Benvenuti nel sito SECO S.p.A.

×

Registrazione

Informazioni Account

  • Dati di Login

    o Accedi

    Nome obbligatorio!
    Cognome obbligatorio!
    Codice Fiscale obbligatorio
    Società obbligatoria!
    Partita IVA obbligatoria!
    Paese Obbligatorio!
    Nome non valido!
    Cognome non valido!
    Questo non è un indirizzo e-mail!
    Indirizzo e-mail obbligatorio!
    Questa e-mail esiste già!
    Password obbligatoria!
    Inserisci una password valida!
    Inserisci 6 o più caratteri!
    Inserisci 16 o meno caratteri!
    Le password non coincidono!
    Termini e Condizioni obbligatorio!
    E-mail o Password errata!
    Account confirmation is required. Please, check your email for the confirmation link. To resend the confirmation email pleaseclick here

    COMe-B09-BT6

    COM Express™ Basic Type 6 with Intel® 6th and 7th generation Core™ / Xeon® (formerly Skylake and Kaby Lake) CPUs

    • Intel® 6th and 7h generation Core™ / Xeon® CPUs
    • 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3
    • Intel® HD Graphics 530 /P530/630/P630

    • 2 x DDR4 So-DIMM slots

      COMe-B09-BT6

    COMe-B09-BT6

    COMe-B75-CT6

    COMe-B75-CT6

    COMe-C08-BT6

    COMe-C08-BT6

    COMe-A98-CT6

    COMe-A98-CT6

     
    Product Development Status
    Processor

    Intel® Core™ i3-6102E, Dual Core @ 1.9GHz, 3MB Cache, 25W TDP
    Intel® Core™ i3-6100E, Dual Core @ 2.7GHz, 3MB Cache, 35W TDP
    Intel® Core™ i5-6442EQ, Quad Core @ 1.9GHz (2.7GHz in Turbo Boost), 6MB Cache, 25W TDP
    Intel® Core™ i5-6440EQ, Quad Core @ 2.7GHz (3.4GHz in Turbo Boost), 6MB Cache, 45W TDP
    Intel® Core™ i7-6822EQ, Quad Core @ 2GHz (2.8GHz in Turbo Boost), 8MB Cache, 25W TDP
    Intel® Core™ i7-6820EQ, Quad Core @ 2.8GHz (3.5GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1505M V5, Quad Core @ 2.8GHz (3.7GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1515M V5, Quad Core @ 2.8 GHZ, 8MB Cache, 45W TDP (ECC supported), GT4E LINE (D0) with OPC (A0)
    ------------------------------------------------------------------------------------------------------------
    Intel® Core i3-7102E, Dual core @ 2.10 GHz (3M Cache,  2.10 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC supported)
    Intel® Core™ i3-7100E, Dual Core @ 2.9GHz, 3MB Cache, 35W TDP
    Intel® Core i5-7442EQ, Quad core @ 2.90 GHz (6M Cache, up to 2.90 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC no supported)
    Intel® Core i5-7440EQ, Quad Core @ 2,90GHZ ( up to 3.60 GHz), 6MB Cache, 45W TDP
    Intel® Core™ i7-7820EQ, Quad Core @ 3.0GHz (3.7GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1505L V6, Quad core @ 2.20 GHz (8M Cache, 2.20 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC supported)
    Intel® Xeon® E3-1505M V6, Quad Core @ 3.0GHz (4.0GHz in Turbo Boost), 8MB Cache, 45W TDP

    AMD Ryzen™ Embedded V1807B with AMD Radeon™ Vega 11 Graphics, Quad Core Dual Thread @ 3.35GHz (3.8 Boost), TDP 35-54W
    AMD Ryzen™ Embedded V1756B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 35-54W
    AMD Ryzen™ Embedded V1605B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 2.0GHz (3.6 Boost), TDP 12-25W
    AMD Ryzen™ Embedded V1202B with AMD Radeon™ Vega 3 Graphics, Dual Core Dual Thread @ 2.3GHz (3.2 Boost), TDP 12-25W
    AMD Ryzen™ Embedded V1404I with AMD Radeon™ Vega 3 Graphics, Quad Core / Single Thread, TDP 15W ,Industrial Temperature range (to be released

