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    Q7-796

    Computer on Module based on the Texas Instruments® OMAP™ 37xx Family

    • OMAP™ 37xx Family - ARM Cortex™ A8 up to 1 GHz core
    • 2 x COM ports; CAN interface; 10/100 Base-T interface
    • PowerVR SGX™ Graphics Accelerator + Up to 800MHz TMS320C64x+™ DSP Core
    • Mobile DDR 128 / 256MB / 512 MB onboard
    Available in Industrial Temperature Range

      Q7-796

    Q7-796

    SYS-A62-10

    SYS-A62-10

    Q7-C25

    Q7-C25

    μQ7-962

    μQ7-962

     
    Product Development Status
    Processor

    Texas Instruments® OMAP™ 37xx Family:
    AM3703 (Cortex™ A8 up to 1 GHz core)
    DM3730 (Cortex™ A8, up to 1GHz core + PowerVR
    SGX™ Graphics Accelerator + Up to 800MHz
    TMS320C64x+™ DSP Core

    Multicore NXP i.MX 6 processor family
    SYS-A62-10/SOLO: i.MX6S Solo, 1 x ARM Cortex-A9 @1 GHz Core
    SYS-A62-10/LITE: i.MX6DL Dual Lite, 2 x ARM Cortex-A9 @1 GHz Cores
    SYS-A62-10/QUAD: i.MX6Q Quad, 4 x ARM Cortex-A9 @1 GHz Cores

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    NXP i.MX 6 Family, based on ARM® CORTEX® -A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core
    Chipset
    ...
    ...
    ...
    ...
    Max Cores
    1
    0
    0
    4
    Max Thread
    0
    0
    0
    0
    Memory
    Mobile DDR 128 / 256MB / 512 MB onboard
    On-board DDR3L soldered memory;
    SYS-A62-10/SOLO: 512MB 32-bit
    SYS-A62-10/LITE: 1GB 64-bit
    SYS-A62-10/QUAD: 1GB 64-bit

    soldered down DDR4-2400 memory, 32-bit interface, up to 4GB

    up to 2GB DDR3L on-board (up to 1GB with i.MX6S)
    Graphics
    ...
    2D, OpenGL® ES2.0 3D HW accelerator
    OpenVG™ accelerator (SYS-A62/10/QUAD only)
    HW encoding of MPEG-4, H.263 V2, H.264, MJPEG
    HW decoding of MPEG-2, VC1, MPEG-4 / XviD, H.263, H.264, DivX

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC,H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG (not for i.MX8M QuadLite).
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 2.x, DirectX 11

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D and i.MX6Q)
    Supports up to 3 independent displays with i.MX6D and i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S
    Video Interfaces
    LVDS Single/Dual Channel 18/24 Bit
    10,1” LVDS display, resolution 1280 x 800, 30K hours life
    P-Cap (Projected Capacitive touch screen), with 2mm glass cover
    Glass Hardness IK08, Surface Hardness 8H (450g)

    HDMI 2.0a / Display Port 1.3 interface, supporting HDCP 2.2 and HDCP 1.4/1.3
    eDP interface or 18- / 24-bit Dual Channel LVDS interface

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4
    Video Resolution
    LVDS, up to 1366 x 768
    ...
    HDMI/DP: Up to 4096 x 2160p60
    LVDS/eDP: Up to 1920 x 1080 @ 60Hz
    HDMI, up to 1080p
    LVDS, up to 1920x1200
    Mass Storage
    256 MB / 512MB / 1GB NAND Flash
    eMMC soldered onboard up to 16GB
    On-board 4GB eMMC drive
    microSD Card Slot
    SATA Connector (SYS-A62-10/QUAD only)

    eMMC 5.0 drive soldered on-board, up to 64GB
    Optional microSD slot on board
    QSPI Flash soldered-onboard

    Up to 8 GB eMMC drive soldered onboard
    SD / MMC / SDIO interface
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)
    Networking
    10/100 Base-T interface
    Gigabit Ethernet connector
    Optional WiFi pluggable module

    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard

    Gigabit Ethernet interface
    USB
    1x USB OTG
    2x USB 2.0 Host
    2 x USB 2.0 Type-A ports and 1 x USB 2.0 internal connector
    USB micro-B Client port

    1 x USB 3.0 OTG Ports
    Up to 4 x USB 2.0 Host Ports

    1 x USB OTG interface
    4 x USB 2.0 Host interfaces
    PCI-e
    ...
    ...

