COM Express™ Rel.3.0 Basic Type 7 module with the AMD EPYC™ Embedded 3000 Series of SoCs

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Disponibile nell'intervallo di temperatura industriale

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AMD EPYC™ Embedded 3000 family of SoCs




4x USB 3.1; 24x PCI-e Gen3 lanes


Four DDR4 SO-DIMM Slots supporting DDR4-2666 Memory with ECC, up to 128GB

Dettaglio prodotto

Caratteristiche tecniche

  • Description
    This innovative solution provides scalable offerings with outstanding performance and more connectivity. Networking and connectivity are improved with the 4x 10GBASE-KR interfaces + 1x 1GbE port with NC-SI and the 4 USB 3.1; 24x PCI-e Gen3 lanes. Moreover, the performance is enhanced by the four DDR4 SO-DIMM slots supporting DDR4-2666 memory with ECC, up to 128GB. The AMD EPYC™ Embedded 3000 shows major improvements in power, optimization, and security. The main features of this new processor are I/O integration, flexibility, and security capabilities, scalable offering, harnessing the power of the new “Zen” CPU architecture. Performance-per-dollar is greatly improved, making it a great choice for development.
  • Processor

    AMD EPYC™ Embedded 3000 family of SoCs:

    • AMD EPYC™ Embedded 3251, Eight Core Dual Thread @ 2.5GHz (3.1 Boost), 16MB L3 shared Cache, TDP 55W
    • AMD EPYC™ Embedded 3201, Eight Core Single Thread @ 1.5GHz (3.1 Boost), 16MB L3 shared Cache, TDP 30W
    • AMD EPYC™ Embedded 3151, Quad Core Dual Thread @ 2.7GHz (2.9 Boost), 16MB L3 shared Cache, TDP 45W
    • AMD EPYC™ Embedded 3101, Quad Core Single Thread @ 2.1GHz (2.9 Boost), 8MB L3 shared Cache, TDP 35W
    • AMD EPYC™ Embedded 3255, Eight Core Dual Thread @ 2.5GHz (3.1 Boost), 16MB L3 Shared Cache, TDP 55W, industrial grade 
  • Memory

    Four DDR4 SO-DIMM Slots supporting DDR4-2666 Memory (both ECC and not-ECC supported), up to 128GB

  • Mass Storage

    2x S-ATA Gen3 Channels

  • Networking
    • 1x Gigabit Ethernet LAN port with NC-SI (Network Controller Sideband Interface) functionality, managed by an Intel® I210 Gigabit Ethernet Controller
    • 4x 10Gigabit Ethernet interfaces (10GBASE-KR), directly managed by the EPYC™ SoCs
  • USB

    4 x USB 3.1 Host ports (SS + USB 2.0 interfaces)

  • PCI-e

    24x PCI-e Gen3 lanes

  • Serial Ports

    2x legacy UARTs, 16C550 compatible

  • Other Interfaces

    SPI, SM Bus, LPC bus

  • Power Supply

    +12VDC ± 10% and + 5VSB (optional)

  • Operating System

    Microsoft® Windows 10 
    Microsoft® Windows Server 2016
    Linux OS 64-bit


  • Operating Temperature

    0°C  ÷ +60 °C (Commercial version)
    -40°÷+85°C (Industrial Range, when available)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

  • Dimensions
    125 x 95 mm (Com Express™ Basic Form factor, Type 7 pinout)

Part Number

  • The ordering code for samples will be available soon.

    Part number description
    If you are interested in this product please contact us
    Contact us for more informations or quotes

Related Products

Cross Platform Development Kit compatible with both x86 and Arm COM Express™ Type 7 modules.
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