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    Plus de vues

    Q7-C26

    Qseven® Rel. 2.1 compliant module with NXP i.MX 8 Applications Processors

    • NXP i.MX 8 Applications Processors

    • 1x USB 3.0; PCI-e x1 Gen3; CSI camera connector; Boot select signal
    • Integrated GPU, supports 2 independent displays

    • soldered down LPDDR4-3200 memory

    Disponible dans la plage des températures industrielles

      Q7-C26

    Q7-C26

    SBC-A62-J

    SBC-A62-J

    SM-C12

    SM-C12

    μQ7-A75-J

    μQ7-A75-J

     
    Statut de développement du produit
    Processeur

    NXP i.MX 8 Family:
    i.MX 8QuadMax - 2x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8QuadPlus - 1x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores

    NXP i.MX 6 Family, based on ARM Cortex-A9 processors:
    SBC-A62-J-SOLO: Single Core (i.MX6S) @1GHz
    SBC-A62-J-LITE: Dual Core Lite (i.MX6DL) @1GHz
    SBC-A62-J-PLUS: Dual Core Plus (i.MX6DP) @1GHz
    SBC-A62-J-QUAD: Quad Core (i.MX6Q) @1GHz

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors

    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core

    Puces
    ...
    ...
    ...
    ...
    Max Cores
    0
    4
    0
    2
    Max Thread
    0
    0
    0
    ...
    Mémoire

    soldered down LPDDR4-3200 memory, 64-bit interface

    Soldered on-board DDR3L memory***:
    SBC-A62-J-SOLO: 512MB 32-bit interface
    SBC-A62-J-LITE: 1GB 64-bit interface
    SBC-A62-J-PLUS: 2GB 64-bit interface
    SBC-A62-J-QUAD: 1GB 64-bit interface

    *** For additional configurability please contact SECO

    Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB

    Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F

    Graphique

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-2, VC-1, RV9, VP8, H.263 and MPEG4 part, HW encoding of AVC/H.264
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 3.x, DirectX 11

    Integrated Graphics, with up to 3 separate HW accelerators for 2D, OpenGL® ES2.0 3D
    OpenVG™ accelerator (only SBC-A62-J-PLUS and SBC-A62-J-QUAD)
    HW encoding of MPEG-4, H.263 V2, H.264, MJPEG
    HW decoding of MPEG-2, VC1, MPEG-4 / XviD, H.263, H.264, DivX
    SBC-A62-J-SOLO and SBC-A62-J-LITE support up to 2 independent displays
    SBC-A62-J-PLUS and SBC-A62-J-QUAD support up to 3independent displays

    Integrated Graphics Processing Unit, supports 2 independent displays
    Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
    Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Supports 2 independent displays

    Interfaces vidéo

    HDMI 2.0a / DP 1.3 or eDP 1.4 interface, supporting HDCP 2.2
    Dual Channel or 2 x Single Channel 18- / 24-bit LVDS interface (1 x Single Channel in case of eDP interface available)

    1 x Dual Channel or 2 x Single Channel 18 / 24 bit LVDS interface
    HDMI interface 1.4

    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
    18- / 24-bit Dual Channel LVDS interface or MIPI-DSI interface
    (factory alternatives)

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface

    Résolution vidéo

    HDMI / DP / eDP resolution up to 4096x2160 @ 60Hz
    LVDS, resolution up to 1920x1080 @ 60Hz

    HDMI: up to 1920 x 1080p
    LVDS: up to 1920 x 1200

    HDMIUp to 4096 x 2160 @ 60 (4K)
    MIPI-DSI, LVDSUp to 1920 x 1080 @ 60Hz

    LVDS, resolution up to 1920x1200
    HDMI, resolution up to 1080p

    Stockage de masse

    1x SATA Gen3 interface
    eMMC 5.1 drive soldered on-board
    SD 4-bit interface
    QSPI Flash soldered-on-board

