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At the embedded world Exhibition & Conference, in addition to its wide range of products and services in exposition, SECO is also going to present EDGEHOG, i.e., SECO’s IIoT-as-a-service platform.
At the embedded world Exhibition & Conference, in addition to its vast array of products and services in exposition, SECO is also going to present SENSE-D01 i.e., SECO’s newest microcontroller for industrial applications.
In this edition of embedded world exhibition & conference, SECO will be showcasing many innovative solutions including products based on the latest AMD Ryzen™ Embedded Processors, i.e. the COMe-B75-CT6 and the COMe-C89-CT6.
At the embedded world Exhibition & Conference, SECO will be exhibiting its first COM Express™ Type 7 product: the COMe-C42-BT7, a COM Express™ Rel. 3.0 Basic Type 7 module with the AMD EPYC™ Embedded 3000 Processor.
From February 25th to 27th 2020, embedded world exhibition & conference, the leading international tradeshow for embedded system technologies, is coming back to Nuremberg Exhibition Centre, Germany. At SECO's booth, among the variety of products displayed, there will be a strong focus on NXP-based solutions.
From February 25th to 27th 2020 in Nuremberg, during embedded world Exhibition & Conference, SECO will showcase its latest solutions to the tens of thousands of expected visitors at its booth. Here, SECO will be proud to announce the expansion of its Qseven® standard products portfolio.
At embedded world Exhibition & Conference SECO’s booth, among the many products of its portfolio, will showcase the company’s range of the most up-to-date Intel®-based solutions.
2020 edition of embedded world in Germany will provide the opportunity to proudly launch SECO’s partnership with Rockchip, presenting its first off-the-shelf product built on the Rockchip RK3399 processor and developed in 3.5” form factor: the SBC-C31.
Among the Arm-based products from SECO’s portfolio on display at embedded world, there will also be the SM-B71, a SMARC Rel. 2.0 compliant module with the Xilinx® Zynq® Ultrascale+™ MPSoC.
SECO enters a new market, keeping a leading-edge portfolio with a new standard from PICMG®: the COM-HPC™. This line enables SECO to take part in the HPC revolution, emerged from the needs of an increasingly demanding market, in line with the performance and speed of the newest processors, retaining high computation and low-latency features.
SECO sarà presente alla prima edizione della Fiera Toscana del Lavoro.
SECO Group annuncia la sottoscrizione del contratto di acquisizione di InHand Electronics, società basata in Maryland, specializzata in soluzioni embedded a basso consumo e in software destinato a produttori (OEM) di dispositivi portatili, Internet delle Cose (IoT) e strumenti wireless.
SECO is is attending the IoT Solutions World Congress in Barcelona with its IoT Business Unit, showing its innovative one-stop IoT solution: the Edgehog platform.
SECO is pleased to announce its participation at ARM TechCon with its most innovative and newly released ARM-based solutions on display.
SECO’s strive to improve and discover new markets lead the company to become a reliable partner in many industries, and in 2019 the company is expanding its reach further than ever before.
Today SECO propels into a new market, completing its portfolio of products with a new line: the COM Express™ Type 7. This new line enables SECO to enter the Networking & Communications and Storage markets, and become a competitive partner in the HPC domain.
Nell’ambito di una continua espansione globale, SECO incrementa la copertura del mercato russo grazie all’accordo per una nuova partnership tecnologica con OSATEC LLC per l’intero portfolio di moduli embedded.
Ottenute le necessarie autorizzazioni da parte del governo cinese, SECO acquisisce la maggioranza del capitale di Fannal Electronics CO. Ltd.
In contemporanea con il lancio di Intel®, SECO ha reso disponibile una nuova gamma di soluzioni basate sulle ultime tecnologie Intel®: la famiglia di processori 8th Gen Intel® Core™ U (“Whiskey Lake”) e la famiglia di processori 9th Gen Intel® Core™ H (“Coffee Lake Refresh”).
Dalle soluzioni cross-platform alla piattaforma SECO per l’Industrial Internet of Things, fino all’innovativa UDOO BOLT, SECO presenta la più ampia gamma di soluzioni per l’industria IoT del domani.
Siamo in un garage degli anni ‘70 e due ragazzi stanno inventando il futuro.