Q7-C25

Qseven® Rel. 2.1 compliant module with NXP i.MX 8M Applications Processors

Status prodotto

Development
Sampling
Production
Disponibile nell'intervallo di temperatura industriale

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CPU

NXP i.MX 8M Applications Processors

Graphics

Integrated GPU, supports 2 independent displays

Connectivity

1x USB 3.0; 4x USB2.0; up to 2x PCI-e x1 Gen2; 1x CAN Bus; 2x UART; 8x GPI/Os

Memory

up to 4GB soldered down DDR4-2400 memory

Dettaglio prodotto

Caratteristiche tecniche

  • Description
    The Q7-C25 is a Qseven® Rel. 2.1 compliant module based on the NXP i.MX 8M Applications Processors with multicore processing: Dual or Quad ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor for realtime applications and 4Kp60 HEVC decoding with HDR. Q7-C25 is a scalable solution for applications like domotics or vending, requiring advanced security, connectivity and multimedia.
  • Processor

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
     i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
     i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    • i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

  • Memory

    soldered down DDR4-2400 memory, 32-bit interface, up to 4GB

  • Graphics

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC,H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG (not for i.MX8M QuadLite).
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 2.x, DirectX 11

  • Video Interfaces

    HDMI 2.0a / Display Port 1.3 interface, supporting HDCP 2.2 and HDCP 1.4/1.3
    eDP interface or 18- / 24-bit Dual Channel LVDS interface

  • Video Resolution

    HDMI/DP Up to 4096 x 2160p60

    LVDS/eDP Up to 1920 x 1080 @ 60Hz

  • Mass Storage

    eMMC 5.0 drive soldered on-board, up to 64GB
    Optional microSD slot on board
    QSPI Flash soldered-onboard

  • Networking

    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard

  • USB

    1 x USB 3.0 OTG Ports
    Up to 4 x USB 2.0 Host Ports

  • PCI-e

    Up to 2 x PCI-e x1 Gen2 ports

  • Audio

    I2S Audio Interface

  • Serial Ports

    1x UART Tx/Rx/RTS/CTS (Optional)
    1x Debug UART
    Optional CAN Bus interface (TTL Level)

  • Other Interfaces

    I2C Bus
    SM Bus
    Optional SPI interface
    8 x GPI/Os
    UltraLow Power RTC
    Power Management Signals
    Watchdog

  • Power Supply

    +5VDC ±5% and +5VSB (optional)
    +3.3V_RTC

  • Operating System

    Linux
    Yocto
    Android

  • Operating Temperature

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version, without WiF+BT optional module)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

  • Dimensions
    70x70 mm (2.76” x 2.76”)

Software

Part Number

  • EC25-2350-4134-C0

    Part number description
    Q7-C25 W/NXP i.MX8M Quad 1.5 GHz (VPU decode + HDR10 + GPU) , DDR4 4GB, eMMC 64 GB, LVDS , uSD on board, PCIe, CAN, WIFI, RTC,com. Temp
    Contact us for more informations or quotes
    CONTATTACI

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