    Intel® 8th generation Core™ / Xeon® (formerly Coffee Lake H) CPUs:

    • Intel® Core™ i7-8850H, Six Core @ 2.6GHz (4.3GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with HyperThreading
    • Intel® Core™ i5-8400H, Quad Core @ 2.5GHz (4.2GHz Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), with HyperThreading
    • Intel® Core™ i3-8100H, Quad Core @ 3.0GHz, 6MB Cache, 45W TDP (35W cTDP)
    • Intel® Xeon® E-2176M, Six Core @ 2.7GHz (4.4GHz Max 1 Core Turbo), 12MB Cache, 45W TDP (35W cTDP), with HyperThreading

    Intel® 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs:

    • Intel® Xeon® E-2276ME Six Core @2.8GHz (4.5GHz Max 1 Core Turbo), 12MB Cache, 45W TDP (35W cTDP), with Hyperthreading
    • Intel® Xeon® E-2276ML Six Core @2.0GHz (4.2GHz Max 1 Core Turbo), 12MB Cache, 25W TDP, with Hyperthreading
    • Intel® Xeon® E-2254ME Quad Core @2.6GHz (3.8GHz Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), with Hyperthreading
    • Intel® Xeon® E-2254ML Quad Core @1.7GHz (3.5GHz Max 1 Core Turbo), 8MB Cache, 25W TDP, with Hyperthreading
    • Intel® Core™ i7-9850HE,  Six Core @2.7GHz (4.4GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with Hyperthreading
    • Intel® Core™ i7-9850HL, Six Core @1.9GHz (4.1GHz Max 1 Core Turbo), 9MB Cache, 25W TDP, with Hyperthreading
    • Intel® Core™ i3-9100HL, Quad Core @1.6GHz (2.9GHz Max 1 Core Turbo), 6MB Cache, 25W TDP
    • Intel® Pentium® G5600E, Dual Core @2.6GHz (3.1GHz Max 1 Core Turbo), 4MB Cache, 35W TDP
    • Intel® Celeron® G4930E, Dual Core @2.4GHz, 2MB Cache, 35W TDP
    • Intel® Celeron® G4932E,  Dual Core @1.9GHz, 2MB Cache, 25W TDP

    AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), TDP 35W
    AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), TDP 35W
    AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), TDP 15W
    AMD RX-416GD, Quad Core @ 1.6 GHz (2.4GHz Max), TDP 15W, Industrial Temperature range

    AMD GX-217GI, Dual Core @1.7GHz (2.0GHz Max), TDP 15W

    AMD GX-224IJ, Dual Core @ 2.4GHz (2.8GHz Max), cTDP 10-15W
    AMD GX-215IJ, Dual Core @1.5GHz (2.0GHz Max), cTDP 6-10W

    Chipset

    SkyLake Platform: Intel® QM170, HM170 or CM236 PCH
    Kabylake Platform: Intel® QM175 or CM238 PCH

    ...
    Intel® QM370, HM370 or CM246 PCH
    ...
    Max Cores
    4
    4
    6
    4
    Max Thread
    8 (HT not available with 6th Generation Core™ i5 and 7th Generation Core™ i3/i5 Processors)
    0
    12
    0
    Memory
    Up to two DDR4 SO-DIMM Slots supporting DDR4-2133 (DDR4-2400 for 7th Generation processors) Memory
    ECC DDR4 memory modules supported only with Xeon® and Core™ i3 processors combined with CM236 / CM238 PCH
    Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory (DDR4-2400 with V1605B, V1202B and V1404I)

    Two DDR4 SO-DIMM Slots supporting DDR4-2666 Memory, up to 64GB 
    ECC DDR4 memory modules supported only with Xeon®, Core™ i3, Pentium® and Celeron® CPUs combined with CM246 PCH