    4GB eMMC drive soldered onboard***
    microSD Card slot
    SBC-A62-J-PLUS and SBC-A62-J-QUAD: SATA connector

    *** For additional configurability please contact SECO

    Optional SD 4-bit interface
    QSPI Flash soldered-onboard
    eMMC 5.0 drive soldered on-board

    On-board eMMC drive, up to 8 GB
    SD / MMC / SDIO interface
    Internal SPI Flash for booting

    Networking

    1 x Gigabit Ethernet interface

    Gigabit Ethernet connector
    Internal USB connector for Wi-Fi Module

    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard
    Fast Ethernet (10/100) interface
    USB

    4 x USB 2.0 Host Ports 
    1 x USB 3.0 Host Port
    1 x USB 2.0 OTG port

    2 x USB 2.0 Type-A ports and 1 x USB 2.0 internal connector
    USB micro-B Client port
    2 USB 3.0 Host ports
    2 USB 2.0 Host ports
    1 USB 2.0 OTG port

    1 x USB OTG interface
    1 x USB 2.0 Host interface

    PCI-e

    2x PCI-e x1 Gen3 ports

    ...
    2x PCI-e x1 ports

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    Audio

    I2S Audio Interface

    SBC-A62-J-LITE, SBC-A62-J-PLUS and SBC-A62-J-QUAD:
    AC’97 Audio Codec Realtek ALC655 with Mic-In, Line-Out audio Jacks

    I2S Audio Interface
    I2S / AC’97 Audio Interface
    Ports série

    1x UART Tx/Rx/RTS/CTS
    1x CAN Bus (TTL level)

    Debug UART interface, TTL voltage level.
    SBC-A62-J-LITE, SBC-A62-J-PLUS and SBC-A62-J-QUAD: dedicated CAN Bus connector (Transceiver CAN 3.3V)
    Other serial interfaces on the expansion connector:
    SBC-A62-J-SOLO: 1 x Serial (TTL level) - 2 x Serial (RS-232) -2 x CAN (TTL level);
    SBC-A62-J-LITE: 1 x Serial (TTL level) - 2 x Serial (RS-232) - 1 x CAN (TTL level);
    SBC-A62-J-PLUS and SBC-A62-J-QUAD: 1 x Serial (RS-485) - 2 x Serial (RS-232) - 1 x CAN (TTL level)

    Up to 2x UART Tx/Rx/RTS/CTS
    2x UART Tx/Rx
    1x CAN Bus (TTL level)
    ...
    Autres interfaces

    CSI camera connector
    2x I2C Bus
    SPI interface
    8 x GPI/Os
    Boot select signal
    Power Management Signals
    Watchdog

    Dedicated connector (I2C, GPIO signals) for external Touch Screen controller; MIPI-CSI Camera connector;
    Configurable* expansion connector with: Up to 28 GPIO - SPI interface - SPDIF Audio interface - CAN interface (TTL level) - SDIO interface - 3 x PWM - I2C - UARTs

    * Please note that some of these interfaces are factory options, other configurations are made via SW.

    1x 4-lanes + 1x 2-lanes CSI camera interfaces
    I2C Bus
    SM Bus
    2x SPI interfaces
    QuadSPI interface
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
    - Additional SD interface
    - Up to 4 UARTs
    - CAN interface
    - Watchdog(s)
    - I2C interfaces
    - PWM outputs
    - SPI interface
    - Additional Audio interface

    (*) not all the combinations are allowed simultaneously Power Management Signals

    Alimentation électrique

    +5VDC ± 5%
    +3.3V_RTC

    +12VDC; Additional embedded Low Power RTC;
    SBC-A62-J-SOLO and SBC-A62-J-LITE: internal i.MX6 Real Time Clock (external battery required for time/date retention, not included)
    SBC-A62-J-PLUS and SBC-A62-J-QUAD: low power Real TimeClock with onboard battery

    +5VDC
    +3.3V_RTC

    +5VDC ± 5%
    Optional Low Power RTC

    Consommation d'énergie
    ...
    ...
    ...
    ...
    Système d'exploitation

