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    SM-B69

    SMARC® Rel. 2.0 compliant module with the Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors

    • Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
    • 2x GbE; 6 x USB 2.0; 2 x USB 3.0; 4x PCI-e
    • Integrated Gen9-LP HD Graphics controller
    • Dual Channel Soldered Down LPDDR4-2400 memory
    Disponible dans la plage des températures industrielles

      SM-B69

    SM-B69

    SM-C12

    SM-C12

    μQ7-A76-J

    μQ7-A76-J

    SM-B71

    SM-B71

     
    Statut de développement du produit
    Processeur

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP
    Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP
    Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP

    Xilinx® Zynq® Ultrascale+™ ZU2CG, ZU3CG, ZU4CG or ZU5CG MPSoCs:
    Dual-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit

    Xilinx® Zynq® Ultrascale+™ ZU2EG, ZU3EG, ZU4EG, ZU5EG, ZU4EV or ZU5EV MPSoCs:
    Quad-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit

    Puces
    ...
    ...
    ...
    ...
    Max Cores
    4
    0
    2
    0
    Max Thread
    4
    0
    2
    0
    Mémoire
    Dual Channel Soldered Down LPDDR4-2400 memory, up to 8GB
    Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB

    Soldered onboard DDR3L memory
    E3825, E3815:  up to 4GB Single-Channel DDR3L @ 1066MHz
    N2807: up to 4GB Single-Channel DDR3L @ 1333MHz

    Soldered Down DDR4-2400 memory
    Up to 8GB for Processing System Unit + up to 2GB for Programmable Logic
    Graphique

    Integrated Intel® HD Graphics 500 series controller with up to 18 Execution Units
    Three Independent displays supported
    HW decoding of HEVC(H.265), H.264, MVC, VP8, VP9, MPEG2, VC-1, WMV9, JPEG/MJPEG formats
    HW encoding of HEVC(H.265), H.264, MVC, VP8, VP9 and JPEG/MPEG formats

    Integrated Graphics Processing Unit, supports 2 independent displays
    Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
    Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

    Integrated Intel® HD Graphics 4000 Series controller
    Dual independent display support
    HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats
    HW encoding of H.264, MPEG2 and MVC formats

    Only on EG and EV MPSOcs:
    Integrated ARM Mali-400 MP2 Graphics Processing Unit
    Multicore 2D/3D acceleration at 667MHz
    OpenGL ES 1.1 / 2.0, OpenVG 1.0 / 1.1
    On EV MPSoCs only, H.264/H.265 integrated video codec
    Interfaces vidéo

    eDP + MIPI-DSI interfaces or Dual Channel 18/24bit LVDS interface
    HDMI or DP++ interface
    DP++ interface
    2 x CSI interfaces

    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
    18- / 24-bit Dual Channel LVDS interface or MIPI-DSI interface
    (factory alternatives)

    Multimode Display Port (DP++) interface
    18 / 24 bit Dual Channel LVDS interface

    18- / 24-bit Dual Channel LVDS interface
    DP interface
    2 x CSI interfaces
    Résolution vidéo
    DP++ Up to 4096 x 2160 @60HZ
    eDP     Up to 3840 x 2160 @60Hz
    HDMI Up to 3840 x 2160 @30Hz
    MIPI-DSI, LVDS Up to 1920 x 1200 @ 60Hz
    HDMIUp to 4096 x 2160 @ 60 (4K)
    MIPI-DSI, LVDSUp to 1920 x 1080 @ 60Hz
    DP++ (HDMI compatible) Up to 2560x1600@60Hz
    LVDS interface Up to 1920x1200@60Hz
    DPUp to 4096 x 2160
    LVDSDependent on the IP implemented in the programmable logic
    Stockage de masse

    Optional eMMC 5.0 drive soldered on-board
    External S-ATA Gen3 Channel
    SD interface

    Optional SD 4-bit interface
    QSPI Flash soldered-onboard
    eMMC 5.0 drive soldered on-board
    2 x external S-ATA channels
    SD interface
    Optional eMMC drive soldered onboard

    1 x external S-ATA Gen3 Channel
    SD interface
    QSPI Flash soldered-onboard
    Optional eMMC 4.51 drive soldered on-board

    Networking

    Up to 2 x Gigabit Ethernet interfaces
    Intel® I210 or I211 Controller (MAC + PHY)

    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard
    Gigabit Ethernet interface
    Up to 2 x Gigabit Ethernet interfaces
    USB
    6 x USB 2.0 Host Ports
    2 x USB 3.0 Host Ports
    2 USB 3.0 Host ports
    2 USB 2.0 Host ports
    1 USB 2.0 OTG port
    1 x USB 3.0 Host port
    4 x USB 2.0 Host ports (one shared with USB 3.0 interface)

    1x USB 2.0 OTG
    2x USB 2.0 Host
    2x USB 3.0 Host

    PCI-e
    4 x PCI-e Root Ports
    2x PCI-e x1 ports
    3 x PCI-e x1 lanes (Gen2)
    PCI-e x4 interface
    Audio
    HD Audio interface
    I2S Audio interface
    I2S Audio Interface
    HD Audio Interface
    Dependent on the IP implemented in the programmable logic
    Ports série

    2 x HS-UARTs
    2 x UARTs

    Up to 2x UART Tx/Rx/RTS/CTS
    2x UART Tx/Rx
    1x CAN Bus (TTL level)
    1 x Serial Port (TTL interface, Tx/Rx only)