    R-Series: Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 2133MHz
    G-Series SoC-I: Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 1600MHz
    G-Series SoC-J: One SO-DIMM slot supporting DDR4 non-ECC modules up to 2133MHz 

    Graphics
    Intel® HD Graphics 530 (6th Generation Core™ processors), P530 (6th Generation Xeon® processors)
    Intel® HD Graphics 630 (7th Generation Core™ processors), P630 (7th Generation Xeon® processors)
    Up to 3 independent displays supported
    DirectX® 12.1, OpenGL 4.4, and OpenCL 2.0 support
    HW accelerated video decode MPEG2, VC1 / WMV9, AVC / H.264, VP8, JPEG / MJPEG, HEVC / H.265, VP9
    HW accelerated video encode MPEG2, AVC / H.264, VP8, JPEG / MJPEG, HEVC / H.265, VP9

    AMD Radeon™ Vega GPU with up to 11 Compute Units
    DirectX® 12 supported
    H.265 (10-bit) decode and 8-bit video encode
    VP9 decode
    4 independent displays supported

    Intel® UHD Graphics 630/P630 architecture, up to 48 Execution Units
    Up to 3 independent displays supported
    DirectX 12, OpenGL 4.5, and OpenCL 2.1 support
    HW accelerated video decode MPEG2, VC1/WMV9, AVC/H.264, VP8, JPEG/MJPEG, HEVC/H.265 (8-/10-bit), VP9
    HW accelerated video encode MPEG2, AVC/H.264, VP8, JPEG, HEVC/H.265, VP9

    AMD Radeon 3rd -Generation Graphics Core Next (GCN)
    AMD RX-421BD - Radeon R7
    AMD RX-418GD, RX-416GD - Radeon R6
    AMD-RX-216GD -  Radeon R5
    AMD GX-217GI - Radeon R6E
    AMD GX-224IJ - Radeon R4E
    AMD GX-215IJ - Radeon R2E
    Up to 3 independent displays supported (up to 2 with G-Series SoC-I and SoC-J)
    DirectX® 12 supported
    UVD 6 (4K H.265 and H.264 decode) and VCE 3.1 (4KH.264 encode) supported 

    Video Interfaces

    Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI and HDMI 1.4
    eDP or Single / Dual-Channel 18- / 24- bit LVDS interface or LVDS + VGA interface
    PCI-express Graphics (PEG) Gen3 x16

    3 x Digital Display Interfaces (DDIs), supporting DP 1.3, DVI and HDMI 1.4/2.0
    eDP or Single/Dual-Channel 18-/24- bit LVDS interface

    Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI, HDMI 1.4
    eDP 1.4 or Single/Dual-Channel 18-/24-bit LVDS interface or LVDS + VGA interface

    Up to 3 x Digital Display Interfaces (DDIs), supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0 (up to 2x DDIs with G-Series SoC-I and SoC-J)
    Optional VGA interface (excludes one DDI Port)
    Optional eDP or Single / Dual-Channel 18- / 24- bit LVDS interface (excludes one DDI Port)

    Video Resolution

    eDP, DP: up to 4096x2304 @ 60Hz, 24bpp
    HDMI: up to 4096x2160 @ 60Hz, 24bpp
    LVDS, VGA: up to 1920x1200 @ 60Hz

    DDIs, eDP: up to 4K
    LVDS: up to 1920 x 1200

    eDP, DP: up to 4096x2304 @ 60Hz, 24bpp
    HDMI: up to 4096x2160 @ 24Hz, 24bpp (HDMI 1.4)
    LVDS, VGA: up to 1920x1200 @ 60Hz

    DDIs: up to 4K
    LVDS, VGA: up to 1920 x 1200 @ 60Hz 

    Mass Storage
    4 x S-ATA Gen3 Channels
    2 x S-ATA Gen3 Channels

     4 x S-ATA Gen3 Channels
    SD interface (shared with GPI/Os) 

