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    Plus de vues

    SM-C12

    SMARC Rel. 2.0 compliant module with NXP i.MX 8M Applications Processors

    • NXP i.MX 8M Applications Processors
    • WiFi + BT LE; CSI camera; QuadSPI interface; 12x GPI/Os
    • Integrated Graphics Processing Unit, supports 2 independent displays
    • Up to 4GB soldered down LPDDR4-3200 memory, 32-bit interface.
    Disponible dans la plage des températures industrielles

      SM-C12

    SM-C12

    SYS-A62-10

    SYS-A62-10

    μQ7-A75-J

    μQ7-A75-J

    SM-B69

    SM-B69

     
    Statut de développement du produit
    Processeur

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    Multicore NXP i.MX 6 processor family
    SYS-A62-10/SOLO: i.MX6S Solo, 1 x ARM Cortex-A9 @1 GHz Core
    SYS-A62-10/LITE: i.MX6DL Dual Lite, 2 x ARM Cortex-A9 @1 GHz Cores
    SYS-A62-10/QUAD: i.MX6Q Quad, 4 x ARM Cortex-A9 @1 GHz Cores

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors

    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    Puces
    ...
    ...
    ...
    ...
    Max Cores
    0
    0
    2
    4
    Max Thread
    0
    0
    ...
    4
    Mémoire
    Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB
    On-board DDR3L soldered memory;
    SYS-A62-10/SOLO: 512MB 32-bit
    SYS-A62-10/LITE: 1GB 64-bit
    SYS-A62-10/QUAD: 1GB 64-bit

    Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F

    Dual Channel Soldered Down LPDDR4-2400 memory, up to 8GB
    Graphique

    Integrated Graphics Processing Unit, supports 2 independent displays
    Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
    Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

    2D, OpenGL® ES2.0 3D HW accelerator
    OpenVG™ accelerator (SYS-A62/10/QUAD only)
    HW encoding of MPEG-4, H.263 V2, H.264, MJPEG
    HW decoding of MPEG-2, VC1, MPEG-4 / XviD, H.263, H.264, DivX

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Supports 2 independent displays

    Integrated Intel® HD Graphics 500 series controller with up to 18 Execution Units
    Three Independent displays supported
    HW decoding of HEVC(H.265), H.264, MVC, VP8, VP9, MPEG2, VC-1, WMV9, JPEG/MJPEG formats
    HW encoding of HEVC(H.265), H.264, MVC, VP8, VP9 and JPEG/MPEG formats

    Interfaces vidéo
    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
    18- / 24-bit Dual Channel LVDS interface or MIPI-DSI interface
    (factory alternatives)
    10,1” LVDS display, resolution 1280 x 800, 30K hours life
    P-Cap (Projected Capacitive touch screen), with 2mm glass cover
    Glass Hardness IK08, Surface Hardness 8H (450g)

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface

    eDP + MIPI-DSI interfaces or Dual Channel 18/24bit LVDS interface
    HDMI or DP++ interface
    DP++ interface
    2 x CSI interfaces

    Résolution vidéo
    HDMIUp to 4096 x 2160 @ 60 (4K)
    MIPI-DSI, LVDSUp to 1920 x 1080 @ 60Hz
    ...

    LVDS, resolution up to 1920x1200
    HDMI, resolution up to 1080p

    DP++ Up to 4096 x 2160 @60HZ
    eDP     Up to 3840 x 2160 @60Hz
    HDMI Up to 3840 x 2160 @30Hz
    MIPI-DSI, LVDS Up to 1920 x 1200 @ 60Hz
    Stockage de masse
    Optional SD 4-bit interface
    QSPI Flash soldered-onboard
    eMMC 5.0 drive soldered on-board
    On-board 4GB eMMC drive
    microSD Card Slot
    SATA Connector (SYS-A62-10/QUAD only)

    On-board eMMC drive, up to 8 GB
    SD / MMC / SDIO interface
    Internal SPI Flash for booting

    Optional eMMC 5.0 drive soldered on-board
    2 x external S-ATA Gen3 Channels
    SD interface

