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    SM-B71

    SMARC Rel. 2.0 compliant module with the Xilinx® Zynq® Ultrascale+™ MPSoC

    • Xilinx® Zynq® Ultrascale+™ CG/EG/EV MPSoCs in C784 package
    • PCI-e x4; 2x GbE; 2x CAN Bus; 2x SPI; 12x GPI/Os
    • Integrated ARM Mali-400 MP2 GPU
    • Up to 8GB + 2GB DDR4 soldered down
    Disponible dans la plage des températures industrielles

      SM-B71

    SM-B71

    SM-B69

    SM-B69

    Q7-C26

    Q7-C26

    Q7-928

    Q7-928

     
    Statut de développement du produit
    Processeur

    Xilinx® Zynq® Ultrascale+™ ZU2CG, ZU3CG, ZU4CG or ZU5CG MPSoCs:
    Dual-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit

    Xilinx® Zynq® Ultrascale+™ ZU2EG, ZU3EG, ZU4EG, ZU5EG, ZU4EV or ZU5EV MPSoCs:
    Quad-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    NXP i.MX 8 Family:
    i.MX 8QuadMax - 2x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8QuadPlus - 1x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8Quad - 4x Cortex®-A53 cores + 2x Cortex®-M4F cores

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6DP DualPlus - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core
    Puces
    ...
    ...
    ...
    ...
    Max Cores
    0
    4
    0
    4
    Max Thread
    0
    4
    0
    0
    Mémoire
    Soldered Down DDR4-2400 memory
    Up to 8GB for Processing System Unit + up to 2GB for Programmable Logic
    Dual Channel Soldered Down LPDDR4-2400 memory, up to 8GB

    soldered down LPDDR4-3200 memory, 64-bit interface

    Up to 4GB DDR3L on-board (up to 2GB with i.MX6S)
    Graphique
    Only on EG and EV MPSOcs:
    Integrated ARM Mali-400 MP2 Graphics Processing Unit
    Multicore 2D/3D acceleration at 667MHz
    OpenGL ES 1.1 / 2.0, OpenVG 1.0 / 1.1
    On EV MPSoCs only, H.264/H.265 integrated video codec

    Integrated Intel® HD Graphics 500 series controller with up to 18 Execution Units
    Three Independent displays supported
    HW decoding of HEVC(H.265), H.264, MVC, VP8, VP9, MPEG2, VC-1, WMV9, JPEG/MJPEG formats
    HW encoding of HEVC(H.265), H.264, MVC, VP8, VP9 and JPEG/MPEG formats

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-2, VC-1, RV9, VP8, H.263 and MPEG4 part, HW encoding of AVC/H.264
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 3.x, DirectX 11

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES 2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D, i.MX6DP and i.MX6Q)
    Enhanced 2D and 3D graphics with i.MX6DP
    Supports up to 3 independent displays with i.MX6D, i.MX6DPand i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S

    Interfaces vidéo
    18- / 24-bit Dual Channel LVDS interface
    DP interface
    2 x CSI interfaces

    eDP + MIPI-DSI interfaces or Dual Channel 18/24bit LVDS interface
    HDMI or DP++ interface
    DP++ interface
    2 x CSI interfaces

    HDMI 2.0a or DP 1.3 interface, supporting HDCP 2.2
    Dual Channel or 2 x Single Channel 18- / 24-bit LVDS interface

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4
    Video Input Port / Camera Connector

    Résolution vidéo
    DPUp to 4096 x 2160
    LVDSDependent on the IP implemented in the programmable logic
    DP++ Up to 4096 x 2160 @60HZ
    eDP     Up to 3840 x 2160 @60Hz
    HDMI Up to 3840 x 2160 @30Hz
    MIPI-DSI, LVDS Up to 1920 x 1200 @ 60Hz
    HDMI:Up to 4Kp60
    LVDSUp to 1080p

    LVDS, up to 1920x1200
    HDMI, up to 1080p

    Stockage de masse

    1 x external S-ATA Gen3 Channel
    SD interface
    QSPI Flash soldered-onboard
    Optional eMMC 4.51 drive soldered on-board

    Optional eMMC 5.0 drive soldered on-board
    2 x external S-ATA Gen3 Channels
    SD interface

    1x SATA Gen3 interface (alternative to 1x PCI-e x1 port)
    eMMC 5.1 drive soldered on-board
    SD 4-bit interface
    QSPI Flash soldered-on-board

    On-board eMMC drive, up to 32 GB
    SD / MMC / SDIO interface
    1 x μSD Card Slot on-board
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

    Networking
    Up to 2 x Gigabit Ethernet interfaces

    Up to 2 x Gigabit Ethernet interfaces
    Intel® I210 or I211 Controller (MAC + PHY)

    1 x Gigabit Ethernet interface

    Gigabit Ethernet interface
    USB

    1x USB 2.0 OTG
    2x USB 2.0 Host
    2x USB 3.0 Host

    6 x USB 2.0 Host Ports
    2 x USB 3.0 Host Ports

    4 x USB 2.0 Host Ports 
    1 x USB 3.0 Host Port
    1 x USB 2.0 OTG port

    1 x USB OTG interface
    4 x USB 2.0 Host interfaces

    PCI-e
    PCI-e x4 interface
    4 x PCI-e Root Ports

    Up to 2x PCI-e x1 Gen3 ports

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
    Audio
    Dependent on the IP implemented in the programmable logic
    HD Audio interface
    I2S Audio interface