    2 x SATA Gen3 Channels
    SD interface shared with GPI/Os
    Networking

    Gigabit Ethernet interface
    Intel® I219-LM GbE Controller

    Gigabit Ethernet interface
    Intel® I21x family GbE Controller 

    Gigabit Ethernet interface
    Intel® I219-LM GbE Controller

    Gigabit Ethernet interface
    Intel® I210 / I211 GbE Controller
    USB
    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports
    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports

    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports 

    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports
    PCI-e
    8 x PCI-e x1 Gen3 lanes

    Up to 4x PCI-e x1 Gen3 lanes + 2 x PCI-e x1 Gen2 ports
    PCI-express Graphics (PEG) x 8 Gen3

    8 x PCI-e x 1 Gen3 lanes
    PCI-express Graphics (PEG) Gen3 x16

    3 x PCI-e x 1 lanes 
    PCI-express Graphics (PEG) x8 (R-Series SoCs) or x4 (G-Series SOC-I and SoC-J)

    Audio
    HD Audio Interface
    HD Audio Interface
    HD Audio Interface
    HD Audio Interface
    Serial Ports
    2 x UARTs

    2 x UARTs

    2 x UARTs
    2 x HS UARTs
    Other Interfaces

    2 x SPI, I2C, SM Bus, LPC bus, 2 x Express Card, FAN management
    Optional TPM 1.2
    LID# / SLEEP# / PWRBTN#, Watchdog
    4x GPI, 4 x GPO

    SPI, I2C bus, SM Bus, LPC bus, FAN management
    LID#/SLEEP#/PWRBTN#, Watchdog
    4x GPI, 4 x GPO

    SPI, I2C, SM Bus, Thermal Management, FAN management
    LPC bus
    Optional TPM 2.0 on-board
    LID#/SLEEP#/PWRBTN#, Watchdog 
    4 x GPI, 4 x GPO (pins shared with SD interface)

    SPI, I2C Bus, SM Bus, LPC Bus, 2 x Express Card, FAN management
    LID# / SLEEP# / PWRBTN#, Watchdog
    4 x GPI, 4 x GPO (multiplexed with SD interface)
    Optional TPM 1.2 or 2.0 module onboard 

    Power Supply
    +12VDC ± 10% and +5VSB (optional)

    +12VDC ± 10% and + 5VSB (optional)

    +12VDC ± 10% and + 5VSB (optional)

    +12VDC ± 10% and + 5VSB (optional)
    Power Consumption
    ...
    ...
    ...
    ...
    Operating System

    Microsoft® Windows 7 (only for Skylake)
    Microsoft® Windows 8.1 (only for Skylake)
    Microsoft® Windows 10
    Linux
    Yocto

    Microsoft® Windows 10
    Linux Ubuntu

    Microsoft® Windows 10 
    Linux

    Microsoft® Windows 7
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7
    Microsoft® Windows Embedded Standard 8
    Linux

    Operating Temperature

    0°C ÷ +60°C (commercial version)
    -40°C / +70°C (Extended Temperature Range)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (Commercial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    125 x 95 mm (COM Express Basic, 4.92” x 3,74”)
    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)

    125 x 95 mm (Com Express™ Basic Form factor, Type 6 pinout)

    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)
    Security
    ...
    ...
    ...
    ...
    BIOS
    ...
    ...
    ...
    ...
    Embedded Controller Functionalities
    ...
    ...
    ...
    ...

    Descrizione

    Dettagli

    COMe-B09-BT6 is a COM Express™ Basic Type 6 module designed by SECO, based on the Intel® 6th and 7th generation Core™ / Xeon® (""Skylake"" and ""Kaby Lake"") CPUs, that features up to 4 Cores, HD Graphics 530 /P530/630/P630 and DDR4 RAM technology.
    Being able to support up to 3 independent displays, it also offers H.265 / HEVC HW Transcoder and resolution up to 4096x2304 @60Hz, 24bpp.

