SM-B71

SMARC Rel. 2.0 compliant module with the Xilinx® Zynq® Ultrascale+™ MPSoC

Status prodotto

Development
Sampling
Production
Disponibile nell'intervallo di temperatura industriale

Contattaci per maggiori informazioni o quotazioni

CPU

Xilinx® Zynq® Ultrascale+™ CG/EG/EV MPSoCs in C784 package

Graphics

Integrated ARM Mali-400 MP2 GPU

Connectivity

PCI-e x4; 2x GbE; 2x CAN Bus; 2x SPI; 12x GPI/Os

Memory

Up to 8GB + 2GB DDR4 soldered down

Dettaglio prodotto

Caratteristiche tecniche

  • Description
    The SM-B71 is a SMARC Rel. 2.0 compliant module with the Xilinx® Zynq® Ultrascale+™ MPSoC. Delivering flexibile ARM + FPGA Heterogeneous processing in a standard form factor, this solution is able to merge wide scalability, from cost effective Dual-Core to high performance Quad-Core ARM® Cortex®-A53 MPSoCs with GPU/VCU, and extreme flexibility (up to 256k FPGA logic cells). It also features dedicated Real-Time ARM® Cortex®-R5 processors, along with LVDS and DP video interfaces up to 4K resolution and high-speed interfaces.
  • Processor

    Xilinx® Zynq® Ultrascale+™ ZU2CGZU3CGZU4CG or ZU5CG MPSoCs:
    Dual-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit

    Xilinx® Zynq® Ultrascale+™ ZU2EGZU3EGZU4EGZU5EGZU4EV or ZU5EV MPSoCs:
    Quad-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit

  • Memory

    Soldered Down DDR4-2400 memory
    Up to 8GB for Processing System Unit + up to 2GB for Programmable Logic

  • Graphics

    Only on EG and EV MPSOcs:
    Integrated ARM Mali-400 MP2 Graphics Processing Unit
    Multicore 2D/3D acceleration at 667MHz
    OpenGL ES 1.1 / 2.0, OpenVG 1.0 / 1.1
    On EV MPSoCs only, H.264/H.265 integrated video codec

  • Video Interfaces

    18- / 24-bit Dual Channel LVDS interface
    DP interface
    2 x CSI interfaces

  • Video Resolution

    DP Up to 4096 x 2160
    LVDS Dependent on the IP implemented in the programmable logic

  • Mass Storage

    1 x external S-ATA Gen3 Channel
    SD interface
    QSPI Flash soldered-onboard
    Optional eMMC 4.51 drive soldered on-board

  • Networking

    Up to 2 x Gigabit Ethernet interfaces

  • USB

    1x USB 2.0 OTG
    2x USB 2.0 Host
    2x USB 3.0 Host

  • PCI-e

    PCI-e x4 interface

  • Audio

    Dependent on the IP implemented in the programmable logic

  • Serial Ports

    2 x UART Tx/Rx/RTS/CTS
    2 x UART Tx/Rx
    2 x CAN Bus

  • Other Interfaces

    2 x I2C Bus
    2 x SPI interfaces
    12 x GPI/Os
    Boot select signals
    Power Management Signals

  • Power Supply

    +3÷+5.25VDC
    +3.3V_RTC

  • Operating System

    Linux
    Android
     

  • Operating Temperature

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

  • Dimensions
    50 x 82 mm (1.97” x 3.23”)

Part Number

  • EB71-6211-1200-C0

    Part number description
    SM-B71 w/ZU4EG Quad Core+ GPU 1,30GHz Xilinx Zynq Ultrascale+, PS DRAM 2 GB, PL DRAM 512M, eMMC 4 GB, SecondGigabit Ethernet SGMII, Si510 - Commercial temperature range
    Contact us for more informations or quotes
    CONTATTACI

Related Products

SMARC DEV KIT
SMARC 2.0 Development Kit
Development
Visualizza Prodotto
RB71-DISS-1-PK
SMARC HEAT SPREADER: SM-B71 Heat Spreader (PASSIVE) - Packaged
Production
Visualizza Prodotto
RB71-DISS-2-PK
SMARC HEAT SPREADER: SM-C12 Heat Spreader (PASSIVE) - Packaged
Production
Visualizza Prodotto