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    Plus de vues

    SM-C12

    SMARC Rel. 2.0 compliant module with NXP i.MX 8M Applications Processors

    • NXP i.MX 8M Applications Processors
    • WiFi + BT LE; CSI camera; QuadSPI interface; 12x GPI/Os
    • Integrated Graphics Processing Unit, supports 2 independent displays
    • Up to 4GB soldered down LPDDR4-3200 memory, 32-bit interface.
    Disponible dans la plage des températures industrielles

      SM-C12

    SM-C12

    Q7-C25

    Q7-C25

    μQ7-A75-J

    μQ7-A75-J

    Q7-C26

    Q7-C26

     
    Statut de développement du produit
    Processeur

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors

    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core

    NXP i.MX 8 Family:
    i.MX 8QuadMax - 2x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8QuadPlus - 1x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8Quad - 4x Cortex®-A53 cores + 2x Cortex®-M4F cores

    Puces
    ...
    ...
    ...
    ...
    Max Cores
    0
    0
    2
    0
    Max Thread
    0
    0
    ...
    0
    Mémoire
    Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB

    soldered down DDR4-2400 memory, 32-bit interface, up to 4GB

    Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F

    soldered down LPDDR4-3200 memory, 64-bit interface

    Graphique

    Integrated Graphics Processing Unit, supports 2 independent displays
    Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
    Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC,H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG (not for i.MX8M QuadLite).
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 2.x, DirectX 11

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Supports 2 independent displays

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-2, VC-1, RV9, VP8, H.263 and MPEG4 part, HW encoding of AVC/H.264
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 3.x, DirectX 11

    Interfaces vidéo
    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
    18- / 24-bit Dual Channel LVDS interface or MIPI-DSI interface
    (factory alternatives)

    HDMI 2.0a / Display Port 1.3 interface, supporting HDCP 2.2 and HDCP 1.4/1.3
    eDP interface or 18- / 24-bit Dual Channel LVDS interface

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface

    HDMI 2.0a or DP 1.3 interface, supporting HDCP 2.2
    Dual Channel or 2 x Single Channel 18- / 24-bit LVDS interface

    Résolution vidéo
    HDMIUp to 4096 x 2160 @ 60 (4K)
    MIPI-DSI, LVDSUp to 1920 x 1080 @ 60Hz
    HDMI/DP: Up to 4096 x 2160p60
    LVDS/eDP: Up to 1920 x 1080 @ 60Hz

    LVDS, resolution up to 1920x1200
    HDMI, resolution up to 1080p

    HDMI:Up to 4Kp60
    LVDSUp to 1080p
    Stockage de masse
    Optional SD 4-bit interface
    QSPI Flash soldered-onboard
    eMMC 5.0 drive soldered on-board

    eMMC 5.0 drive soldered on-board, up to 64GB
    Optional microSD slot on board
    QSPI Flash soldered-onboard

    On-board eMMC drive, up to 8 GB
    SD / MMC / SDIO interface
    Internal SPI Flash for booting

    1x SATA Gen3 interface (alternative to 1x PCI-e x1 port)
    eMMC 5.1 drive soldered on-board
    SD 4-bit interface
    QSPI Flash soldered-on-board

    Networking
    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard

    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard

    Fast Ethernet (10/100) interface

    1 x Gigabit Ethernet interface

    USB
    2 USB 3.0 Host ports
    2 USB 2.0 Host ports
    1 USB 2.0 OTG port

    1 x USB 3.0 OTG Ports
    Up to 4 x USB 2.0 Host Ports

    1 x USB OTG interface
    1 x USB 2.0 Host interface

    4 x USB 2.0 Host Ports 
    1 x USB 3.0 Host Port
    1 x USB 2.0 OTG port

    PCI-e
    2x PCI-e x1 ports

    1x PCI-e x1 port, optional

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    Up to 2x PCI-e x1 Gen3 ports

    Audio
    I2S Audio Interface

    I2S Audio Interface

    I2S / AC’97 Audio Interface

    I2S Audio Interface

    Ports série
    Up to 2x UART Tx/Rx/RTS/CTS
    2x UART Tx/Rx
    1x CAN Bus (TTL level)

    1x UART Tx/Rx/RTS/CTS (Optional)
    1x Debug UART
    Optional CAN Bus interface (TTL Level)

    ...