    Ulteriori informazioni

    Ulteriori informazioni

    Processor

    Intel® Core™ i3-6102E, Dual Core @ 1.9GHz, 3MB Cache, 25W TDP
    Intel® Core™ i3-6100E, Dual Core @ 2.7GHz, 3MB Cache, 35W TDP
    Intel® Core™ i5-6442EQ, Quad Core @ 1.9GHz (2.7GHz in Turbo Boost), 6MB Cache, 25W TDP
    Intel® Core™ i5-6440EQ, Quad Core @ 2.7GHz (3.4GHz in Turbo Boost), 6MB Cache, 45W TDP
    Intel® Core™ i7-6822EQ, Quad Core @ 2GHz (2.8GHz in Turbo Boost), 8MB Cache, 25W TDP
    Intel® Core™ i7-6820EQ, Quad Core @ 2.8GHz (3.5GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1505M V5, Quad Core @ 2.8GHz (3.7GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1515M V5, Quad Core @ 2.8 GHZ, 8MB Cache, 45W TDP (ECC supported), GT4E LINE (D0) with OPC (A0)
    ------------------------------------------------------------------------------------------------------------
    Intel® Core i3-7102E, Dual core @ 2.10 GHz (3M Cache,  2.10 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC supported)
    Intel® Core™ i3-7100E, Dual Core @ 2.9GHz, 3MB Cache, 35W TDP
    Intel® Core i5-7442EQ, Quad core @ 2.90 GHz (6M Cache, up to 2.90 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC no supported)
    Intel® Core i5-7440EQ, Quad Core @ 2,90GHZ ( up to 3.60 GHz), 6MB Cache, 45W TDP
    Intel® Core™ i7-7820EQ, Quad Core @ 3.0GHz (3.7GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1505L V6, Quad core @ 2.20 GHz (8M Cache, 2.20 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC supported)
    Intel® Xeon® E3-1505M V6, Quad Core @ 3.0GHz (4.0GHz in Turbo Boost), 8MB Cache, 45W TDP

    Chipset

    SkyLake Platform: Intel® QM170, HM170 or CM236 PCH
    Kabylake Platform: Intel® QM175 or CM238 PCH

    Max Cores
    4
    Max Thread
    8 (HT not available with 6th Generation Core™ i5 and 7th Generation Core™ i3/i5 Processors)
    Memory
    Up to two DDR4 SO-DIMM Slots supporting DDR4-2133 (DDR4-2400 for 7th Generation processors) Memory
    ECC DDR4 memory modules supported only with Xeon® and Core™ i3 processors combined with CM236 / CM238 PCH
    Graphics
    Intel® HD Graphics 530 (6th Generation Core™ processors), P530 (6th Generation Xeon® processors)
    Intel® HD Graphics 630 (7th Generation Core™ processors), P630 (7th Generation Xeon® processors)
    Up to 3 independent displays supported
    DirectX® 12.1, OpenGL 4.4, and OpenCL 2.0 support
    HW accelerated video decode MPEG2, VC1 / WMV9, AVC / H.264, VP8, JPEG / MJPEG, HEVC / H.265, VP9
    HW accelerated video encode MPEG2, AVC / H.264, VP8, JPEG / MJPEG, HEVC / H.265, VP9
    Video Interfaces

    Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI and HDMI 1.4
    eDP or Single / Dual-Channel 18- / 24- bit LVDS interface or LVDS + VGA interface
    PCI-express Graphics (PEG) Gen3 x16

    Video Resolution

    eDP, DP: up to 4096x2304 @ 60Hz, 24bpp
    HDMI: up to 4096x2160 @ 60Hz, 24bpp
    LVDS, VGA: up to 1920x1200 @ 60Hz

    Video Interfaces
    SINGLE CHANNEL LVDS, DUAL CHANNEL LVDS, eDP, VGA, DDI
    Mass Storage
    4 x S-ATA Gen3 Channels
    Networking