    1x PCI-e x1 port, optional

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
    Audio
    AC’97 Audio Interface
    SYS-A62-10/LITE and SYS-A62-10/QUAD: Realtek ALC655
    AC’97 Audio Codec with Mic-In, Line-Out audio Jacks

    I2S Audio Interface

    I2S / AC’97 Audio Interface
    Serial Ports
    2 x COM ports

    CAN interface
    Dedicated Serial ports:
    SYS-A62-10/SOLO: 2 x RS-232 ports 
    SYS-A62-10/LITE: 2 x RS-232 ports, 1 x CAN port
    SYS-A62-10/QUAD: 2 x RS-232 ports, 1 x RS-485 port, 1 x CAN port

    Other serial ports can be realised on expansion connector (see ""Other interfaces"")

    1x UART Tx/Rx/RTS/CTS (Optional)
    1x Debug UART
    Optional CAN Bus interface (TTL Level)

    2 x Serial ports (TTL interface)
    CAN port interface
    Other Interfaces

    MMC/HC MMC/SD/SDHC/SDIO interface
    Video Input Port / Camera Connector
    LPC Bus
    SMBus
    SPI interface
    I2C bus
    JTAG

    MIPI-CSI Camera connector
    Programmable expansion connector with:
    SYS-A62-10/SOLO: up to 22 GPIOs, 2 x TTL CAN ports, 1 x UART TTL, 3 x PWM, 2 x I2C, SD, SPI or S/PDIF interfaces
    SYS-A62-10/LITE: up to 20 GPIOs, 1 x TTL CAN port, 1 x UART TTL, 3 x PWM, 2 x I2C, SD, SPI or S/PDIF interfaces
    SYS-A62-10/QUAD: up to 18 GPIOs, 1 x TTL CAN port, 3 x PWM, 2 x I2C, SD, SPI or S/PDIF interfaces

    I2C Bus
    SM Bus
    Optional SPI interface
    8 x GPI/Os
    UltraLow Power RTC
    Power Management Signals
    Watchdog

    I2C Bus
    SM Bus
    Power Management Signals
    Power Supply
    ...

    +12VDC
    SYS-A62-10/SOLO and SYS-A62-10/LITE: internal i.MX6 RTC, require external battery for time/data retention
    SYS-A62-10/QUAD: low power RTC with on-board battery

    +5VDC ±5% and +5VSB (optional)
    +3.3V_RTC

    +5VDC ± 5%
    Power Consumption
    ...
    ...
    ...
    ...
    Operating System
    Microsoft® Windows® CE 6.0

    Linux
    Linux
    Yocto
    Windows® Embedded Compact 7

    Linux
    Android

    Linux
    Yocto
    Operating Temperature

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ 50°C

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version, without WiF+BT optional module)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    269,60 x 189,20 x 17,17 mm
    70x70 mm (2.76” x 2.76”)
    40x70 mm (μQseven, 1.57” x 2.76”)
    Security
    N/A
    N/A
    N/A
    N/A
    BIOS
    N/A
    N/A
    N/A
    N/A
    Embedded Controller Functionalities
    N/A
    N/A
    N/A
    N/A

    Descrizione

    Dettagli

    The Q7-796 is a Qseven® Spec. Rel. 1.20 Compliant Module designed by SECO, which represents the best solution for development of scalable ARM solutions, offering different level of performance and ultra-low power consumption demanding applications.


    The board integrates the OMAP™ 37xx platform of Texas Instruments®, an application Processor integrating a Cortex™ A8 core. The processor is available in different versions, in order to meet all kind of customers needing.

    Ulteriori informazioni

    Ulteriori informazioni

    Processor

    Texas Instruments® OMAP™ 37xx Family:
    AM3703 (Cortex™ A8 up to 1 GHz core)
    DM3730 (Cortex™ A8, up to 1GHz core + PowerVR
    SGX™ Graphics Accelerator + Up to 800MHz
    TMS320C64x+™ DSP Core

    Max Cores
    1
    Memory
    Mobile DDR 128 / 256MB / 512 MB onboard
    Video Interfaces
    LVDS Single/Dual Channel 18/24 Bit
    Video Resolution
    LVDS, up to 1366 x 768
    Mass Storage
    256 MB / 512MB / 1GB NAND Flash
    eMMC soldered onboard up to 16GB
    Networking
    10/100 Base-T interface
    USB
    1x USB OTG
    2x USB 2.0 Host
    Audio
    AC’97 Audio Interface
    Serial Ports
    2 x COM ports

    CAN interface
    Other Interfaces

    MMC/HC MMC/SD/SDHC/SDIO interface
    Video Input Port / Camera Connector
    LPC Bus
    SMBus
    SPI interface
    I2C bus
    JTAG

    Operating System
    Microsoft® Windows® CE 6.0

    Linux
    Operating Temperature

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    Software

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Documentazione
    Data Sheet
    Manual
    • quadmo747_x_omap3_manual_rel1_5.pdf*

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Q7-796

    Q7-796
    • EVALUATE OUR PRODUCTS

      Max. 3 pcs per part number
    • SAMPLING PRICE

      Shipping costs included
    • BUSINESS TO BUSINESS ONLY

      Technical support provided exclusively to business
    Computer on Module based on the Texas Instruments® OMAP™ 37xx Family
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