    Networking
    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard
    Gigabit Ethernet connector
    Optional WiFi pluggable module
    Fast Ethernet (10/100) interface

    Up to 2 x Gigabit Ethernet interfaces
    Intel® I210 or I211 Controller (MAC + PHY)

    USB
    2 USB 3.0 Host ports
    2 USB 2.0 Host ports
    1 USB 2.0 OTG port
    2 x USB 2.0 Type-A ports and 1 x USB 2.0 internal connector
    USB micro-B Client port

    1 x USB OTG interface
    1 x USB 2.0 Host interface

    6 x USB 2.0 Host Ports
    2 x USB 3.0 Host Ports
    PCI-e
    2x PCI-e x1 ports
    ...

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    4 x PCI-e Root Ports
    Audio
    I2S Audio Interface
    SYS-A62-10/LITE and SYS-A62-10/QUAD: Realtek ALC655
    AC’97 Audio Codec with Mic-In, Line-Out audio Jacks
    I2S / AC’97 Audio Interface
    HD Audio interface
    I2S Audio interface
    Ports série
    Up to 2x UART Tx/Rx/RTS/CTS
    2x UART Tx/Rx
    1x CAN Bus (TTL level)
    Dedicated Serial ports:
    SYS-A62-10/SOLO: 2 x RS-232 ports 
    SYS-A62-10/LITE: 2 x RS-232 ports, 1 x CAN port
    SYS-A62-10/QUAD: 2 x RS-232 ports, 1 x RS-485 port, 1 x CAN port

    Other serial ports can be realised on expansion connector (see ""Other interfaces"")
    ...

    2 x HS-UARTs
    2 x UARTs

    Autres interfaces

    1x 4-lanes + 1x 2-lanes CSI camera interfaces
    I2C Bus
    SM Bus
    2x SPI interfaces
    QuadSPI interface
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    MIPI-CSI Camera connector
    Programmable expansion connector with:
    SYS-A62-10/SOLO: up to 22 GPIOs, 2 x TTL CAN ports, 1 x UART TTL, 3 x PWM, 2 x I2C, SD, SPI or S/PDIF interfaces
    SYS-A62-10/LITE: up to 20 GPIOs, 1 x TTL CAN port, 1 x UART TTL, 3 x PWM, 2 x I2C, SD, SPI or S/PDIF interfaces
    SYS-A62-10/QUAD: up to 18 GPIOs, 1 x TTL CAN port, 3 x PWM, 2 x I2C, SD, SPI or S/PDIF interfaces

    On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
    - Additional SD interface
    - Up to 4 UARTs
    - CAN interface
    - Watchdog(s)
    - I2C interfaces
    - PWM outputs
    - SPI interface
    - Additional Audio interface

    (*) not all the combinations are allowed simultaneously Power Management Signals

    Up to 12x GPIOs
    I2C Bus
    SM Bus
    2x SPI interfaces
    LPC Bus
    FAN management
    Power Management Signals

    Alimentation électrique

    +5VDC
    +3.3V_RTC

    +12VDC
    SYS-A62-10/SOLO and SYS-A62-10/LITE: internal i.MX6 RTC, require external battery for time/data retention
    SYS-A62-10/QUAD: low power RTC with on-board battery

    +5VDC ± 5%
    Optional Low Power RTC

    +5VDC and +3.3V_RTC
    Consommation d'énergie
    ...
    ...
    ...
    ...
    Système d'exploitation

    Linux
    Yocto
    Android

    Linux
    Yocto
    Windows® Embedded Compact 7

    Linux
    Yocto

    Microsoft® Windows 10 Enterprise (64 bit)
    Microsoft® Windows 10 IoT Core
    Linux
    Yocto

    Température d'exploitation
    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ 50°C

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (Industrial temp.)* 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    50 x 82 mm (1.97” x 3.23”)
    269,60 x 189,20 x 17,17 mm
    40x70 mm (1.57” x 2.76”)
    50 x 82 mm (1.97” x 3.23”)
    Security
    ...
    ...
    ...
    ...
    BIOS
    ...
    ...
    ...
    ...
    Embedded Controller Functionalities
    ...
    ...
    ...
    ...
    CAN Bus
    N/A
    N/A
    N/A
    N/A
    Functional Safety Features
    N/A
    N/A
    N/A
    N/A