    Gigabit Ethernet interface
    Intel® I219-LM GbE Controller

    USB
    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports
    PCI-e
    8 x PCI-e x1 Gen3 lanes
    Audio
    HD Audio Interface
    Serial Ports
    2 x UARTs
    Other Interfaces

    2 x SPI, I2C, SM Bus, LPC bus, 2 x Express Card, FAN management
    Optional TPM 1.2
    LID# / SLEEP# / PWRBTN#, Watchdog
    4x GPI, 4 x GPO

    Power Supply
    +12VDC ± 10% and +5VSB (optional)
    Operating System

    Microsoft® Windows 7 (only for Skylake)
    Microsoft® Windows 8.1 (only for Skylake)
    Microsoft® Windows 10
    Linux
    Yocto

    Operating Temperature

    0°C ÷ +60°C (commercial version)
    -40°C / +70°C (Extended Temperature Range)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    125 x 95 mm (COM Express Basic, 4.92” x 3,74”)
    Software
    BIOS
    • [Bios] - Release version 1.04*
    EAPI
    • [Embedded application programming interface] - Release version 1.20.19*
    Windows 10
    • [Driver package] – Release version for Windows 10 iot 2016 (RS1)*
    • [Driver package] – Release version for Windows 10 iot 2019 (RS5)*
    Windows 7 (Skylake)
    • [Chipset - 64bit] - Driver version 10.1.1.40*
    • [Video - 64bit] - Driver version 21.20.16.4678*
    • [Lan - 64bit] - Driver version 22.3*
    • [Management Engine - 64bit] - Driver version 11.6.29.3287*

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Documentazione

    * User need to register to site before download reserved files. Please login if you are a registered user.

