SECO enters a new market, keeping a leading-edge portfolio with a new standard from PICMG®: the COM-HPC™. This line enables SECO to take part in the HPC revolution, emerged from the needs of an increasingly demanding market, in line with the performance and speed of the newest processors, retaining high computation and low-latency features.
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SECO sarà presente alla prima edizione della Fiera Toscana del Lavoro.
SECO Group annuncia la sottoscrizione del contratto di acquisizione di InHand Electronics, società basata in Maryland, specializzata in soluzioni embedded a basso consumo e in software destinato a produttori (OEM) di dispositivi portatili, Internet delle Cose (IoT) e strumenti wireless.
SECO is is attending the IoT Solutions World Congress in Barcelona with its IoT Business Unit, showing its innovative one-stop IoT solution: the Edgehog platform.
SECO is pleased to announce its participation at ARM TechCon with its most innovative and newly released ARM-based solutions on display.
SECO’s strive to improve and discover new markets lead the company to become a reliable partner in many industries, and in 2019 the company is expanding its reach further than ever before.
Today SECO propels into a new market, completing its portfolio of products with a new line: the COM Express™ Type 7. This new line enables SECO to enter the Networking & Communications and Storage markets, and become a competitive partner in the HPC domain.
Nell’ambito di una continua espansione globale, SECO incrementa la copertura del mercato russo grazie all’accordo per una nuova partnership tecnologica con OSATEC LLC per l’intero portfolio di moduli embedded.
Ottenute le necessarie autorizzazioni da parte del governo cinese, SECO acquisisce la maggioranza del capitale di Fannal Electronics CO. Ltd.
In contemporanea con il lancio di Intel®, SECO ha reso disponibile una nuova gamma di soluzioni basate sulle ultime tecnologie Intel®: la famiglia di processori 8th Gen Intel® Core™ U (“Whiskey Lake”) e la famiglia di processori 9th Gen Intel® Core™ H (“Coffee Lake Refresh”).
Dalle soluzioni cross-platform alla piattaforma SECO per l’Industrial Internet of Things, fino all’innovativa UDOO BOLT, SECO presenta la più ampia gamma di soluzioni per l’industria IoT del domani.
Siamo in un garage degli anni ‘70 e due ragazzi stanno inventando il futuro.
SECO’s NXP i.MX8 solutions will be on display during the show on May 15/16, 2019
The domain of Human-Computer Interaction does not only concern the design of technology that is easy to use, useful, and fancy—it has to do with our role in shaping our environment, our ecological niche that today involves the whole earth.
SECO, a proven partner of NXP as well as a leading-edge partner of Arm is investing much effort in the partnership with NXP with both Layerscape® LX2160A Multicore Communications Processor and the i.MX 8 Family.
SECO makes your business IoT-ready in three easy steps
Heterogeneous processing systems based on the Xilinx® Zynq® Ultrascale+™ MPSoCs
Among the innovations presented this year, SECO will be showcasing its vast array of state-of-the-art and fully scalable solutions - from low power to high-end SBCs and standard modules - built on the latest Intel® technologies in a large number of form factors, to fully meet a broad range of market demands and design requirements.
Among the innovations, SECO will be showcasing at embedded world its vast array of state-of-the-art solutions in COM Express™ standard form factor.
Hangzhou, February 25th, 2019 - SECO SpA (Arezzo), a high-tech manufacturer of computer miniaturization and “ready-to-use” integrated systems, with shareholder FII Tech Growth fund backed by Cassa Depositi e Prestiti, is pleased to announce that today it has signed an agreement to acquire the majority of Fannal Electronics Co. Ltd., a leading manufacturer of Human Machine Interaction technologies based in Hangzhou (China).