    Description

    Détails

    The SM-C12 is a SMARC Rel. 2.0 compliant module with NXP i.MX 8M Applications Processors. Featuring multicore processing (Dual or Quad ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor) and 4Kp60 HEVC decoding with HDR, it is a scalable solution designed by SECO for home automation, transportation, digital signage and vending machines, and applicable to scenarios requiring advanced security, connectivity, multimedia and real-time response.
    Informations supplémentaires

    Informations complémentaires

    Processeur

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    Mémoire
    Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB
    Graphique

    Integrated Graphics Processing Unit, supports 2 independent displays
    Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
    Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

    Interfaces vidéo
    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
    18- / 24-bit Dual Channel LVDS interface or MIPI-DSI interface
    (factory alternatives)
    Résolution vidéo
    HDMIUp to 4096 x 2160 @ 60 (4K)
    MIPI-DSI, LVDSUp to 1920 x 1080 @ 60Hz
    Stockage de masse
    Optional SD 4-bit interface
    QSPI Flash soldered-onboard
    eMMC 5.0 drive soldered on-board
    Networking
    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard
    USB
    2 USB 3.0 Host ports
    2 USB 2.0 Host ports
    1 USB 2.0 OTG port
    PCI-e
    2x PCI-e x1 ports
    Audio
    I2S Audio Interface
    Ports série
    Up to 2x UART Tx/Rx/RTS/CTS
    2x UART Tx/Rx
    1x CAN Bus (TTL level)
    Autres interfaces

    1x 4-lanes + 1x 2-lanes CSI camera interfaces
    I2C Bus
    SM Bus
    2x SPI interfaces
    QuadSPI interface
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    Alimentation électrique

    +5VDC
    +3.3V_RTC

    Système d'exploitation

    Linux
    Yocto
    Android

    Température d'exploitation
    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    50 x 82 mm (1.97” x 3.23”)
    Logiciel

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    SM-C12

    SM-C12
    • ÉVALUER NOS PRODUITS

      Max. 3 pcs par code article
    • PRIX ÉCHANTILLONNAGE

      Frais d'expédition inclus
    • UNIQUEMENT B2B

      Support technique fourni exclusivement pour les entreprises
    SMARC Rel. 2.0 compliant module with the NXP i.MX 8M Applications Processors
    Code article SKU Description article Configuration article Acheter des échantillons en ligne Nous contacter comparer
    RC12-2220-2211-C0 SMARC NXP i.MX 8M SMARC - NXP i.MX8M Quad 1.5 GHz (VPU decode + HDR10 + GPU), LPDDR4 2GB, eMMC 8GB, LVDS+HDMI, WIFI(WL1831) + BT, PCle ,CAN - Comm. Temp AJOUTER POUR COMPARER
    RC12-3120-2211-C0 SMARC NXP i.MX 8M SMARC - NXP i.MX8M Quad Lite1.5 GHz (GPU, No VPU), LPDDR4 1 GB, eMMC 8 GB, LVDS + HDMI, WIFI(WL1831) + BT, PCIe, CAN, Comm. Temp. AJOUTER POUR COMPARER
    RC12-5220-2311-I0 SMARC NXP i.MX 8M SMARC - NXP i.MX8M Quad 1.3 GHz (VPU decode + HDR10 + GPU), LPDDR4 2 GB, eMMC 8 GB, LVDS + HDMI, WIFI(WL1837) + BT, PCIe, CAN, Ind. Temp AJOUTER POUR COMPARER
    RC12-6120-2311-I0 SMARC NXP i.MX 8M SMARC - NXP i.MX8M Quad Lite 1.3 GHz (GPU, No VPU), LPDDR4 1 GB, eMMC 8 GB, LVDS + HDMI, WIFI(WL1837) + BT, PCIe, CAN, Ind. Temp AJOUTER POUR COMPARER

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