    1x UART Tx/Rx/RTS/CTS
    1x CAN Bus (TTL level)

    Autres interfaces

    1x 4-lanes + 1x 2-lanes CSI camera interfaces
    I2C Bus
    SM Bus
    2x SPI interfaces
    QuadSPI interface
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    I2C Bus
    SM Bus
    Optional SPI interface
    8 x GPI/Os
    UltraLow Power RTC
    Power Management Signals
    Watchdog

    On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
    - Additional SD interface
    - Up to 4 UARTs
    - CAN interface
    - Watchdog(s)
    - I2C interfaces
    - PWM outputs
    - SPI interface
    - Additional Audio interface

    (*) not all the combinations are allowed simultaneously Power Management Signals

    CSI camera connector
    2x I2C Bus
    SPI interface
    8 x GPI/Os
    Boot select signal
    Power Management Signals
    Watchdog

    Alimentation électrique

    +5VDC
    +3.3V_RTC

    +5VDC ±5% and +5VSB (optional)
    +3.3V_RTC

    +5VDC ± 5%
    Optional Low Power RTC

    +5VDC ± 5%
    +3.3V_RTC

    Consommation d'énergie
    ...
    ...
    ...
    ...
    Système d'exploitation
    Linux
    Android

    Linux
    Android

    Linux
    Yocto

    Linux
    Android

    Température d'exploitation
    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version, without WiF+BT optional module)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (Industrial temp.)* 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    50 x 82 mm (1.97” x 3.23”)
    70x70 mm (2.76” x 2.76”)
    40x70 mm (1.57” x 2.76”)
    70x70 mm (2.76” x 2.76”)
    Security
    ...
    ...
    ...
    ...
    BIOS
    ...
    ...
    ...
    ...
    Embedded Controller Functionalities
    ...
    ...
    ...
    ...

    Description

    Détails

    The SM-C12 is a SMARC Rel. 2.0 compliant module with NXP i.MX 8M Applications Processors. Featuring multicore processing (Dual or Quad ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor) and 4Kp60 HEVC decoding with HDR, it is a scalable solution designed by SECO for home automation, transportation, digital signage and vending machines, and applicable to scenarios requiring advanced security, connectivity, multimedia and real-time response.
    Informations supplémentaires

    Informations complémentaires

    Processeur

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    Mémoire
    Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB
    Graphique

    Integrated Graphics Processing Unit, supports 2 independent displays
    Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
    Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

    Interfaces vidéo
    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
    18- / 24-bit Dual Channel LVDS interface or MIPI-DSI interface
    (factory alternatives)
    Résolution vidéo
    HDMIUp to 4096 x 2160 @ 60 (4K)
    MIPI-DSI, LVDSUp to 1920 x 1080 @ 60Hz
    Interfaces vidéo
    DUAL CHANNEL LVDS, HDMI, MIPI-DSI
    Stockage de masse
    Optional SD 4-bit interface
    QSPI Flash soldered-onboard
    eMMC 5.0 drive soldered on-board
    Networking
    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard
    USB
    2 USB 3.0 Host ports
    2 USB 2.0 Host ports
    1 USB 2.0 OTG port
    PCI-e
    2x PCI-e x1 ports
    Audio
    I2S Audio Interface
    Ports série
    Up to 2x UART Tx/Rx/RTS/CTS
    2x UART Tx/Rx
    1x CAN Bus (TTL level)
    Autres interfaces

    1x 4-lanes + 1x 2-lanes CSI camera interfaces
    I2C Bus
    SM Bus
    2x SPI interfaces
    QuadSPI interface
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    Alimentation électrique

    +5VDC
    +3.3V_RTC

    Système d'exploitation
    Linux
    Android
    Température d'exploitation
    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    50 x 82 mm (1.97” x 3.23”)
    Logiciel

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    SM-C12

    SM-C12
    • ÉVALUER NOS PRODUITS

      Max. 3 pcs par code article
    • PRIX ÉCHANTILLONNAGE

      Frais d'expédition inclus
    • UNIQUEMENT B2B

      Support technique fourni exclusivement pour les entreprises
    SMARC Rel. 2.0 compliant module with the NXP i.MX 8M Applications Processors
    Code article SKU Description article Configuration article Acheter des échantillons en ligne Nous contacter comparer
    RC12-2220-2211-C0-V SMARC NXP i.MX 8M SMARC - NXP i.MX8M Quad 1.5 GHz (VPU decode + HDR10 + GPU), LPDDR4 2GB, eMMC 8GB, LVDS+HDMI, WIFI(WL1831) + BT, PCle ,CAN - Comm. Temp AJOUTER POUR COMPARER
    RC12-3120-2211-C0-V SMARC NXP i.MX 8M SMARC - NXP i.MX8M Quad Lite1.5 GHz (GPU, No VPU), LPDDR4 1 GB, eMMC 8 GB, LVDS + HDMI, WIFI(WL1831) + BT, PCIe, CAN, Comm. Temp. AJOUTER POUR COMPARER
    RC12-5220-2311-I0-V SMARC NXP i.MX 8M SMARC - NXP i.MX8M Quad 1.3 GHz (VPU decode + HDR10 + GPU), LPDDR4 2 GB, eMMC 8 GB, LVDS + HDMI, WIFI(WL1837) + BT, PCIe, CAN, Ind. Temp AJOUTER POUR COMPARER
    RC12-6120-2311-I0-V SMARC NXP i.MX 8M SMARC - NXP i.MX8M Quad Lite 1.3 GHz (GPU, No VPU), LPDDR4 1 GB, eMMC 8 GB, LVDS + HDMI, WIFI(WL1837) + BT, PCIe, CAN, Ind. Temp AJOUTER POUR COMPARER

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