    Linux
    Yocto
    Android

    Free Android and Linux community BSP available at UDOO.org
    SECO Android (under development) and Linux BSP / WEC7 on request. Please contact us
    Yocto Guideline valid for SECO BSP
    Linux

    Linux
    Yocto
    Android

    Linux
    Yocto

    Température d'exploitation

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial temp.)**
    For industrial temp. (-40°C ÷ +85°C)** please contact us

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (Industrial temp.)* 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    110 x 86.5 mm (4.5” x 3.7”)
    50 x 82 mm (1.97” x 3.23”)
    40x70 mm (1.57” x 2.76”)
    Security
    ...
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    ...
    ...
    BIOS
    ...
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    ...
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    Embedded Controller Functionalities
    ...
    ...
    ...
    ...
    CAN Bus
    ...
    ...
    ...
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    Functional Safety Features
    ...
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    ...

    Description

    Détails

    The Q7-C26 is a Qseven® Rel. 2.1 compliant module based on the NXP i.MX 8 Applications Processors. This solution features rich m2m interface to control onboard subsystems and wide connectivity, taking advantage of the wide scalability offered by Qseven® form factor and the i.MX 8 family.

    Informations supplémentaires

    Informations complémentaires

    Processeur

    NXP i.MX 8 Family:
    i.MX 8QuadMax - 2x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8QuadPlus - 1x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores

    Mémoire

    soldered down LPDDR4-3200 memory, 64-bit interface

    Graphique

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-2, VC-1, RV9, VP8, H.263 and MPEG4 part, HW encoding of AVC/H.264
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 3.x, DirectX 11

    Interfaces vidéo

    HDMI 2.0a / DP 1.3 or eDP 1.4 interface, supporting HDCP 2.2
    Dual Channel or 2 x Single Channel 18- / 24-bit LVDS interface (1 x Single Channel in case of eDP interface available)

    Résolution vidéo

    HDMI / DP / eDP resolution up to 4096x2160 @ 60Hz
    LVDS, resolution up to 1920x1080 @ 60Hz

    Stockage de masse

    1x SATA Gen3 interface
    eMMC 5.1 drive soldered on-board
    SD 4-bit interface
    QSPI Flash soldered-on-board

    Networking

    1 x Gigabit Ethernet interface

    USB

    4 x USB 2.0 Host Ports 
    1 x USB 3.0 Host Port
    1 x USB 2.0 OTG port

    PCI-e

    2x PCI-e x1 Gen3 ports

    Audio

    I2S Audio Interface

    Ports série

    1x UART Tx/Rx/RTS/CTS
    1x CAN Bus (TTL level)

    Autres interfaces

    CSI camera connector
    2x I2C Bus
    SPI interface
    8 x GPI/Os
    Boot select signal
    Power Management Signals
    Watchdog

    Alimentation électrique

    +5VDC ± 5%
    +3.3V_RTC

    Système d'exploitation

    Linux
    Yocto
    Android

    Température d'exploitation

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    Logiciel

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    Q7-C26

    Q7-C26
    • ÉVALUER NOS PRODUITS

      Max. 3 pcs par code article
    • PRIX ÉCHANTILLONNAGE

      Frais d'expédition inclus
    • UNIQUEMENT B2B

      Support technique fourni exclusivement pour les entreprises
    Qseven® Rel. 2.1 compliant module with the NXP i.MX 8 Applications Processors
    Code article SKU Description article Configuration article Acheter des échantillons en ligne Nous contacter comparer
    QC26-7331-1111-I0 Q7 - NXP i.MX 8 Quad Max 1.6GHz (VPU + GPU) Q7 - NXP i.MX 8 Quad Max 1.6GHz (VPU + GPU), LPDDR4 8 GB, eMMC 16 GB, LVDS + HDMI/DP, HUB USB, Video In, PCle, Gigabit Eth - Industrial Range AJOUTER POUR COMPARER

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