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    COMe-C55-CT6

    Compact COM Express™ Rel. 3.0 Type 6 module with the 8th Gen Intel® Core™ and Celeron™ U-series processors (formerly Whiskey Lake)

    • 8th Gen Intel® Core™ and Celeron™ U-series processors (formerly Whiskey Lake) with 15W TDP
    • 4 x USB 3.1; 8 x USB 2.0, up to 8 x PCI-e x 1
    • Intel® UHD Graphics 620

    • Two DDR4 SO-DIMM Slots supporting DDR4-2400 Memory, up to 32GB

    Descrizione

    Dettagli

    Low power multi-core Intel® architecture for mobile applications
    Ulteriori informazioni

    Ulteriori informazioni

    Processor

    Intel® Core™ i7-8665UE, Quad Core @ 1.7GHz with HT, 8MB Cache, 15W TDP (12.5W..25W cTDP)
    Intel® Core™ i5-8365UE, Quad Core @ 1.6GHz with HT, 6MB Cache, 15W TDP (12.5W..25W cTDP)
    Intel® Core™ i3-8145UE, Dual Core @ 2.2GHz with HT, 4MB Cache, 15W TDP (12.5W..25W cTDP)
    Intel® Celeron® 4305UE, Dual Core @ 2.0GHz, 2MB Cache, 15W TDP (cTDP 12.5W)

    Max Cores
    4
    Max Thread
    8
    Memory
    Two DDR4 SO-DIMM Slots supporting DDR4-2400 Memory, up to 32GB
    Graphics

    Intel® UHD Graphics 620
    Up to 3 independent display supported
    DirectX 12, OpenGL 4.5, and OpenCL 2.1 support
    HW accelerated video decode MPEG2, VC1/WMV9, AVC/H.264,
    VP8, JPEG/MJPEG, HEVC/H.265 (8 and 10 bits), VP9
    HW accelerated video encode MPEG2, AVC/H.264, VP8, JPEG,
    HEVC/H.265, VP9

    Video Interfaces

    Up to 2 x Digital Display Interfaces (DDIs), supporting DP 1.2, eDP 1.4, HDMI 1.4 and DVI
    eDP or Single/Dual-Channel 18-/24- bit LVDS interface
    Optional VGA interface (excludes DDI port #2)

    Video Resolution

    eDP, DP: up to 4096 x 2304 @60Hz
    HDMI: up to 4096 x 2160 @30Hz
    LVDS: up to 1920 x 1200 @ 60Hz
    VGA: up to 2048 x 1536 @ 50Hz (reduced blanking)

    Mass Storage

    Up to 3 x S-ATA Gen3 Channels
    Optional eMMC 5.1 drive on-board
    microSD Card slot on-board

    Networking

    Gigabit Ethernet interface Intel® I219-LM GbE Controller

    USB

    4 x USB 3.1 Host ports
    8 x USB 2.0 Host ports;

    PCI-e

    Up to 8 x PCI-e x 1 lanes
    Optional PCI-express Graphics (PEG) x2 or x4
    Possible configurations:
    • 8 ports PCI-e x1
    • 6 ports PCI-e x 1 + PEG x2
    • 5 ports PCI-e x 1 + PEG x4
    • 4 ports PCI-e x 1 + PEG x4 + 3rd SATA

    Audio
    HD Audio Interface
    Serial Ports

    2 x UARTs

    Other Interfaces

    SPI, I2C, SM Bus, LPC bus, FAN management
    Optional TPM 2.0 module on-board
    LID#/SLEEP#/PWRBTN#, Watchdog
    4x GPI, 4 x GPO

    Power Supply

    +12VDC ± 10% and + 5VSB (optional)

    Operating System

    Microsoft Windows 10 Enterprise / IoT
    Linux
    Yocto

    Operating Temperature

    0°C  ÷ +60 °C (Commercial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)
    Documentazione

    * User need to register to site before download reserved files. Please login if you are a registered user.

    COMe-C55-CT6

    COMe-C55-CT6
    • EVALUATE OUR PRODUCTS

      Max. 3 pcs per part number
    • SAMPLING PRICE

      Shipping costs included
    • BUSINESS TO BUSINESS ONLY

      Technical support provided exclusively to business
    Compact COM Express™ Rel. 3.0 Type 6 module with the 8th Gen Intel® Core™ and Celeron™ U-series processors (formerly Whiskey Lake)
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