    COMe-B09-BT6

    COMe-B09-BT6
    • EVALUATE OUR PRODUCTS

      Max. 3 pcs per part number
    • SAMPLING PRICE

      Shipping costs included
    • BUSINESS TO BUSINESS ONLY

      Technical support provided exclusively to business
    COM Express™ Basic Type 6 with Intel® 6th and 7th generation Core™ / Xeon® (formerly Skylake and Kaby Lake) CPUs
    sku part number part number description part number configuration buy samples online Contattaci compare
    MB09-5050-2100-I1 COM-Express Type 6 Intel® Core i7-6822EQ COM Express Type 6 - COMe-B09-BT6 w/ Intel® Core i7-6822EQ, PCH - QM175, eDP (B0), DP on DDI3 (B3) - Ind. Temp. Range Qualified Confronta
    MB09-2030-4100-C1 COM-Express Type 6 Intel® Core i3-6100E COM Express Type 6 - COMe-B09-BT6 w/ Intel® Core i3-6100E, PCH - CM236, LVDS (B1), VGA (B2) Confronta
    MB09-3020-2100-C1 COM-Express Type 6 Intel® Core i5-6442EQ COM Express Type 6 - COMe-B09-BT6 w/ Intel® Core i5-6442EQ, PCH - QM170, eDP (B0), DP on DDI3 (B3) Confronta
    MB09-4020-2100-C1 COM-Express Type 6 Intel® Core i5-6440EQ COM Express Type 6 - COMe-B09-BT6 w/ Intel® Core i5-6440EQ, PCH - QM170, eDP (B0), DP on DDI3 (B3) Confronta
    MB09-5010-2100-C1 COM-Express Type 6 Intel® Core i7-6822EQ COM Express Type 6 - COMe-B09-BT6 w/ Intel® Core i7-6822EQ, PCH - HM170, eDP (B0), DP on DDI3 (B3) Confronta
    MB09-6010-2000-C1 COM-Express Type 6 Intel® Core i7-6820EQ COM Express Type 6 - COMe-B09-BT6 w/ Intel® Core i7-6820EQ, PCH - HM170, eDP (B0), DP on DDI3 (B3) Confronta
    MB09-6020-2100-C1 COM-Express Type 6 Intel® Core i7-6820EQ COM Express Type 6 - COMe-B09-BT6 w/ Intel® Core i7-6820EQ, PCH - QM170, eDP (B0), DP on DDI3 (B3) Confronta
    MB09-7030-4100-C1 COM-Express Type 6 Intel® Xeon® E3-1505M V5 COM Express Type 6 - COMe-B09-BT6 w/ Intel® Xeon® E3-1505M V5, PCH - CM236, LVDS (B1), VGA (B2) Confronta
    MB09-8030-2100-C1 COM-Express Type 6 Intel® Xeon® E3-1535M V5 COM Express Type 6 - COMe-B09-BT6 w/ Intel® Xeon® E3-1535M V5,PCH - CM236, eDP (B0), DP on DDI3 (B3), TPM2.0 Confronta
    MB09-9030-4100-C1 COM-Express Type 6 Intel® Xeon® E3-1515M V5 COM Express Type 6 - COMe-B09-BT6 w/ Intel® Xeon® E3-1515M V5,PCH - CM236,LVDS (B1), VGA (B2), LINE GT4e (D0) OPCM (A0) Confronta
    MB09-A050-2100-C1 COM-Express Type 6 Intel® Kaby Lake Core i3-7100E COM Express Type 6 - COMe-B09-BT6 w/ Intel® Kaby Lake Core i3-7100E, PCH - QM175, eDP (B0), DP on DDI3 (B3) Confronta
    MB09-B050-2100-C1 COM-Express Type 6 Intel® Kaby Lake Core i5-7440EQ COM Express Type 6 - COMe-B09-BT6 w/ Intel® Kaby Lake Core i5-7440EQ, PCH - QM175, eDP (B0), DP on DDI3 (B3) Confronta
    MB09-B050-4100-C1 COM-Express Type 6 Intel® Kaby Lake Core i5-7440EQ COM Express Type 6 - COMe-B09-BT6 w/ Intel® Kaby Lake Core i5-7440EQ,PCH - QM175,LVDS (B1), VGA (B2), LINE GT4e (D0) OPCM (A0) Confronta
    MB09-C050-2100-C1 COM-Express Type 6 Intel® Kaby Lake Core i7-7820EQ COM Express Type 6 - COMe-B09-BT6 w/ Intel® Kaby Lake Core i7-7820EQ, PCH - QM175, eDP (B0), DP on DDI3 (B3) Confronta
    MB09-D060-2100-C1 COM-Express Type 6 Intel® Kaby Lake Xeon® E3-1505M V6 COM Express Type 6 - COMe-B09-BT6 w/ Intel® Kaby Lake Xeon® E3-1505M V6,PCH - CM238, eDP (B0), DP on DDI3 (B3) Confronta
    MB09-E040-6100-C1 COM-Express Type 6 Intel® Kaby Lake Core i3-7102E COM Express Type 6 - COMe-B09-BT6 w/ Intel® Kaby Lake Core i3-7102E , PCH - HM175, VGA (B2) Confronta
    MB09-E050-6100-C1 COM-Express Type 6 Intel® Kaby Lake Core i3-7102E COM Express Type 6 - COMe-B09-BT6 w/ Intel® Kaby Lake Core i3-7102E , PCH - QM175, VGA (B2) Confronta
    MB09-F050-5100-C1 COM-Express Type 6 Intel® Kaby Lake Core i5-7442EQ COM Express Type 6 - COMe-B09-BT6 w/ Intel® Kaby Lake Core i5-7442EQ , PCH - QM175, LVDS (B1), DP on DDI3 (B3) Confronta
    MB09-G060-2100-C1 COM-Express Type 6 Intel® Kaby Lake Xeon® E3-1505L V6 COM Express Type 6 - COMe-B09-BT6 w/ Intel® Kaby Lake Xeon® E3-1505L V6, PCH - CM238, eDP (B0), DP on DDI3 (B3) Confronta

    • Industrial Automation
    • Infotainment/Vending
    • Measuring Instruments
    • Medical
    • Utilities (Energy-Telco)
    Top