Moduli COM Express®

Per design e mercati di fascia alta
Elevata elaborazione grafica
Ricco di funzionalità
Per progetti con elevate prestazioni
Formato Basic (125x95 mm) e Compact (95x95 mm)
Vantaggi dell’Approccio Computer-on-Module
Investimento di progettazione limitato alla Carrier Board
Standard consolidati
Soluzioni scalabili e future-proof
Disponibilità a lungo termine
Compatibilità Arm e x86
Soluzioni multi-vendor
Altamente configurabili
Soluzioni innovative e aggiornabili
Time-to-market ridotto
Descrizione

Lo standard COM Express® consente la personalizzazione del progetto in modo rapido ed economico. I moduli SECO sono disponibili in COM Express® Type 6 e Type 7, in due formati: il Basic, con dimensioni di 125 x 95 mm, adatto per dispositivi ad alta sensibilità energetica, e il Compact, con dimensioni di 95x95 mm, che è un buon compromesso tra alte prestazioni e dimensioni ridotte.

Interfacce COM Express™

10 Products

COMe-C55-CT6

Compact COM Express™ Rel. 3.0 Type 6 module with the 8th Gen Intel® Core™ and Celeron™ 4000 series processors (formerly Whiskey Lake)

  • 4 x USB 3.1; 8 x USB 2.0, up to 8 x PCI-e x 1
  • Intel® UHD Graphics 620/610
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COMe-C42-BT7

COM Express™ Rel.3.0 Basic Type 7 module with the AMD EPYC™ Embedded 3000 Series of SoCs

  • 4x USB 3.1; 24x PCI-e Gen3 lanes
  • N.A.
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COMe-C89-CT6

Compact COM Express™ Rel.3.0 Type 6 module, with the AMD Ryzen™ Embedded R1000 family of SoCs

  • 4x USB 3.0; 8x USB 2.0; Up to 5x PCI-e x1; PEG x4 Gen3
  • AMD Radeon™ Vega GPU with 3 Compute Units
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COMe-C24-CT6

COM Express™ 3.0 Compact Type 6 Module with the Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors

  • 4x USB 3.0; 8x USB 2.0; 5x PCI-e x1 Gen2
  • Intel® HD Graphics 500 series controller with up to 18 Execution Units
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COMe-C08-BT6

COM Express™ 3.0 Basic Type 6 Module with Intel® 8th generation Core™/ Xeon® (formerly Coffee Lake) and 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs

  • 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3
  • Intel® UHD Graphics 630/P630 architecture, up to 48 Execution Units
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COMe-B75-CT6

COM Express™ Compact 3.0 Type 6 Module with the AMD Ryzen™ Embedded V1000 processors

  • 4x USB 3.0; 8x USB 2.0; 4x PCI-e x1 Gen 3, PEG x8 Gen3
  • AMD Radeon™ Vega GPU with up to 11 Compute Units DirectX® 12 supported
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COMe-B09-BT6

COM Express™ Basic Type 6 with Intel® 6th and 7th generation Core™ / Xeon® (formerly Skylake and Kaby Lake) CPUs

  • 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3
  • Intel® HD Graphics 530 /P530/630/P630
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COMe-A98-CT6

COM Express Compact Type 6 with the AMD Embedded 3rd generation R-Series SoC (formerly Merlin Falcon), G-Series SoC-I (formerly Brown Falcon) or G-Series SoC-J (formerly Prairie Falcon)

  • 4x USB 3.0; 8x USB 2.0; 3x PCI-e x1 Gen3
  • AMD Radeon 3rd -Generation Graphics Core Next (GCN)
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COMe-A41-CT6

COM Express™ Compact Type 6 with Intel® Atom™ E3800 and Celeron® families (formerly Bay Trail)

  • 4x USB 3.0; 7x USB 2.0; 4x PCI-e x1 Gen2
  • Integrated Intel® HD Graphics 4000 Series controller
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COMe-953-BT6

COM Express™ Basic Type 6 Module with Intel® Haswell family CPUs

  • 4x USB 3.0; 8x USB 2.0; 7x PCI-e x1
  • Integrated Intel® HD Graphics 4600
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