Compact COM Express™ Rel. 3.0 Type 6 module with the 8th Gen Intel® Core™ and Celeron™ 4000 series processors (formerly Whiskey Lake)

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8th Gen Intel® Core™ and Celeron™ 4000 series processors (formerly Whiskey Lake) with 15W TDP


Intel® UHD Graphics 620/610


4 x USB 3.1; 8 x USB 2.0, up to 8 x PCI-e x 1


Two DDR4 SO-DIMM Slots supporting DDR4-2400 Memory, up to 64GB

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Caratteristiche tecniche

  • Description
    Low power multi-core Intel® architecture for mobile applications
  • Processor

    Intel® Core™ i7-8665UE, Quad Core @ 1.7GHz (Turbo Boost 4.4GHz) with HT, 8MB Cache, 15W TDP (12.5W..25W cTDP)
    Intel® Core™ i5-8365UE, Quad Core @ 1.6GHz (Turbo Boost 4.1GHz) with HT, 6MB Cache, 15W TDP (12.5W..25W cTDP)
    Intel® Core™ i3-8145UE, Dual Core @ 2.2GHz (Turbo Boost 3.9GHz) with HT, 4MB Cache, 15W TDP (12.5W..25W cTDP)
    Intel® Celeron® 4305UE, Dual Core @ 2.0GHz, 2MB Cache, 15W TDP

  • Max Cores
  • Max Threads
  • Memory

    Two DDR4 SO-DIMM Slots supporting DDR4-2400 Memory, up to 64GB

  • Graphics

    Intel® UHD Graphics 620 (Core™ processors), 610 (Celeron™ processor)
    Up to 3 independent display supported
    DirectX 12, OpenGL 4.5, and OpenCL 2.1 support
    HW accelerated video decode MPEG2, VC1/WMV9, AVC/H.264,
    VP8, JPEG/MJPEG, HEVC/H.265 (8 and 10 bits), VP9
    HW accelerated video encode MPEG2, AVC/H.264, VP8, JPEG,
    HEVC/H.265, VP9

  • Video Interfaces

    Up to 2 x Digital Display Interfaces (DDIs), supporting DP 1.2, eDP 1.4, HDMI 1.4 and DVI
    eDP or Single/Dual-Channel 18-/24- bit LVDS interface
    Optional VGA interface (excludes DDI port #2)

  • Video Resolution

    eDP, DP: up to 4096 x 2304 @60Hz
    HDMI: up to 4096 x 2160 @30Hz
    LVDS: up to 1920 x 1200 @ 60Hz
    VGA: up to 2048 x 1536 @ 50Hz (reduced blanking)

  • Mass Storage

    Up to 3 x S-ATA Gen3 Channels
    Optional eMMC 5.1 drive on-board
    microSD Card slot on-board

  • Networking

    Gigabit Ethernet interface
    Intel® I219-LM GbE Controller

  • USB

    4 x USB 3.1 Host ports
    8 x USB 2.0 Host ports

  • PCI-e

    Up to 8 x PCI-e x 1 lanes
    Optional PCI-express Graphics (PEG) x2 or x4
    Possible configurations (factory alternative):
    • 8 ports PCI-e x1
    • 6 ports PCI-e x 1 + PEG x2
    • 5 ports PCI-e x 1 + PEG x4
    • 4 ports PCI-e x 1 + PEG x4 + 3rd SATA

  • Audio

    HD Audio Interface

  • Serial Ports

    2 x UARTs

  • Other Interfaces

    SPI, I2C, SM Bus, LPC bus, FAN management
    Optional TPM 2.0 module on-board
    LID#/SLEEP#/PWRBTN#, Watchdog
    4x GPI, 4 x GPO

  • Power Supply

    +12VDC ± 10% and + 5VSB (optional)

  • Operating System

    Microsoft Windows 10 Enterprise / IoT

  • Operating Temperature

    0°C  ÷ +60 °C (Commercial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

  • Dimensions
    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)


Part Number

  • EC55-3044-7120-C0

    Part number description
    COMe-C55 w/ Intel® Whiskey Lake i7, eMMC 32GB, 4 PCIE + 4 PEG + 3 SATA, LVDS -VGA, TPM, 3wire FAN
    Contact us for more informations or quotes

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