    I2S Audio Interface

    AC'97 Audio Interface
    I2S
    Ports série

    2 x UART Tx/Rx/RTS/CTS
    2 x UART Tx/Rx
    2 x CAN Bus

    2 x HS-UARTs
    2 x UARTs

    1x UART Tx/Rx/RTS/CTS
    1x CAN Bus (TTL level)

    2 x serial ports (TTL interface)
    CAN port interface

    Autres interfaces

    2 x I2C Bus
    2 x SPI interfaces
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    Up to 12x GPIOs
    I2C Bus
    SM Bus
    2x SPI interfaces
    LPC Bus
    FAN management
    Power Management Signals

    CSI camera connector
    2x I2C Bus
    SPI interface
    8 x GPI/Os
    Boot select signal
    Power Management Signals
    Watchdog

    I2C Bus
    LPC Bus
    SM Bus
    Power Management Signals

    Alimentation électrique
    +3÷+5.25VDC
    +3.3V_RTC
    +5VDC and +3.3V_RTC

    +5VDC ± 5%
    +3.3V_RTC

    +5VDC ± 5%

    Consommation d'énergie
    ...
    ...
    ...
    ...
    Système d'exploitation
    Linux
    Android

    Microsoft® Windows 10 Enterprise (64 bit)
    Microsoft® Windows 10 IoT Core
    Linux
    Yocto

    Linux
    Yocto
    Android

    Linux
    Yocto
    Microsoft® Windows Embedded Compact 7

    Température d'exploitation

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    50 x 82 mm (1.97” x 3.23”)
    50 x 82 mm (1.97” x 3.23”)
    70x70 mm (2.76” x 2.76”)
    70x70 mm (2.76” x 2.76”)
    Security
    ...
    ...
    ...
    ...
    BIOS
    ...
    ...
    ...
    ...
    Embedded Controller Functionalities
    ...
    ...
    ...
    ...
    CAN Bus
    N/A
    N/A
    N/A
    ...
    Functional Safety Features
    N/A
    N/A
    N/A
    ...

    Description

    Détails

    The SM-B71 is a SMARC Rel. 2.0 compliant module with the Xilinx® Zynq® Ultrascale+™ MPSoC. Delivering flexibile ARM + FPGA Heterogeneous processing in a standard form factor, this solution is able to merge wide scalability, from cost effective Dual-Core to high performance Quad-Core ARM® Cortex®-A53 MPSoCs with GPU/VCU, and extreme flexibility (up to 256k FPGA logic cells). It also features dedicated Real-Time ARM® Cortex®-R5 processors, along with LVDS and DP video interfaces up to 4K resolution and high-speed interfaces.
    Informations supplémentaires

    Informations complémentaires

    Processeur

    Xilinx® Zynq® Ultrascale+™ ZU2CG, ZU3CG, ZU4CG or ZU5CG MPSoCs:
    Dual-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit

    Xilinx® Zynq® Ultrascale+™ ZU2EG, ZU3EG, ZU4EG, ZU5EG, ZU4EV or ZU5EV MPSoCs:
    Quad-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit

    Mémoire
    Soldered Down DDR4-2400 memory
    Up to 8GB for Processing System Unit + up to 2GB for Programmable Logic
    Graphique
    Only on EG and EV MPSOcs:
    Integrated ARM Mali-400 MP2 Graphics Processing Unit
    Multicore 2D/3D acceleration at 667MHz
    OpenGL ES 1.1 / 2.0, OpenVG 1.0 / 1.1
    On EV MPSoCs only, H.264/H.265 integrated video codec
    Interfaces vidéo
    18- / 24-bit Dual Channel LVDS interface
    DP interface
    2 x CSI interfaces
    Résolution vidéo
    DPUp to 4096 x 2160
    LVDSDependent on the IP implemented in the programmable logic
    Stockage de masse

    1 x external S-ATA Gen3 Channel
    SD interface
    QSPI Flash soldered-onboard
    Optional eMMC 4.51 drive soldered on-board

    Networking
    Up to 2 x Gigabit Ethernet interfaces
    USB

    1x USB 2.0 OTG
    2x USB 2.0 Host
    2x USB 3.0 Host

    PCI-e
    PCI-e x4 interface
    Audio
    Dependent on the IP implemented in the programmable logic
    Ports série

    2 x UART Tx/Rx/RTS/CTS
    2 x UART Tx/Rx
    2 x CAN Bus

    Autres interfaces

    2 x I2C Bus
    2 x SPI interfaces
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    Alimentation électrique
    +3÷+5.25VDC
    +3.3V_RTC
    Système d'exploitation
    Linux
    Android
    Température d'exploitation

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    50 x 82 mm (1.97” x 3.23”)
    Logiciel

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    SM-B71

    SM-B71
    • ÉVALUER NOS PRODUITS

      Max. 3 pcs par code article
    • PRIX ÉCHANTILLONNAGE

      Frais d'expédition inclus
    • UNIQUEMENT B2B

      Support technique fourni exclusivement pour les entreprises
    SMARC Rel. 2.0 compliant module with the Xilinx® Zynq® Ultrascale+™ MPSoC
    Code article SKU Description article Configuration article Acheter des échantillons en ligne Nous contacter comparer
    RB71-6211-1000-C0 SMARC - Xilinx Zynq Ultrascale+ ZU4EG Quad Core SMARC - Xilinx Zynq Ultrascale+ ZU4EG Quad Core + GPU @1,3GHz, 2GB DDR4 PSU Memory, 512MB DDR4 PL Memory, 4GB eMMC, 2nd Gigabit Ethernet - Commercial Temperature AJOUTER POUR COMPARER

    • Automatisation des bâtiments
    • Automatisation industrielle
    • Instruments de mesure
    • Médical
    • Sécurité/Surveillance
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