SECO is pleased to announce its participation at ARM TechCon with its most innovative and newly released ARM-based solutions on display. SECO will be located in booth 1134.
“In tight cooperation with NXP and Xilinx, SECO has been able to deliver to the market the most innovative ARM-based solutions available to date” said Michael Duhamel, VP of Sales, SECO USA. “SECO’s strategy to become a market leader in the United States is taking shape and our ability to leverage on ARM architectures ensures that we consolidate our position in this geography”
At ARM TechCon a vast range of solutions powered by the NXP i.MX8 and i.MX6 Families will be showcased as well as Xilinx® Zynq® Ultrascale+™-based SM-B71.
The SECO NXP i.MX8 and i.MX6 Families offer a broad range of standard form factors and SBCs.
As previously announced, in 2019 SECO is releasing an entire product roadmap based on standard and custom form factors for edge computing and AI, where high performance, low power, high reliability in critical infrastructure, automotive, and networking are required. This new line completes the already extensive product portfolio based on the NXP i.MX 8 Family, which ranges from the ultra-low-power NXP i.MX 8M Mini to the best in class, the NXP i.MX 8 Quad Max.