    2 x UART Tx/Rx/RTS/CTS
    2 x UART Tx/Rx
    2 x CAN Bus

    Autres interfaces

    Up to 12x GPIOs
    I2C Bus
    SM Bus
    2x SPI interfaces
    LPC Bus
    FAN management
    Power Management Signals

    1x 4-lanes + 1x 2-lanes CSI camera interfaces
    I2C Bus
    SM Bus
    2x SPI interfaces
    QuadSPI interface
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    I2C bus
    LPC Bus
    SM Bus
    Thermal / FAN Management
    PWR Management signals

    2 x I2C Bus
    2 x SPI interfaces
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    Alimentation électrique
    +5VDC and +3.3V_RTC

    +5VDC
    +3.3V_RTC

    +5VDC ± 5%
    +3÷+5.25VDC
    +3.3V_RTC
    Consommation d'énergie
    ...
    ...
    ...
    ...
    Système d'exploitation

    Microsoft® Windows 10 Enterprise (64 bit)
    Microsoft® Windows 10 IoT Core
    Linux
    Yocto

    Linux
    Yocto
    Android

    Microsoft® Windows 7
    Microsoft® Windows 8.1
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7
    Microsoft® Windows Embedded Compact 7
    Linux
    Yocto

    Linux
    Android
    Température d'exploitation

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    50 x 82 mm (1.97” x 3.23”)
    50 x 82 mm (1.97” x 3.23”)
    40 x 70 mm (1.57 x 2.76)
    50 x 82 mm (1.97” x 3.23”)
    Security
    ...
    ...
    ...
    ...
    BIOS
    ...
    ...
    ...
    ...
    Embedded Controller Functionalities
    ...
    ...
    ...
    ...
    CAN Bus
    ...
    ...
    ...
    ...
    Functional Safety Features
    ...
    ...
    ...
    ...

    Description

    Détails

    The SM-B69 is a SMARC Rel. 2.0 compliant module with the Intel® Atom X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly code name Apollo Lake) Processors. This high performance, low power and feature-rich solution is able to run up to 3 independent displays, with 4K HW decoding and encoding of HEVC(H.265), H.264, VP8, SVC, MVC. It features Quad Channel Soldered Down LPDDR4-2400 memory up to 8GB, up to 2 x Gigabit Ethernet interfaces and 2 x MIPI CSI interfaces.

    Informations supplémentaires

    Informations complémentaires

    Processeur

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    Max Cores
    4
    Max Thread
    4
    Mémoire
    Dual Channel Soldered Down LPDDR4-2400 memory, up to 8GB
    Graphique

    Integrated Intel® HD Graphics 500 series controller with up to 18 Execution Units
    Three Independent displays supported
    HW decoding of HEVC(H.265), H.264, MVC, VP8, VP9, MPEG2, VC-1, WMV9, JPEG/MJPEG formats
    HW encoding of HEVC(H.265), H.264, MVC, VP8, VP9 and JPEG/MPEG formats

    Interfaces vidéo

    eDP + MIPI-DSI interfaces or Dual Channel 18/24bit LVDS interface
    HDMI or DP++ interface
    DP++ interface
    2 x CSI interfaces

    Résolution vidéo
    DP++ Up to 4096 x 2160 @60HZ
    eDP     Up to 3840 x 2160 @60Hz
    HDMI Up to 3840 x 2160 @30Hz
    MIPI-DSI, LVDS Up to 1920 x 1200 @ 60Hz
    Stockage de masse

    Optional eMMC 5.0 drive soldered on-board
    External S-ATA Gen3 Channel
    SD interface

    Networking

    Up to 2 x Gigabit Ethernet interfaces
    Intel® I210 or I211 Controller (MAC + PHY)

    USB
    6 x USB 2.0 Host Ports
    2 x USB 3.0 Host Ports
    PCI-e
    4 x PCI-e Root Ports
    Audio
    HD Audio interface
    I2S Audio interface
    Ports série

    2 x HS-UARTs
    2 x UARTs

    Autres interfaces

    Up to 12x GPIOs
    I2C Bus
    SM Bus
    2x SPI interfaces
    LPC Bus
    FAN management
    Power Management Signals

    Alimentation électrique
    +5VDC and +3.3V_RTC
    Système d'exploitation

    Microsoft® Windows 10 Enterprise (64 bit)
    Microsoft® Windows 10 IoT Core
    Linux
    Yocto

    Température d'exploitation

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    50 x 82 mm (1.97” x 3.23”)
    Documents

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    SM-B69

    SM-B69
    • ÉVALUER NOS PRODUITS

      Max. 3 pcs par code article
    • PRIX ÉCHANTILLONNAGE

      Frais d'expédition inclus
    • UNIQUEMENT B2B

      Support technique fourni exclusivement pour les entreprises
    SMARC® Rel. 2.0 compliant module with the Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
    Code article SKU Description article Configuration article Acheter des échantillons en ligne Nous contacter comparer
    RB69-5940-2211-I0-V SMARC - Intel Atom x7-E3950 Quad Core @1.6GHz (Apollo Lake) SMARC - Intel Atom x7-E3950 Quad Core @1.6GHz (Apollo Lake), 8GB LPDDR4 Quad Channel, 32GB eMMC, LVDS + DP++ video interfaces, 2x Intel I210 GbEthernet controllers - Industrial temp. range AJOUTER POUR COMPARER

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