTAG

    I2C Bus
    SM Bus
    Optional SPI interface
    8 x GPI/Os
    UltraLow Power RTC
    Power Management Signals
    Watchdog

    CSI camera connector
    2x I2C Bus
    SPI interface
    8 x GPI/Os
    Boot select signal
    Power Management Signals
    Watchdog

    On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
    - Additional SD interface
    - Up to 4 UARTs
    - CAN interface
    - Watchdog(s)
    - I2C interfaces
    - PWM outputs
    - SPI interface
    - Additional Audio interface

    (*) not all the combinations are allowed simultaneously Power Management Signals

    Power Supply
    ...

    +5VDC ±5% and +5VSB (optional)
    +3.3V_RTC

    +5VDC ± 5%
    +3.3V_RTC

    +5VDC ± 5%
    Optional Low Power RTC

    Power Consumption
    ...
    ...
    ...
    ...
    Operating System
    Microsoft® Windows® CE 6.0

    Linux

    Linux
    Android

    Linux
    Android

    Linux
    Yocto

    Operating Temperature

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version, without WiF+BT optional module)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (Industrial temp.)* 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    70x70 mm (2.76” x 2.76”)
    70x70 mm (2.76” x 2.76”)
    40x70 mm (1.57” x 2.76”)

    Descrizione

    Dettagli

    The Q7-796 is a Qseven® Spec. Rel. 1.20 Compliant Module designed by SECO, which represents the best solution for development of scalable ARM solutions, offering different level of performance and ultra-low power consumption demanding applications.


    The board integrates the OMAP™ 37xx platform of Texas Instruments®, an application Processor integrating a Cortex™ A8 core. The processor is available in different versions, in order to meet all kind of customers needing.

    Ulteriori informazioni

    Ulteriori informazioni

    Processor

    Texas Instruments® OMAP™ 37xx Family:
    AM3703 (Cortex™ A8 up to 1 GHz core)
    DM3730 (Cortex™ A8, up to 1GHz core + PowerVR
    SGX™ Graphics Accelerator + Up to 800MHz
    TMS320C64x+™ DSP Core

    Max Cores
    1
    Memory
    Mobile DDR 128 / 256MB / 512 MB onboard
    Video Interfaces
    LVDS Single/Dual Channel 18/24 Bit
    Video Resolution
    LVDS, up to 1366 x 768
    Mass Storage
    256 MB / 512MB / 1GB NAND Flash
    eMMC soldered onboard up to 16GB
    Networking
    10/100 Base-T interface
    USB
    1x USB OTG
    2x USB 2.0 Host
    Audio
    AC’97 Audio Interface
    Serial Ports
    2 x COM ports

    CAN interface
    Other Interfaces

    MMC/HC MMC/SD/SDHC/SDIO interface
    Video Input Port / Camera Connector
    LPC Bus
    SMBus
    SPI interface
    I2C bus
    JTAG

    Operating System
    Microsoft® Windows® CE 6.0

    Linux
    Operating Temperature

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    Software

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Documentazione
    Data Sheet
    Manual
    • quadmo747_x_omap3_manual_rel1_5.pdf*

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Q7-796

    Q7-796
    • EVALUATE OUR PRODUCTS

      Max. 3 pcs per part number
    • SAMPLING PRICE

      Shipping costs included
    • BUSINESS TO BUSINESS ONLY

      Technical support provided exclusively to business
    Computer on Module based on the Texas Instruments® OMAP™ 37xx Family
    sku part number part number description part number configuration buy samples online Contattaci compare
    M796-LLMCFBBI Qseven OMAP DM3730 OMAP3 DM3730CUSD100 @1GHz - 512MB 200MHz DDR SDRAM - SSD 1GB - 10/100 ETH - eMMC 4GB - CAMERA Connector - CAN Controller - Ind. Temp Confronta
    M796-FFPBCBBC Qseven OMAP DM3730 OMAP DM3730CUS100 @1GHz, 512MB 200MHz DDR SDRAM, SSD 512MB,10/100 ETH, eMMC 8GB, CAMERA Connector, CAN Controller (commercial temp.) Confronta
    M796-MLQCFBBI Qseven OMAP AM3703 OMAP AM3703CUSD100 @1GHz - 512MB 200MHz DDR SDRAM, SSD 512MB, 10/100 ETH, eMMC 4GB, CAMERA Connector, CAN Controller (industrial temp.) Confronta

    • Devices
    • Industrial Automation
    • Iot
    • Medical
    • Transportation
    Top